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1. 发明申请

US20130014926A1 DATA CENTER COOLANT SWITCH 有权
标题翻译：数据中心冷却开关
公开(公告)号：US20130014926A1
公开(公告)日：2013-01-17
申请号：US13184239
申请日：2011-07-15
申请人： Madhusudan K. Iyengar , Pritish R. Parida , Mark D. Schultz
发明人： Madhusudan K. Iyengar , Pritish R. Parida , Mark D. Schultz
IPC分类号： F28F27/00
CPC分类号： H05K7/20836 , F28D15/00 , H05K7/2079
摘要： A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid. It has a second heat transfer fluid freezing point lower than the first heat transfer fluid freezing point, and the second heat transfer fluid freezing point is sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.
摘要翻译：数据中心冷却系统以第一模式运行; 其具有室内部分，其中热量从数据中心的部件吸收;以及室外热交换器部分，其中外部空气被用于冷却至少在室外热交换器部分中存在的第一传热流体（例如，水）第一模式下的冷却系统。第一传热流体是相对高性能的传热流体（与第二流体相比），并且具有第一传热流体凝固点。确定已经达到适当的时间以从第一模式切换到第二模式。基于该判定，与第一传热流体相比，数据冷却系统的室外热交换器部分切换为相对低性能的传热流体的第二传热流体。其具有比第一传热流体凝固点低的第二传热流体凝固点，并且当室外空气温度下降到与第一传热的第一预定关系时，第二传热流体凝固点足够低以在不冻结的情况下运行流体凝固点。

2. 发明授权

US09043035B2 Dynamically limiting energy consumed by cooling apparatus 有权
标题翻译：动力限制冷却装置消耗的能量
公开(公告)号：US09043035B2
公开(公告)日：2015-05-26
申请号：US13305967
申请日：2011-11-29
申请人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
发明人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Roger R. Schmidt , Mark D. Schultz
IPC分类号： G06F19/00 , G05D7/06 , G06F1/20 , G11B33/14 , H05K7/20 , G06F1/32
CPC分类号： G05D7/0635 , G06F1/20 , G06F1/206 , G06F1/3206 , G11B33/144 , H05K7/20281 , H05K7/20781 , H05K7/2079 , H05K7/20836 , Y02D10/16
摘要： Cooling apparatuses and methods are provided which include one or more coolant-cooled structures associated with an electronics rack, a coolant loop coupled in fluid communication with one or more passages of the coolant-cooled structure(s), one or more heat exchange units coupled to facilitate heat transfer from coolant within the coolant loop, and N controllable components associated with the coolant loop or the heat exchange unit(s), wherein N≧1. The N controllable components facilitate circulation of coolant through the coolant loop or transfer of heat from the coolant via the heat exchange unit(s). A controller is coupled to the N controllable components, and dynamically adjusts operation of the N controllable components, based on Z input parameters and one or more specified constraints, to provide a specified cooling to the coolant-cooled structure(s), while limiting energy consumed by the N controllable components, wherein Z≧1.
摘要翻译：提供了冷却装置和方法，其包括与电子机架相关联的一个或多个冷却剂冷却结构，与冷却剂冷却结构的一个或多个通道流体连通的冷却剂回路，一个或多个热交换单元以促进从冷却剂回路内的冷却剂的热传递，以及与冷却剂回路或热交换单元相关联的N个可控部件，其中N≥1。 N个可控部件促使冷却剂循环通过冷却剂回路或通过热交换单元从冷却剂传递热量。控制器耦合到N个可控组件，并且基于Z输入参数和一个或多个指定的约束来动态调整N个可控组件的操作，以向冷却剂冷却的结构提供特定的冷却，同时限制能量由N个可控部件消耗，其中Z≥1。

