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1. 发明授权

US11118056B2 Thermally conductive polysiloxane composition 有权
公开(公告)号：US11118056B2
公开(公告)日：2021-09-14
申请号：US16319639
申请日：2017-07-20
申请人： MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
发明人： Daigo Hirakawa , Masanori Takanashi , Isao Iida , Kenji Takenaka , Eiji Tanigawa
IPC分类号： C08L83/04 , C08G77/08 , C08G77/12 , C08G77/18 , C08G77/20 , C08G77/00 , C08K3/22 , C08K3/28
摘要： A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 μm to 150 μm in an amount of at least 20% by mass, based on the mass of a total of the component (A).

2. 发明授权

US11286349B2 Surface treatment agent for thermally conductive polyorganosiloxane composition 有权
公开(公告)号：US11286349B2
公开(公告)日：2022-03-29
申请号：US16319624
申请日：2017-07-20
申请人： MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
发明人： Eiji Tanigawa , Masanori Takanashi , Isao Iida , Daigo Hirakawa , Kenji Takenaka
IPC分类号： C08G77/18 , C08G77/50 , C08K3/013 , C08K9/06 , C08G77/04
摘要： A siloxane compound represented by the general formula (1): where R1 is a group having an alkoxysilyl group having 1 to 4 carbon atoms, R2 is a linear organosiloxy group represented by the general formula (2): where each R4 is independently a monovalent hydrocarbon group having 1 to 12 carbon atoms, Y is a monovalent hydrocarbon group having 1 to 6 carbon atoms, and d is an integer of 10 to 50, each X is independently a divalent hydrocarbon group having 2 to 10 carbon atoms, each of a and b is independently an integer of 1 or more, c is an integer of 0 or more, a+b+c is an integer of 4 or more, and each R3 is independently a monovalent hydrocarbon group having 1 to 6 carbon atoms.

3. 发明授权

US09034993B2 Room temperature-curable polyorganosiloxane composition 有权
标题翻译：室温固化型聚有机硅氧烷组合物
公开(公告)号：US09034993B2
公开(公告)日：2015-05-19
申请号：US13928820
申请日：2013-06-27
申请人： MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
发明人： Koki Otashiro , Isao Iida
IPC分类号： C08K3/36 , C09J183/04 , C08G77/16 , C08K5/544 , C08G77/18 , C08K9/06
CPC分类号： C08K3/36 , C08G77/16 , C08G77/18 , C08K5/544 , C08K9/06 , C08L83/00 , C09J183/04
摘要： A room temperature-curable polyorganosiloxane composition is a two component-type room temperature-curable polyorganosiloxane composition including (A) a base composition and (B) a cross-linking agent composition. The component (A) contains (a1) polyorganosiloxane having a hydroxyl group or an alkoxy group at a molecular end and (a2) an inorganic filler. The component (B) includes (b1) an organosilicon compound having three or more hydrolyzable groups in one molecule, (b2) polyorganosiloxane having an alkoxy group at a molecular end and represented by the following general formula and, and (b3) a curing catalyst. In the two component-type room temperature-curable polyorganosiloxane composition, it is possible to appropriately adjust a compounding ratio of the base component and the cross-linking component according to the use of an automatic mixer/discharger or the like without deteriorating properties such as deep-part curability, curing uniformity, and storage stability.
摘要翻译：室温固化性聚有机硅氧烷组合物是包含（A）基础组合物和（B）交联剂组合物的双组分型室温固化型聚有机硅氧烷组合物。组分（A）含有（a1）分子末端具有羟基或烷氧基的聚有机硅氧烷，（a2）无机填料。组分（B）包括（b1）在一个分子中具有三个或更多个可水解基团的有机硅化合物，（b2）分子末端具有烷氧基并由以下通式表示的聚有机硅氧烷，和（b3）固化催化剂。在双组分型室温固化型聚有机硅氧烷组合物中，可以根据使用自动混合器/放电机等适当地调整基础成分和交联成分的配合比例，而不会劣化诸如深部固化性，固化均匀性和储存稳定性。

