专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US06841403B2 Method for manufacturing semiconductor devices and method and its apparatus for processing detected defect data 有权
标题翻译：半导体器件的制造方法及其检测缺陷数据的处理方法及其装置
公开(公告)号：US06841403B2
公开(公告)日：2005-01-11
申请号：US10348747
申请日：2003-01-21
申请人： Maki Tanaka , Shunji Maeda , Minori Noguchi , Takafumi Okabe , Yuji Takagi , Chie Shishido
发明人： Maki Tanaka , Shunji Maeda , Minori Noguchi , Takafumi Okabe , Yuji Takagi , Chie Shishido
IPC分类号： H01L21/00 , H01L21/66 , G06F19/00
CPC分类号： H01L21/67276 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a method for manufacturing semiconductor device and a method and apparatus for processing detected defect data, making it possible to quickly infer or determine a process and related manufacturing equipment that causes defects in a fabrication line of semiconductor devices, take remedy action, and achieve a constant and high yield. The method of the invention comprises quantitatively evaluating similarity of a defects distribution on a wafer that suffered abnormal occurrence of defects to inspection results for wafers inspected in the past, analyzing cyclicity of data sequence of evaluated similarity, evaluating relationship between the cyclicity of defects obtained from the analysis and the process method according to each manufacturing equipment in the fabrication line, and inferring or determining a causal process and equipment that caused the defects.
摘要翻译：本发明公开了一种用于制造半导体器件的方法和用于处理检测到的缺陷数据的方法和装置，使得可以快速推断或确定导致半导体器件制造线中的缺陷的处理和相关制造设备，采取补救措施，以及实现恒定和高收益。本发明的方法包括定量评估在异常发生缺陷的晶片上的缺陷分布与以往检查的晶片的检查结果的相似性，分析评估的相似性的数据序列的循环性，评估从根据制造线上每个制造设备的分析和处理方法，并推断或确定引起缺陷的因果过程和设备。

2. 发明授权

US06797526B2 Method for manufacturing semiconductor devices and method and its apparatus for processing detected defect data 有权
标题翻译：半导体器件的制造方法及其检测缺陷数据的处理方法及其装置
公开(公告)号：US06797526B2
公开(公告)日：2004-09-28
申请号：US10232871
申请日：2002-08-30
申请人： Maki Tanaka , Shunji Maeda , Minori Noguchi , Takafumi Okabe , Yuji Takagi , Chie Shishido
发明人： Maki Tanaka , Shunji Maeda , Minori Noguchi , Takafumi Okabe , Yuji Takagi , Chie Shishido
IPC分类号： H01L2100
CPC分类号： H01L21/67276 , H01L22/20 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a method for manufacturing semiconductor device and a method and apparatus for processing detected defect data, making it possible to quickly infer or determine a process and related manufacturing equipment that causes defects in a fabrication line of semiconductor devices, take remedy action, and achieve a constant and high yield. The method of the invention comprises quantitatively evaluating similarity of a defects distribution on a wafer that suffered abnormal occurrence of defects to inspection results for wafers inspected in the past, analyzing cyclicity of data sequence of evaluated similarity, evaluating relationship between the cyclicity of defects obtained from the analysis and the process method according to each manufacturing equipment in the fabrication line, and inferring or determining a causal process and equipment that caused the defects.
摘要翻译：本发明公开了一种用于制造半导体器件的方法和用于处理检测到的缺陷数据的方法和装置，使得可以快速推断或确定导致半导体器件制造线中的缺陷的处理和相关制造设备，采取补救措施，以及实现恒定和高收益。本发明的方法包括定量评估在异常发生缺陷的晶片上的缺陷分布与以往检查的晶片的检查结果的相似性，分析评估的相似性的数据序列的循环性，评估从根据制造线上每个制造设备的分析和处理方法，并推断或确定引起缺陷的因果过程和设备。