3. 发明授权

US09151543B2 Data center coolant switch 有权
标题翻译：数据中心冷却液开关
公开(公告)号：US09151543B2
公开(公告)日：2015-10-06
申请号：US13184239
申请日：2011-07-15
申请人： Madhusudan K. Iyengar , Pritish R. Parida , Mark D. Schultz
发明人： Madhusudan K. Iyengar , Pritish R. Parida , Mark D. Schultz
IPC分类号： F25B25/00 , F28D15/00 , H05K7/20
CPC分类号： H05K7/20836 , F28D15/00 , H05K7/2079
摘要： A data center cooling system is operated in a first mode; it has an indoor portion wherein heat is absorbed from components in the data center, and an outdoor heat exchanger portion wherein outside air is used to cool a first heat transfer fluid (e.g., water) present in at least the outdoor heat exchanger portion of the cooling system during the first mode. The first heat transfer fluid is a relatively high performance heat transfer fluid (as compared to the second fluid), and has a first heat transfer fluid freezing point. A determination is made that an appropriate time has been reached to switch from the first mode to a second mode. Based on this determination, the outdoor heat exchanger portion of the data cooling system is switched to a second heat transfer fluid, which is a relatively low performance heat transfer fluid, as compared to the first heat transfer fluid. It has a second heat transfer fluid freezing point lower than the first heat transfer fluid freezing point, and the second heat transfer fluid freezing point is sufficiently low to operate without freezing when the outdoor air temperature drops below a first predetermined relationship with the first heat transfer fluid freezing point.
摘要翻译：数据中心冷却系统以第一模式运行; 其具有室内部分，其中热量从数据中心的部件吸收;以及室外热交换器部分，其中外部空气被用于冷却至少在室外热交换器部分中存在的第一传热流体（例如，水）第一模式下的冷却系统。第一传热流体是相对高性能的传热流体（与第二流体相比），并且具有第一传热流体凝固点。确定已经达到适当的时间以从第一模式切换到第二模式。基于该判定，与第一传热流体相比，数据冷却系统的室外热交换器部分切换为相对低性能的传热流体的第二传热流体。其具有比第一传热流体凝固点低的第二传热流体凝固点，并且当室外空气温度下降到与第一传热的第一预定关系时，第二传热流体凝固点足够低以在不冻结的情况下运行流体凝固点。

4. 发明申请

US20130306292A1 APPARATUS FOR THE COMPACT COOLING OF MODULES 有权
标题翻译：装置紧凑型冷却装置
公开(公告)号：US20130306292A1
公开(公告)日：2013-11-21
申请号：US13475348
申请日：2012-05-18
申请人： Madhusudan K. Iyengar , Pritish R. Parida
发明人： Madhusudan K. Iyengar , Pritish R. Parida
IPC分类号： F28F7/00
CPC分类号： H01L23/3672 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H05K7/20154 , H05K7/20509 , H01L2924/00
摘要： An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip.
摘要翻译：用于模块紧凑冷却的装置。所述装置包括夹子，联接到所述夹子的第一侧的第一盖板，与所述夹子的与所述夹子的第一侧相对的所述夹子的第二侧连接的第二盖板，与所述第一盖板热耦合的第一框架以及与第二盖板热耦合的第二框架。第一框架和第二框架中的每一个可以包括用于分别使冷却剂通过第一框架和第二框架的多个通道。此外，该装置还可以包括用于引导冷却剂穿过多个通道并用于阻止冷却剂沿着夹子的第一侧和夹子的第二侧流动的填料。

5. 发明授权

US09445529B2 Liquid cooled data center design selection 有权
标题翻译：液冷数据中心设计选择
公开(公告)号：US09445529B2
公开(公告)日：2016-09-13
申请号：US13479265
申请日：2012-05-23
申请人： Timothy J. Chainer , Madhusudan K. Iyengar , Pritish R. Parida
发明人： Timothy J. Chainer , Madhusudan K. Iyengar , Pritish R. Parida
IPC分类号： G06G7/56 , H05K7/20
CPC分类号： H05K7/2079 , H05K7/20836
摘要： Input data, specifying aspects of a thermal design of a liquid cooled data center, is obtained. The input data includes data indicative of ambient outdoor temperature for a location of the data center; and/or data representing workload power dissipation for the data center. The input data is evaluated to obtain performance of the data center thermal design. The performance includes cooling energy usage; and/or one pertinent temperature associated with the data center. The performance of the data center thermal design is output.
摘要翻译：获得了指定液冷数据中心的热设计方面的输入数据。输入数据包括指示数据中心位置的环境室外温度的数据; 和/或表示数据中心的工作负载功耗的数据。评估输入数据以获得数据中心热设计的性能。性能包括冷却能量的使用; 和/或与数据中心相关联的一个相关温度。输出数据中心散热设计的性能。