4. 发明授权

US11739245B2 Thermally conductive polyorganosiloxane composition 有权
公开(公告)号：US11739245B2
公开(公告)日：2023-08-29
申请号：US16319612
申请日：2017-07-20
申请人： MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
发明人： Masanori Takanashi , Isao Iida , Daigo Hirakawa , Kenji Takenaka , Eiji Tanigawa
IPC分类号： C09K5/14 , C08G77/08 , C08G77/12 , C08G77/18 , C08K3/22 , C08K3/28 , H05K7/20 , C08G77/20
CPC分类号： C09K5/14 , C08G77/08 , C08G77/12 , C08G77/18 , C08K3/22 , C08K3/28 , H05K7/2039 , C08G77/20 , C08K2003/2227 , C08K2003/282 , C08K2201/001
摘要： A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, (B) a polyorganosiloxane resin including at least one polysiloxane having one curable functional group in the molecule thereof, and (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure.

5. 发明授权

US10160883B2 Room-temperature-curable polyorganosiloxane composition and electric/electronic apparatus 有权
公开(公告)号：US10160883B2
公开(公告)日：2018-12-25
申请号：US15190916
申请日：2016-06-23
申请人： MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
发明人： Isao Iida , Takeshi Sunaga
IPC分类号： C08L83/00 , C08L83/06 , C09D183/06 , C08G77/18 , B05D1/02
摘要： There is provided a room-temperature-curable polyorganosiloxane composition having low viscosity and good coatability without any solvent and forming a cured coating film excellent in scratch resistance. The room-temperature-curable polyorganosiloxane composition contains: (A) 100 parts by mass of a mixture of (A1) 10 to 80 parts by mass of a polyorganosiloxane having two or more alkoxy groups bonded to silicon atoms and a prescribed viscosity, and (A2) 90 to 20 parts by mass of a polyorganosiloxane represented by an average composition formula: R1aSi(OR2)bO{4−(a+b)}/2 (R1 and R2 represent prescribed group respectively, and a and b are prescribed positive numbers), having an Mw of 2,000 to 100,000 and a three-dimensional network structure, and being in a solid state or in a semisolid state at normal temperature; and (B) 0.1 to 15 parts by mass of an organic titanium compound.

6. 发明授权

US11814521B2 Thermally conductive polyorganosiloxane composition 有权
公开(公告)号：US11814521B2
公开(公告)日：2023-11-14
申请号：US17357690
申请日：2021-06-24
申请人： MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
发明人： Atsushi Sakamoto , Isao Iida
IPC分类号： C08L83/04 , C08K3/28 , C08K3/013 , C08L83/06 , C08G77/12 , C08G77/20
CPC分类号： C08L83/04 , C08K3/013 , C08K3/28 , C08L83/06 , C08G77/12 , C08G77/20 , C08K2003/282 , C08K2201/001 , C08K2201/003 , C08L2203/206 , C08L83/04 , C08L83/00 , C08L83/00 , C08K5/56 , C08K3/22
摘要： A thermally conductive polysiloxane composition comprising: (A) a thermally conductive filler; (B) a polyorganosiloxane resin having a curable functional group in the polysiloxane molecule, the polyorganosiloxane resin comprising at least one polysiloxane (b1) having one curable functional group in the molecule thereof; (C) a siloxane compound having an alkoxysilyl group and a linear siloxane structure; (D) a hydrogenpolyorganosiloxane; and (E) a platinum catalyst, wherein the content of the polysiloxane (b1) having one curable functional group in the molecule thereof in the polyorganosiloxane resin (B) is more than 80% by mass.