3. 发明申请

US20120076396A1 PATTERN INSPECTION METHOD AND ITS APPARATUS 审中-公开
标题翻译：模式检验方法及其设备
公开(公告)号：US20120076396A1
公开(公告)日：2012-03-29
申请号：US13312460
申请日：2011-12-06
申请人： Kaoru SAKAI , Shunji Maeda , Takafumi Okabe , Hiroshi Goto , Masayuki Kuwabara , Naoya Takeuchi
发明人： Kaoru SAKAI , Shunji Maeda , Takafumi Okabe , Hiroshi Goto , Masayuki Kuwabara , Naoya Takeuchi
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T7/0002 , G06T7/32 , G06T7/33 , G06T2207/30148
摘要： A pattern inspection method and apparatus are provided for sequentially imaging plural chips formed on a substrate to be inspected to and obtaining inspection images and reference images, calculating a position gap between the inspection images and the reference images using a recipe created in advance by using another substrate of the same kind or type as the substrate, the recipe including information for determining which pattern sections are to be selected and discarded, aligning the inspection images and the reference images using information of the position gap from the calculating step, and comparing the inspection images with the reference images aligned by the aligning step and extracting a defect candidate.
摘要翻译：提供了一种图案检查方法和装置，用于将形成在要检查的基板上的多个芯片顺序地成像并获得检查图像和参考图像，使用预先通过使用另一个来创建的食谱来计算检查图像与参考图像之间的位置间隙与基板相同种类或类型的基板，所述配方包括用于确定要选择和丢弃哪些图案部分的信息，使用来自计算步骤的位置间隙的信息对准检查图像和参考图像，并且将检查具有通过对准步骤对齐的参考图像并提取缺陷候选的图像。

4. 发明申请

US20100104173A1 Method And Apparatus For Inspecting A Pattern Formed On A Substrate 有权
标题翻译：检查基板上形成的图案的方法和装置
公开(公告)号：US20100104173A1
公开(公告)日：2010-04-29
申请号：US12649898
申请日：2009-12-30
申请人： Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe , Masahiro Watanabe
发明人： Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe , Masahiro Watanabe
IPC分类号： G06K9/62
CPC分类号： G03F7/7065 , G01N21/95684
摘要： A pattern inspection method and apparatus in which a deep ultraviolet light or an ultraviolet light is irradiated onto a specimen on which a pattern is formed, an image of the specimen which is irradiated with the deep ultraviolet light or the ultraviolet light is formed and the formed image is detected with a rear-surface irradiation type image sensor, which is sensitive to wavelengths of no greater than 400 nmm. A signal outputted from the image sensor is processed so as to detect a defect of the specimen by converting an analog image signal outputted from the image sensor to a digital image signal with an A/D converter, and a display displays information of the defect detected.
摘要翻译：将深紫外光或紫外线照射到形成有图案的试样上的图案检查方法和装置形成了被深紫外线或紫外线照射的样本的图像，形成使用对不大于400nm的波长敏感的背面照射型图像传感器来检测图像。处理从图像传感器输出的信号，以便通过用A / D转换器将从图像传感器输出的模拟图像信号转换为数字图像信号来检测样本的缺陷，并且显示器显示检测到的缺陷的信息。

5. 发明申请

US20090153840A1 Method And Apparatus For Inspecting Pattern Defects 有权
标题翻译：检查图案缺陷的方法和装置
公开(公告)号：US20090153840A1
公开(公告)日：2009-06-18
申请号：US12366003
申请日：2009-02-05
申请人： Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe
发明人： Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe
IPC分类号： G01N21/88 , G01N21/00
CPC分类号： G01N21/95684 , G01N2021/9513
摘要： An apparatus and method for inspecting defects includes an illuminator for irradiating light having an ultraviolet wavelength emitted from a light source onto a specimen through a reflection objective lens, an image-former for forming an image of light reflected from the specimen by the illumination of the light from the illuminator, which is passed through at least the reflection objective lens, a detector which detects the image of light formed by the image-former with an image sensor, and an image processor for processing a signal output from the detector to detect defects on the specimen. The image sensor is a reverse-surface irradiation type image sensor.
摘要翻译：用于检查缺陷的装置和方法包括：照射器，用于将通过光源发射的具有从光源发射的紫外线波长的光通过反射物镜照射到样本上;成像器，用于形成从样本反射的光的图像，至少通过反射物镜的照明器的光，用图像传感器检测由成像器形成的光的图像的检测器，以及用于处理从检测器输出的信号以检测缺陷的图像处理器在标本上。图像传感器是反面照射型图像传感器。