6. 发明授权

US09250636B2 Coolant and ambient temperature control for chillerless liquid cooled data centers 有权
标题翻译：冷却液和环境温度控制无冷却液体冷却数据中心
公开(公告)号：US09250636B2
公开(公告)日：2016-02-02
申请号：US13439471
申请日：2012-04-04
申请人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Robert E. Simons
发明人： Timothy J. Chainer , Milnes P. David , Madhusudan K. Iyengar , Pritish R. Parida , Robert E. Simons
IPC分类号： G05D23/00 , G05D23/19 , G06F1/20 , H05K7/20
CPC分类号： H05K7/20836 , F28F27/02 , G05D23/1932 , G06F1/206 , G06F2200/201 , Y02D10/16
摘要： Cooling control methods include measuring a temperature of air provided to a plurality of nodes by an air-to-liquid heat exchanger, measuring a temperature of at least one component of the plurality of nodes and finding a maximum component temperature across all such nodes, comparing the maximum component temperature to a first and second component threshold and comparing the air temperature to a first and second air threshold, and controlling a proportion of coolant flow and a coolant flow rate to the air-to-liquid heat exchanger and the plurality of nodes based on the comparisons.
摘要翻译：冷却控制方法包括通过空气 - 液体热交换器测量提供给多个节点的空气的温度，测量多个节点中的至少一个部件的温度并且在所有这些节点之间找到最大分量温度，比较将最大部件温度提高到第一和第二部件阈值，并将空气温度与第一和第二空气阈值进行比较，并且控制冷却剂流量和冷却剂流量的比例到空气到液体热交换器和多个节点基于比较。

7. 发明授权

US09076753B2 Apparatus for the compact cooling of modules 有权
标题翻译：用于模块紧凑冷却的装置
公开(公告)号：US09076753B2
公开(公告)日：2015-07-07
申请号：US13475348
申请日：2012-05-18
申请人： Madhusudan K. Iyengar , Pritish R. Parida
发明人： Madhusudan K. Iyengar , Pritish R. Parida
IPC分类号： F28F7/00 , H05K7/20 , H01L23/10 , H01L23/34 , H01L23/367 , H01L23/40 , H01L23/467
CPC分类号： H01L23/3672 , H01L23/4093 , H01L23/467 , H01L2924/0002 , H05K7/20154 , H05K7/20509 , H01L2924/00
摘要： An apparatus for the compact cooling of modules. The apparatus includes a clip, a first cover plate coupled to a first side of the clip, a second cover plate coupled to a second side of the clip opposite to the first side of the clip, a first frame thermally coupled to the first cover plate, and a second frame thermally coupled to the second cover plate. Each of the first frame and the second frame may include a plurality of channels for passing coolant through the first frame and the second frame, respectively. Additionally, the apparatus may further include a filler for directing coolant through the plurality of channels, and for blocking coolant from flowing along the first side of the clip and the second side of the clip.
摘要翻译：用于模块紧凑冷却的装置。所述装置包括夹子，联接到所述夹子的第一侧的第一盖板，与所述夹子的与所述夹子的第一侧相对的所述夹子的第二侧连接的第二盖板，与所述第一盖板热耦合的第一框架以及与第二盖板热耦合的第二框架。第一框架和第二框架中的每一个可以包括用于分别使冷却剂通过第一框架和第二框架的多个通道。此外，该装置还可以包括用于引导冷却剂穿过多个通道并用于阻止冷却剂沿着夹子的第一侧和夹子的第二侧流动的填料。