7. 发明授权

US11084927B2 Thermally conductive polysiloxane composition 有权
公开(公告)号：US11084927B2
公开(公告)日：2021-08-10
申请号：US16319639
申请日：2017-07-20
申请人： MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
发明人： Daigo Hirakawa , Masanori Takanashi , Isao Iida , Kenji Takenaka , Eiji Tanigawa
IPC分类号： C08L83/04 , C08G77/08 , C08G77/12 , C08G77/18 , C08G77/20 , C08G77/00 , C08K3/22 , C08K3/28
摘要： A thermally conductive polysiloxane composition includes (A) a thermally conductive filler, and (B) at least one member selected from the group consisting of an alkoxysilyl group-containing compound and a dimethylpolysiloxane. The component (A) includes at least two thermally conductive fillers having different average particle diameters, and (A-1) indefinite-shaped aluminum nitride particles having an average particle diameter of 30 μm to 150 μm in an amount of at least 20% by mass, based on the mass of a total of the component (A).

8. 发明授权

US11254849B2 Method for producing a thermally conductive polysiloxane composition 有权
公开(公告)号：US11254849B2
公开(公告)日：2022-02-22
申请号：US15772690
申请日：2016-11-02
申请人： MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
发明人： Eiji Tanigawa , Masanori Takanashi , Isao Iida , Daigo Hirakawa , Kenji Takenaka
IPC分类号： C08K9/06 , C09K5/14 , H01L23/36 , C08L83/04 , H01L23/373 , C08J3/20 , C08K9/08 , C08G77/20 , C08K3/22 , C09C3/12
摘要： A method for producing a polyorganosiloxane resin composition including: (a) mixing a thermally-conductive filler having a particle size distribution having a single peak, with a surface treatment agent containing a siloxane to form a mixture, and (b) mixing the mixture from step (a) with a polysiloxane resin.

9. 发明申请

US20130303676A1 ROOM TEMPERATURE-CURABLE POLYORGANOSILOXANE COMPOSITION 有权
标题翻译：室温可固化聚硅氧烷组合物
公开(公告)号：US20130303676A1
公开(公告)日：2013-11-14
申请号：US13928820
申请日：2013-06-27
申请人： MOMENTIVE PERFORMANCE MATERIALS JAPAN LLC
发明人： Koki Otashiro , Isao Iida
IPC分类号： C08K3/36
CPC分类号： C08K3/36 , C08G77/16 , C08G77/18 , C08K5/544 , C08K9/06 , C08L83/00 , C09J183/04
摘要： A room temperature-curable polyorganosiloxane composition is a two component-type room temperature-curable polyorganosiloxane composition including (A) a base composition and (B) a cross-linking agent composition. The component (A) contains (a1) polyorganosiloxane having a hydroxyl group or an alkoxy group at a molecular end and (a2) an inorganic filler. The component (B) includes (b1) an organosilicon compound having three or more hydrolyzable groups in one molecule, (b2) polyorganosiloxane having an alkoxy group at a molecular end and represented by the following general formula and, and (b3) a curing catalyst. In the two component-type room temperature-curable polyorganosiloxane composition, it is possible to appropriately adjust a compounding ratio of the base component and the cross-linking component according to the use of an automatic mixer/discharger or the like without deteriorating properties such as deep-part curability, curing uniformity, and storage stability.
摘要翻译：室温固化性聚有机硅氧烷组合物是包含（A）基础组合物和（B）交联剂组合物的双组分型室温固化型聚有机硅氧烷组合物。组分（A）含有（a1）分子末端具有羟基或烷氧基的聚有机硅氧烷，（a2）无机填料。组分（B）包括（b1）在一个分子中具有三个或更多个可水解基团的有机硅化合物，（b2）分子末端具有烷氧基并由以下通式表示的聚有机硅氧烷，和（b3）固化催化剂。在双组分型室温固化型聚有机硅氧烷组合物中，可以根据使用自动混合器/放电机等适当地调整基础成分和交联成分的配合比例，而不会劣化诸如深部固化性，固化均匀性和储存稳定性。

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