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    • 3. 发明授权
    • Non-volatile memory device
    • 非易失性存储器件
    • US08526225B2
    • 2013-09-03
    • US12596721
    • 2008-04-30
    • Ludovic GouxJudit G. Lisoni ReyesThomas GilleDirk J. C. C. M. Wouters
    • Ludovic GouxJudit G. Lisoni ReyesThomas GilleDirk J. C. C. M. Wouters
    • G11C11/00
    • H01L45/1683G11C13/0009G11C13/02G11C2213/15G11C2213/56H01L45/04H01L45/1233H01L45/1253H01L45/144
    • A memory device comprises an array of memory cells for storing data and a voltage application unit for applying voltages to the cells for writing data to the cells. Each memory cell has a first layer comprising copper in contact with a second layer comprising a chalcogenide material. The voltage application unit is arranged to write data by switching each cell between a first resistance state and a second, lower, resistance state. The voltage application unit is arranged to switch a cell to the first resistance state by applying a potential difference across the first and second layers such that the potential at the first layer is higher than the potential at the second layer by 0.5 volts or less. The voltage application unit is arranged to switch a cell to the second resistance state by applying a potential difference across the first and second layers such that the potential at the second layer is higher than the potential at the first layer by 0.5 volts or less. The current flow when switching between resistance states is less than 10 μA. The memory cells of the device can be toggled between the resistance states, and the resistance states are non-volatile.
    • 存储器件包括用于存储数据的存储器单元阵列和用于向单元施加电压以将数据写入单元的电压施加单元。 每个存储单元具有包含与包含硫族化物材料的第二层接触的铜的第一层。 电压施加单元被布置成通过在第一电阻状态和第二,较低电阻状态之间切换每个单元来写入数据。 电压施加单元被布置成通过在第一层和第二层之间施加电位差来将单元切换到第一电阻状态,使得第一层处的电位高于第二层处的电位0.5伏或更小。 电压施加单元被布置成通过施加跨越第一层和第二层的电位差使单元切换到第二电阻状态,使得第二层处的电位高于第一层的电位0.5伏或更小。 在电阻状态之间切换时的电流小于10μA。 器件的存储单元可以在电阻状态之间切换,并且电阻状态是非易失性的。
    • 6. 发明申请
    • NON-VOLATILE MEMORY DEVICE
    • 非易失性存储器件
    • US20100202193A1
    • 2010-08-12
    • US12596721
    • 2008-04-30
    • Ludovic GouxJudit Lisoni ReyesThomas GilleDirk Wouters
    • Ludovic GouxJudit Lisoni ReyesThomas GilleDirk Wouters
    • G11C11/00H01L45/00G11C7/22
    • H01L45/1683G11C13/0009G11C13/02G11C2213/15G11C2213/56H01L45/04H01L45/1233H01L45/1253H01L45/144
    • A memory device comprises an array of memory cells for storing data and a voltage application unit for applying voltages to the cells for writing data to the cells. Each memory cell has a first layer comprising copper in contact with a second layer comprising a chalcogenide material. The voltage application unit is arranged to write data by switching each cell between a first resistance state and a second, lower, resistance state. The voltage application unit is arranged to switch a cell to the first resistance state by applying a potential difference across the first and second layers such that the potential at the first layer is higher than the potential at the second layer by 0.5 volts or less. The voltage application unit is arranged to switch a cell to the second resistance state by applying a potential difference across the first and second layers such that the potential at the second layer is higher than the potential at the first layer by 0.5 volts or less. The current flow when switching between resistance states is less than 10 μA. The memory cells of the device can be toggled between the resistance states, and the resistance states are non-volatile.
    • 存储器件包括用于存储数据的存储器单元阵列和用于向单元施加电压以将数据写入单元的电压施加单元。 每个存储单元具有包含与包含硫族化物材料的第二层接触的铜的第一层。 电压施加单元被布置成通过在第一电阻状态和第二,较低电阻状态之间切换每个单元来写入数据。 电压施加单元被布置成通过在第一层和第二层之间施加电位差来将单元切换到第一电阻状态,使得第一层处的电位高于第二层处的电位0.5伏或更小。 电压施加单元被布置成通过施加跨越第一层和第二层的电位差使单元切换到第二电阻状态,使得第二层处的电位高于第一层的电位0.5伏或更小。 在电阻状态之间切换时的电流小于10μA。 器件的存储单元可以在电阻状态之间切换,并且电阻状态是非易失性的。