8. 发明授权

US08913384B2 Thermal transfer structures coupling electronics card(s) to coolant-cooled structure(s) 有权
标题翻译：将电子卡耦合到冷却剂冷却结构的热转印结构
公开(公告)号：US08913384B2
公开(公告)日：2014-12-16
申请号：US13527947
申请日：2012-06-20
申请人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
发明人： Milnes P. David , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Pritish R. Parida , Roger R. Schmidt , Mark E. Steinke
IPC分类号： H05K7/20 , H05K13/00
CPC分类号： H05K7/20745 , H05K7/2079 , H05K13/00
摘要： Cooling apparatuses and coolant-cooled electronic systems are provided which include thermal transfer structures configured to engage with a spring force one or more electronics cards with docking of the electronics card(s) within a respective socket(s) of the electronic system. A thermal transfer structure of the cooling apparatus includes a thermal spreader having a first thermal conduction surface, and a thermally conductive spring assembly coupled to the conduction surface of the thermal spreader and positioned and configured to reside between and physically couple a first surface of an electronics card to the first surface of the thermal spreader with docking of the electronics card within a socket of the electronic system. The thermal transfer structure is, in one embodiment, metallurgically bonded to a coolant-cooled structure and facilitates transfer of heat from the electronics card to coolant flowing through the coolant-cooled structure.
摘要翻译：提供冷却装置和冷却剂冷却的电子系统，其包括热传递结构，其被配置成与弹簧力接合一个或多个电子卡，其中电子卡在电子系统的相应插座内对接。冷却装置的热传递结构包括具有第一热传导表面的散热器和耦合到散热器的导电表面的导热弹簧组件，并被定位和配置成驻留在物理上耦合电子器件的第一表面卡到散热器的第一表面，使电子卡在电子系统的插座内对接。在一个实施例中，热传递结构是冶金结合到冷却剂冷却结构，并且有助于将热量从电子卡传递到流过冷却剂冷却结构的冷却剂。

9. 发明申请

US20130306273A1 APPARATUS FOR THE COMPACT COOLING OF AN ARRAY OF COMPONENTS 审中-公开
标题翻译：用于组件阵列的紧凑冷却的装置
公开(公告)号：US20130306273A1
公开(公告)日：2013-11-21
申请号：US13475224
申请日：2012-05-18
申请人： Madhusudan K. Iyengar , Pritish R. Parida
发明人： Madhusudan K. Iyengar , Pritish R. Parida
IPC分类号： F28D15/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： An apparatus for the compact cooling of an array of components. The apparatus includes a housing with cover plates on opposing sides of the housing, and a frame between the cover plates. The frame is thermally coupled to each of the cover plates and includes a plurality of channels for passing coolant through the housing.
摘要翻译：用于紧凑冷却组件阵列的装置。该装置包括在壳体的相对侧上具有盖板的壳体和盖板之间的框架。框架热耦合到每个盖板并且包括用于使冷却剂通过壳体的多个通道。

10. 发明授权

US08493738B2 Cooled electronic system with thermal spreaders coupling electronics cards to cold rails 失效
标题翻译：冷却电子系统，散热器将电子卡耦合到冷轨
公开(公告)号：US08493738B2
公开(公告)日：2013-07-23
申请号：US13102211
申请日：2011-05-06
申请人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
发明人： Timothy J. Chainer , Michael A. Gaynes , David P. Graybill , Madhusudan K. Iyengar , Vinod Kamath , Bejoy J. Kochuparambil , Roger R. Schmidt , Mark D. Schultz , Daniel P. Simco , Mark E. Steinke
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20781 , H05K7/2079
摘要： Liquid-cooled electronic systems are provided which include an electronic assembly having an electronics card and a socket with a latch at one end. The latch facilitates securing of the card within the socket or removal of the card from the socket. A liquid-cooled cold rail is disposed at the one end of the socket, and a thermal spreader couples the electronics card to the cold rail. The thermal spreader includes first and second thermal transfer plates coupled to first and second surfaces on opposite sides of the card, and thermally conductive extensions extending from end edges of the plates, which couple the respective transfer plates to the liquid-cooled cold rail. The thermally conductive extensions are disposed to the sides of the latch, and the card is securable within or removable from the socket using the latch without removing the cold rail or the thermal spreader.
摘要翻译：提供液冷电子系统，其包括具有电子卡的电子组件和在一端具有闩锁的插座。闩锁有助于将卡固定在插座内或从插座中取出卡。液冷冷轨布置在插座的一端，散热器将电子卡连接到冷轨。热散布器包括耦合到卡的相对侧上的第一和第二表面的第一和第二热传递板，以及从板的端部边缘延伸的导热延伸件，其将相应的传递板联接到液体冷却的冷轨。导热延伸部设置在闩锁的侧面，并且卡可以使用闩锁固定在插座内或从插座中移除而不移除冷轨或散热器。

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