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1. 发明授权

US09708693B2 High phosphorus electroless nickel 有权
公开(公告)号：US09708693B2
公开(公告)日：2017-07-18
申请号：US14294437
申请日：2014-06-03
申请人： MacDermid Acumen, Inc.
发明人： Robert Janik , Nicole J. Micyus
IPC分类号： C23C18/36 , C23C18/32 , C22C19/03
CPC分类号： C22C19/03 , C23C18/36
摘要： An electroless nickel plating bath comprising: i) a source of nickel ions; ii) an effective amount of thiourea; iii) an effective amount of saccharin; iv) a source of hypophosphite ions; v) one or more chelating agents; and vi) optionally, other additives and a method of using the same to provide a high phosphorus electroless nickel plating deposit on a substrate. The high phosphorus electroless nickel deposit is capable of passing an RCA nitric acid test, whereby the substrate with the high phosphorus nickel deposit thereon is immersed into concentrated nickel acid for 30 seconds and a deposit that does not turn black or grey is deemed to have passed the RCA nitric acid test.

2. 发明授权

US11685999B2 Aqueous electroless nickel plating bath and method of using the same 有权
公开(公告)号：US11685999B2
公开(公告)日：2023-06-27
申请号：US14293216
申请日：2014-06-02
申请人： MacDermid Acumen, Inc.
发明人： Robert Janik , Nicole J. Micyus , Ryan Schuh
IPC分类号： B05D3/10 , C23C18/36
CPC分类号： C23C18/36
摘要： An electroless nickel plating solution and a method of using the same to produce a nickel deposit having a phosphorus content that remains at about 12% throughout the lifetime of the electroless nickel plating solution is disclosed. The electroless nickel plating solution comprises (a) a source of nickel ions; (b) a reducing agent comprising a hypophosphite; and (c) a chelation system comprising: (i) one or more dicarboxylic acids; and (ii) one or more alpha hydroxy carboxylic acids. The electroless nickel plating solution may also comprise stabilizers and brighteners.

3. 发明授权

US10246778B2 Electroless nickel plating solution and method 有权
公开(公告)号：US10246778B2
公开(公告)日：2019-04-02
申请号：US13961018
申请日：2013-08-07
申请人： MacDermid Acumen, Inc.
发明人： Robert Janik , Nicole J. Micyus
IPC分类号： C23C18/18 , C23C18/16 , C23C18/20 , C23C18/36 , C23C18/34
摘要： An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.

4. 发明申请

US20150044374A1 Electroless Nickel Plating Solution and Method 审中-公开
标题翻译：化学镀镍溶液及方法
公开(公告)号：US20150044374A1
公开(公告)日：2015-02-12
申请号：US13961018
申请日：2013-08-07
申请人： MacDermid Acumen, Inc.
发明人： Robert Janik , Nicole J. Micyus
IPC分类号： C23C18/16 , C23C18/20 , C23C18/36 , C23C18/18
CPC分类号： C23C18/1646 , C23C18/1637 , C23C18/1639 , C23C18/1641 , C23C18/1824 , C23C18/1844 , C23C18/1893 , C23C18/2046 , C23C18/2086 , C23C18/34 , C23C18/36
摘要： An electroless nickel plating solution and a method of using the same is described. The electroless nickel plating solution comprises (i) a source of nickel ions; (ii) a reducing agent; (iii) one or more complexing agents; (iv) one or more bath stabilizers; (v) a brightener, said brightener comprising a sulfonated compound having sulfonic acid or sulfonate groups; and (vi) optionally, one or more additional additives. The use of the sulfonated compound brightener results in a bright electroless nickel deposit on various substrates having a high gloss value.
摘要翻译：描述了一种无电镀镍溶液及其使用方法。化学镀镍溶液包括（i）镍离子源; （ii）还原剂; （iii）一种或多种络合剂; （iv）一种或多种浴液稳定剂; （v）增白剂，所述增白剂包含具有磺酸或磺酸盐基团的磺化化合物; 和（vi）任选的一种或多种另外的添加剂。磺化化合物增白剂的使用导致在具有高光泽度的各种基材上的亮化学镀镍。

5. 发明申请

US20160010214A1 Composite Electroless Nickel Plating 审中-公开
标题翻译：复合无电镀镍
公开(公告)号：US20160010214A1
公开(公告)日：2016-01-14
申请号：US14327995
申请日：2014-07-10
申请人： MacDermid Acumen, Inc.
发明人： Boules H. Morcos , Nicole J. Micyus , John Pawlowski
IPC分类号： C23C18/16 , C23C18/34
CPC分类号： C23C18/1646 , C23C18/1662 , C23C18/1671 , C23C18/34 , C23C18/36
摘要： A method of producing a composite electroless nickel layer on a substrate is described. The method includes the steps of contacting the substrate with a composite electroless nickel plating bath and generating an electrostatic field in the electroless nickel plating bath. The electric field is generated by placing an anode in the electroless nickel plating bath and connecting the anode to a positive terminal of a DC rectifier, and connecting the substrate to a negative terminal of the DC rectifier, and preferably inserting a capacitor into the circuit to prevent passage of current. An attractive force generated by the electrostatic field increases the attraction of the positively charged PTFE particles to the negatively charged substrate and drives the positively charged PTFE particles to the negatively charged substrate.
摘要翻译：描述了在基板上制造复合化学镀镍层的方法。该方法包括以下步骤：使基底与复合无电镀镍浴接触，并在无电镀镍浴中产生静电场。通过将阳极放置在化学镀镍浴中并将阳极连接到DC整流器的正极端子并将衬底连接到DC整流器的负极端子，并且优选地将电容器插入到电路中来产生电场防止电流流过。由静电场产生的吸引力增加了带正电荷的PTFE颗粒对带负电荷的基底的吸引力，并将带正电的PTFE颗粒驱动到带负电荷的衬底上。

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