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1. 发明授权

US06227434B1 Reworking of a ball grid array module 失效
标题翻译：球栅阵列模块的重新组装
公开(公告)号：US06227434B1
公开(公告)日：2001-05-08
申请号：US09273788
申请日：1999-03-22
申请人： Luigi Bassi , Michele Monopoli , Paolo Spinzi , Danilo Villa
发明人： Luigi Bassi , Michele Monopoli , Paolo Spinzi , Danilo Villa
IPC分类号： B23K3110
CPC分类号： B23K1/018 , B23K2101/36 , H05K3/3436 , H05K3/3457 , H05K3/3494
摘要： A method for reworking a Ball Grid Array electronic module by removing the solder balls from the substrate surface after one or more of the connections have been detected to be damaged. The module is immersed in a water soluble oil bath and heated to the melting point. Then a rotating brush, with the rotating axis perpendicular to the substrate plane, removes the solder balls and the solder material particles while the module is still immersed in the fluid.
摘要翻译：检测到一个或多个连接件被检测到损坏之后，通过从衬底表面去除焊球来重新制作球栅阵列电子模块的方法。将该模块浸入水溶性油浴中并加热至熔点。然后旋转的轴与旋转轴线垂直于衬底平面，当模块仍然浸入流体中时，去除焊球和焊料颗粒。

2. 发明授权

US06994803B2 Ball grid array module 有权
标题翻译：球栅阵列模块
公开(公告)号：US06994803B2
公开(公告)日：2006-02-07
申请号：US10436591
申请日：2003-05-12
申请人： Luigi Giussani , Lorenza Lombardi , Michele Monopoli , Vittorio Sirtori , Franco Zambon
发明人： Luigi Giussani , Lorenza Lombardi , Michele Monopoli , Vittorio Sirtori , Franco Zambon
IPC分类号： C09K3/00 , C09K15/32 , C11D17/00 , H05K3/30 , H05K13/00
CPC分类号： H05K3/0076 , H01L24/48 , H01L24/81 , H01L24/85 , H01L2224/05624 , H01L2224/16 , H01L2224/48091 , H01L2224/81801 , H01L2224/85 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3452 , H05K2203/0786 , H05K2203/122 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02–0.03 millimeter) of a paste very soluble in water and washing it off.The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.
摘要翻译：根据本发明的优选实施例的方法在制造混合多芯片模块（HMCM）的SMT组装操作期间减轻了金污染的问题，实现了高的组装工艺产量。该目标通过在第一工艺步骤中保护具有非常溶于水并将其清除的薄层（0.02-0.03毫米）的金来实现。

3. 发明授权

US06574860B1 Ball grid array module 失效
标题翻译：球栅阵列模块
公开(公告)号：US06574860B1
公开(公告)日：2003-06-10
申请号：US09666949
申请日：2000-09-20
申请人： Luigi Giussani , Lorenza Lombardi , Michele Monopoli , Vittorio Sirtori , Franco Zambon
发明人： Luigi Giussani , Lorenza Lombardi , Michele Monopoli , Vittorio Sirtori , Franco Zambon
IPC分类号： H05K334
CPC分类号： H05K3/0076 , H01L24/48 , H01L24/81 , H01L24/85 , H01L2224/05624 , H01L2224/16 , H01L2224/48091 , H01L2224/81801 , H01L2224/85 , H01L2224/85399 , H01L2924/00014 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01033 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/3452 , H05K2203/0786 , H05K2203/122 , Y10T29/4913 , Y10T29/49144 , Y10T29/49146 , Y10T29/49147 , Y10T29/49149 , Y10T29/49169 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： The method according to a preferred embodiment of the present invention mitigates the problem of gold contamination during the SMT assembly operations in the manufacture of Hybrid Multi Chip Modules (HMCM), achieving a high assembly process yield. This target is accomplished by protecting, at the first process step, the gold with a thin layer (0.02-0.03 millimeter) of a paste very soluble in water and washing it off. The protective layer obtained with the above described method is very strong. Furthermore it is very easy to remove, since it is soluble in water.
摘要翻译：根据本发明的优选实施例的方法在制造混合多芯片模块（HMCM）的SMT组装操作期间减轻了金污染的问题，实现了高的组装工艺产量。该目标通过在第一工艺步骤中保护具有非常溶于水并将其清除的薄层（0.02-0.03毫米）的金来实现。用上述方法获得的保护层非常强。此外，它非常容易去除，因为它可溶于水。

4. 发明授权

US06453263B1 Surface analysis using ellipsometry 失效
标题翻译：使用椭偏仪进行表面分析
公开(公告)号：US06453263B1
公开(公告)日：2002-09-17
申请号：US09548941
申请日：2000-04-13
申请人： Vittorio Sirtori , Lorenza Lombardi , Michele Monopoli , Franco Zambon
发明人： Vittorio Sirtori , Lorenza Lombardi , Michele Monopoli , Franco Zambon
IPC分类号： G01B1302
CPC分类号： G01B11/303 , G01B11/0641
摘要： A method and system for estimating the roughness and the contamination of a surface. A preferred embodiment of the present invention makes use of a mathematical model which gives indications of the metal roughness, expressed as the ratio of metal volume to air volume, and the contamination thickness values of a metal substrate (e.g. gold) for a determined contamination (e.g. organic). This model is based on a series of tables which represent the expected values of &psgr;, i.e. the ratio between the amplitudes of the incident beam on the two polarization planes multiplied by the ratio of the amplitudes of the reflected beam on the polarization planes, and &Dgr;, i.e. the difference between the phases on the two polarization planes of the incident beam and the reflected beam, for a gold substrate having a predetermined roughness and a predetermined type of contamination (organic). Each table is built for a roughness value &phgr; expressed as the ratio of metal volume to air volume and gives the values of &psgr; and &Dgr; for a range of possible contaminations expressed as thickness of the contaminant film. Each table shows, for a predetermined value of &phgr;, the expected values of &psgr; and &Dgr; for an organic contaminant film having a thickness of 0, 10 . . . 100 Angstrom.
摘要翻译：用于估计表面的粗糙度和污染的方法和系统。本发明的优选实施例利用一种数学模型，该数学模型给出了金属粗糙度的指示，其表示为金属体积与空气体积的比率以及用于确定的污染物的金属基底（例如金）的污染物厚度值（例如有机）。该模型基于一系列表示psi的期望值的表，即在两个偏振面上的入射光束的振幅乘以反射光束在偏振面上的幅度的比率和DELTA 即对于具有预定粗糙度的金基板和预定类型的污染（有机的）的入射光束和反射光束的两个偏振面上的相位之间的差异。每个表都是用一个表示为金属体积与空气体积的比率的粗糙度值phi构成的，并给出了以污染物膜厚度表示的可能污染范围的psi和DELTA值。对于预定值的phi，每个表显示厚度为0,10的有机污染膜的psi和DELTA的期望值。。。 100埃。

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