6. 发明授权

US07508973B2 Method of inspecting defects 失效
标题翻译：检查缺陷的方法
公开(公告)号：US07508973B2
公开(公告)日：2009-03-24
申请号：US10809321
申请日：2004-03-26
申请人： Takafumi Okabe , Shunji Maeda , Yukihiro Shibata , Hidetoshi Nishiyama
发明人： Takafumi Okabe , Shunji Maeda , Yukihiro Shibata , Hidetoshi Nishiyama
IPC分类号： G06K9/00 , G06F3/048
CPC分类号： G06T7/0004 , G06T2207/30148
摘要： A method of inspecting detects includes assigning a plurality of sets of image acquisition conditions, executing inspection using each of the sets of conditions, classifying all detected defects into real defects and false defects by use of an automatic defect classification function, and selecting, from the plurality of sets of conditions, a set of conditions ideal for detection.
摘要翻译：检查检测方法包括：分配多组图像获取条件，使用每种条件执行检查，通过使用自动缺陷分类功能将所有检测到的缺陷分类为真实缺陷和假缺陷，并且从多组条件，一套条件理想的检测。

7. 发明申请

US20090003682A1 Pattern inspection method and its apparatus 有权
标题翻译：图案检验方法及其装置
公开(公告)号：US20090003682A1
公开(公告)日：2009-01-01
申请号：US12230362
申请日：2008-08-28
申请人： Kaoru Sakai , Shunji Maeda , Takafumi Okabe
发明人： Kaoru Sakai , Shunji Maeda , Takafumi Okabe
IPC分类号： G06K9/00
CPC分类号： G06T7/001 , G06T2207/30148
摘要： In a pattern inspection apparatus for comparing images of corresponding areas of two patterns, which are formed so as to be identical, so as to judge that a non-coincident part of the images is a defect, the influence of unevenness in brightness of patterns caused by a difference of thickness or the like is reduced, whereby highly sensitive pattern inspection is realized. In addition, high-speed pattern inspection can be carried out without changing the image comparison algorithm. For this purpose, the pattern inspection apparatus operates to perform comparison processing of images in parallel in plural areas. Further, the pattern inspection apparatus operates to convert gradation of an image signal among compared images using different plural processing units such that, even in the case in which a difference of brightness occurs in an identical pattern among images, a defect can be detected correctly.
摘要翻译：在用于比较形成为相同的两个图案的相应区域的图像的图形检查装置中，以判断图像的不重合的部分是缺陷，导致图案的亮度不均匀性的影响通过减小厚度差等，从而实现高灵敏度图案检查。此外，可以进行高速图案检查，而不改变图像比较算法。为此，图案检查装置在多个区域中并行地执行图像的比较处理。此外，图案检查装置进行操作以使用不同的多个处理单元来转换比较图像中的图像信号的灰度，使得即使在图像中以相同图案发生亮度差异的情况下，也可以正确检测缺陷。

