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    • 5. 发明授权
    • Non-volatile memory device
    • 非易失性存储器件
    • US08526225B2
    • 2013-09-03
    • US12596721
    • 2008-04-30
    • Ludovic GouxJudit G. Lisoni ReyesThomas GilleDirk J. C. C. M. Wouters
    • Ludovic GouxJudit G. Lisoni ReyesThomas GilleDirk J. C. C. M. Wouters
    • G11C11/00
    • H01L45/1683G11C13/0009G11C13/02G11C2213/15G11C2213/56H01L45/04H01L45/1233H01L45/1253H01L45/144
    • A memory device comprises an array of memory cells for storing data and a voltage application unit for applying voltages to the cells for writing data to the cells. Each memory cell has a first layer comprising copper in contact with a second layer comprising a chalcogenide material. The voltage application unit is arranged to write data by switching each cell between a first resistance state and a second, lower, resistance state. The voltage application unit is arranged to switch a cell to the first resistance state by applying a potential difference across the first and second layers such that the potential at the first layer is higher than the potential at the second layer by 0.5 volts or less. The voltage application unit is arranged to switch a cell to the second resistance state by applying a potential difference across the first and second layers such that the potential at the second layer is higher than the potential at the first layer by 0.5 volts or less. The current flow when switching between resistance states is less than 10 μA. The memory cells of the device can be toggled between the resistance states, and the resistance states are non-volatile.
    • 存储器件包括用于存储数据的存储器单元阵列和用于向单元施加电压以将数据写入单元的电压施加单元。 每个存储单元具有包含与包含硫族化物材料的第二层接触的铜的第一层。 电压施加单元被布置成通过在第一电阻状态和第二,较低电阻状态之间切换每个单元来写入数据。 电压施加单元被布置成通过在第一层和第二层之间施加电位差来将单元切换到第一电阻状态,使得第一层处的电位高于第二层处的电位0.5伏或更小。 电压施加单元被布置成通过施加跨越第一层和第二层的电位差使单元切换到第二电阻状态,使得第二层处的电位高于第一层的电位0.5伏或更小。 在电阻状态之间切换时的电流小于10μA。 器件的存储单元可以在电阻状态之间切换,并且电阻状态是非易失性的。
    • 9. 发明申请
    • Resistive Memory Element and Related Control Method
    • 电阻记忆元件及相关控制方法
    • US20120228578A1
    • 2012-09-13
    • US13416902
    • 2012-03-09
    • Ludovic Goux
    • Ludovic Goux
    • H01L45/00H01L21/8239
    • G11C13/0007G11C13/0011G11C13/003G11C13/0069G11C2213/77H01L27/2472H01L45/04H01L45/1233H01L45/1273H01L45/146H01L45/147
    • Resistive memory elements and arrays of resistive memory elements are disclosed. In one embodiment, a resistive memory element includes a top electrode element lying in a plane parallel to a reference plane, and having, in perpendicular projection on the reference plane, a top electrode projection; a bottom electrode element lying in a plane parallel to the reference plane, and having, in perpendicular projection on the reference plane, a bottom electrode projection; and an active layer with changeable resistivity interposed between the top electrode element and the bottom electrode element. The top electrode projection and the bottom electrode projection overlap in an overlapping region that comprises a corner of the top electrode projection and/or a corner of the bottom electrode projection, and an area of the overlapping region constitutes less than 10% of a total projected area of the top electrode element and the bottom electrode element on the reference plane.
    • 公开了电阻式存储器元件和电阻存储器元件阵列。 在一个实施例中,电阻式存储器元件包括位于平行于参考平面的平面中的顶部电极元件,并且在参考平面上的垂直投影中具有顶部电极突起; 位于与参考平面平行的平面中的底部电极元件,并且在参考平面上具有垂直投影的底部电极突起; 以及插入在所述顶部电极元件和所述底部电极元件之间的具有可变电阻的有源层。 顶部电极突起和底部电极突起在包括顶部电极突起的角部和/或底部电极突起的角部的重叠区域中重叠,并且重叠区域的面积构成小于总投影的10% 上电极元件和底电极元件的面积。