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热词
    • 5. 发明授权
    • Method for forming a heat dissipation device
    • 形成散热装置的方法
    • US07698815B2
    • 2010-04-20
    • US10817170
    • 2004-04-02
    • Scott Garner
    • Scott Garner
    • B23P15/26B21D53/08
    • H01L23/4093F28D15/0275F28F1/32H01L23/427H01L2924/0002Y10T29/49353Y10T29/49364Y10T29/49368Y10T29/49377Y10T29/49378H01L2924/00
    • A heat sink for integrated circuits is limited substantially to heat transfer fins on one or more heat pipe tubes, the tube(s) functioning as a base for the heat sink. The heat pipe tube has a flattened oval cross-section and can snap-fit in openings through the fins. The tube is exposed on one side of the heat sink for contact with the heat generating circuit. The fins can be flat or irregular and can have a collar engaging the heat pipe tube. In one example, the heat pipe runs perpendicular to vertical fins along the bottom of a standing fin stack. In another embodiment two U-shaped heat pipe tubes carry a layered stack, the bottom of the U-shapes being presented under the lowermost in the stack. A clamp urges the heat sink against the heat source.
    • 用于集成电路的散热器基本上受限于一个或多个热管管上的传热翅片,该管作为散热器的基座起作用。 热管管具有扁平的椭圆形横截面,并且可以卡扣配合穿过翅片的开口。 该管暴露在散热器的一侧以与发热电路接触。 翅片可以是平坦的或不规则的,并且可以具有接合热管管的套环。 在一个示例中,热管垂直于垂直散热片沿立式散热片堆叠的底部延伸。 在另一个实施例中,两个U形热管管承载层叠的堆叠,U形的底部呈现在堆叠中的最下面。 夹具将散热器推向热源。