8. 发明授权

US07330248B2 Method and apparatus for inspecting defects 失效
标题翻译：检查缺陷的方法和装置
公开(公告)号：US07330248B2
公开(公告)日：2008-02-12
申请号：US11089881
申请日：2005-03-25
申请人： Kaoru Sakai , Shunji Maeda , Takafumi Okabe , Masahiro Watanabe
发明人： Kaoru Sakai , Shunji Maeda , Takafumi Okabe , Masahiro Watanabe
IPC分类号： G01N21/88
CPC分类号： G01N23/227 , G01N21/94 , G01N21/9501
摘要： In a defect inspecting apparatus, having contrast, brightness and appearance of a target for inspection and detection sensitivity of a defect changed depending on optical system conditions, and adapted to perform inspection by selecting an optimal test condition, even an unskilled user can easily select an optimal optical condition by quantitatively displaying evaluation values side by side when optical system conditions are changed. Moreover, by selecting an evaluation item having highest satisfaction based on a result of a series of test inspection, an optimal test condition can be automatically selected.
摘要翻译：在缺陷检查装置中，根据光学系统条件具有对象的检查目标的检查和检测灵敏度的对比度，亮度和外观变化，并且适于通过选择最佳测试条件进行检查，即使是非熟练的用户也可以容易地选择当光学系统条件改变时，通过定量地显示评估值来获得最佳光学条件。此外，通过基于一系列检查结果的结果选择具有最高满意度的评价项目，可以自动选择最佳检测条件。

9. 发明申请

US20050220333A1 Image alignment method, comparative inspection method, and comparative inspection device for comparative inspections 有权
标题翻译：图像对准方法，比较检查方法和比较检查比较检查装置
公开(公告)号：US20050220333A1
公开(公告)日：2005-10-06
申请号：US11140350
申请日：2005-05-27
申请人： Kaoru Sakai , Shunji Maeda , Takafumi Okabe
发明人： Kaoru Sakai , Shunji Maeda , Takafumi Okabe
IPC分类号： G01B11/00 , G06T1/00 , G06T7/00 , G06T7/60 , G06K9/00 , G06K9/32
CPC分类号： G06T7/001 , G01N21/95607 , G03F1/84 , G06T7/32 , G06T2207/30148
摘要： The present invention provides a high-precision alignment method, device and code for inspections that compare an inspection image with a reference image and detect defects from their differences. In one embodiment an inspection image and a reference image are divided into multiple regions. An offset is calculated for each pair of sub-images. Out of these multiple offsets, only the offsets with high reliability are used to determine an offset for the entire image. This allows high-precision alignment with little or no dependency on pattern density or shape, differences in luminance between images, and uneven luminance within individual images. Also, detection sensitivity is adjusted as necessary by monitoring alignment precision.
摘要翻译：本发明提供了一种用于检查的高精度对准方法，装置和代码，其将检查图像与参考图像进行比较，并从其差异中检测缺陷。在一个实施例中，检查图像和参考图像被分成多个区域。为每对子图像计算偏移量。在这些多个偏移量中，仅使用具有高可靠性的偏移量来确定整个图像的偏移。这允许对图案密度或形状几乎或不依赖的高精度对准，图像之间的亮度差异以及各个图像内的不均匀亮度。此外，通过监视对准精度，根据需要调整检测灵敏度。

10. 发明授权

US06927847B2 Method and apparatus for inspecting pattern defects 失效
标题翻译：检查图案缺陷的方法和装置
公开(公告)号：US06927847B2
公开(公告)日：2005-08-09
申请号：US10218463
申请日：2002-08-15
申请人： Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe
发明人： Minoru Yoshida , Shunji Maeda , Atsushi Shimoda , Kaoru Sakai , Takafumi Okabe
IPC分类号： G01N21/00 , G01N21/95 , G01N21/956 , G01N21/88
CPC分类号： G01N21/95607 , G01N21/9501 , G01N21/95684 , G01N2021/9513
摘要： An apparatus for inspecting pattern defects on microscopic circuit patterns, with high resolution, comprises: an objective lens for detecting an image of a sample; a UV laser beam illumination arrangement for illuminating onto a pupil of the objective lens; am arrangement for lowering coherency of the UV laser illumination; a detector of integration type; and an arrangement for processing detected signal thereof.
摘要翻译：一种用于检测具有高分辨率的微观电路图案上的图案缺陷的装置，包括：用于检测样品图像的物镜; 用于照射到物镜的光瞳上的UV激光束照明装置; 用于降低UV激光照明的相干性的布置; 集成型检测器; 以及用于处理其检测信号的装置。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式