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    • 5. 发明授权
    • Methods and systems for evaluating checker quality of a verification environment
    • 用于评估验证环境的检验质量的方法和系统
    • US08359559B2
    • 2013-01-22
    • US12977376
    • 2010-12-23
    • Kai YangMichael LyonsKuo-Ching LinWei-Ting TuChih-Wen ChangTein-Chun Wei
    • Kai YangMichael LyonsKuo-Ching LinWei-Ting TuChih-Wen ChangTein-Chun Wei
    • G06F17/50G06F9/455
    • G06F17/5022G06F17/504G06F2217/10
    • Methods and systems for evaluating checker quality of a verification environment are provided. In some embodiments, an overall sensitivity for the verification environment and an individual sensitivity for a respective checker are calculated. The overall sensitivity is a probability that a plurality of problematic design behaviors, which are propagated to a checker system including at least one checker, can be detected by the verification environment. The individual sensitivity is a probability that a plurality of problematic design behaviors, which are propagated to at least one specific probe among a plurality of probes of a design, can be detected by the checker corresponding to the specific probe. The overall checker sensitivity numbers can show the robustness of the check system. The individual checker sensitivity can guide the user which individual checker or checkers to improve.
    • 提供了用于评估验证环境的检查器质量的方法和系统。 在一些实施例中,计算验证环境的总体灵敏度和相应检查器的个体灵敏度。 总体灵敏度是通过验证环境可以检测到传播到包括至少一个检验器的检查系统的多个有问题的设计行为的概率。 个体敏感度是通过与特定探针对应的检查器可以检测到在设计的多个探针中传播到至少一个特定探针的多个有问题的设计行为的概率。 整体检查灵敏度数字可以显示检查系统的稳健性。 单独的检查灵敏度可以指导用户哪个单独的检查器或检查器改进。
    • 8. 发明申请
    • Cutting machine
    • 切割机
    • US20090223070A1
    • 2009-09-10
    • US12379996
    • 2009-03-05
    • Kai YangKenji Abe
    • Kai YangKenji Abe
    • B27B9/00
    • B23D59/006
    • It is, accordingly, an object of the present invention to provide a technique which is effective in preventing chips generated during cutting operation on a workpiece from being accumulated in a region ahead in a cutting direction. A representative cutting machine includes a motor, a blade, a body housing having a first region that houses the motor and a second region that covers the blade and projects forward of a front surface of the first region, a base, an angular plate, an outlet formed in the body housing, an opening and a blocking part. The blocking part prevents the air discharged from the outlet from flowing out laterally with respect to the moving direction of the base through a clearance between a front end of the second region and the one end of the angular plate and thereby helps the air discharged from the outlet flow into the opening.
    • 因此,本发明的目的是提供一种技术,其有效地防止在切割操作期间在工件上产生的碎屑积聚在切割方向上的区域中。 代表性的切割机包括马达,叶片,具有容纳马达的第一区域的主体壳体和覆盖叶片并在第一区域的前表面向前突出的第二区域,基座,角板, 出口形成在主体壳体中,一个开口和一个阻挡部分。 阻挡部防止从出口排出的空气相对于基座的移动方向横向流过第二区域的前端和角板的一端之间的间隙,从而有助于从 出口流入开口。
    • 10. 发明申请
    • Measurement of Thickness Profile and Elastic Modulus Profile of a Polishing Pad
    • 抛光垫的厚度剖面和弹性模量曲线的测量
    • US20060196283A1
    • 2006-09-07
    • US11306766
    • 2006-01-10
    • Kai YangSheng-Hun JengYu-Ting Lin
    • Kai YangSheng-Hun JengYu-Ting Lin
    • G01N19/00B24B49/00
    • G01B21/08B24B37/013B24B49/00G01N2203/0075
    • An apparatus for measuring the thickness profile and elastic modulus profile of a polishing pad comprise an eddy current sensor and a mechanism to press the eddy current sensor against the polishing pad. The pad thickness is given by the signal of the eddy current sensor. The elastic modulus of the polishing pad is extracted from measurements at different forces applied to the eddy current sensor. The thickness profile and elastic modulus profile of the polishing pad are obtained by scanning the measurement across the whole polishing pad or along a diameter of the polishing pad. The pad thickness profile is used to adjust pad conditioning recipe so that more pad materials is eroded away at thicker area of the pad. By employing the apparatus of present invention, the thickness uniformity of a polishing pad can be better maintained, resulting in longer pad lifetime and better CMP removal rate uniformity.
    • 用于测量抛光垫的厚度分布和弹性模量分布的装置包括涡流传感器和将涡流传感器压靠抛光垫的机构。 焊盘厚度由涡流传感器的信号给出。 抛光垫的弹性模量从施加到涡流传感器的不同力的测量中提取出来。 抛光垫的厚度分布和弹性模量分布是通过扫描整个抛光垫或沿研磨垫的直径进行测量而得到的。 衬垫厚度轮廓用于调整衬垫调节配方,使得更多的衬垫材料在衬垫的较厚区域被侵蚀掉。 通过采用本发明的装置,可以更好地保持抛光垫的厚度均匀性,从而延长焊垫寿命和更好的CMP去除速率均匀性。