专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US4627160A Method for removal of carbonaceous residues from ceramic structures having internal metallurgy 失效
标题翻译：从具有内部冶金的陶瓷结构中去除碳质残渣的方法
公开(公告)号：US4627160A
公开(公告)日：1986-12-09
申请号：US761713
申请日：1985-08-02
申请人： Lester W. Herron , Ananda H. Kumar , Raj N. Master , Robert W. Nufer
发明人： Lester W. Herron , Ananda H. Kumar , Raj N. Master , Robert W. Nufer
IPC分类号： C03C8/16 , B01J23/00 , B01J31/00 , C03C10/08 , C03C10/12 , C04B35/638 , C04B35/64 , H01L21/48 , H05K1/03 , H05K3/46
CPC分类号： H01L21/4857 , C04B35/638 , C04B35/64 , H01L21/4807 , H05K1/0306 , Y10T29/49126 , Y10T29/49163 , Y10T29/49165
摘要： A process for removing organic materials from an article formed from a slurry of glass and/or ceramic particles, resin binder, and a solvent for the resin binder, the process involving including in the slurry a particulate catalyst selected from the group consisting of Cu, Cu.sub.2 O, CuO, Cu.sub.2 SO.sub.4, CuCl.sub.2, Cu organometallic compounds, and mixtures thereof, the catalyst promoting a rapid and complete removal from the shaped article when heated of the organic materials of the slurry.
摘要翻译：一种从由玻璃和/或陶瓷颗粒，树脂粘合剂和树脂粘合剂的溶剂形成的制品中除去有机材料的方法，该方法包括在浆料中包含选自Cu， Cu 2 O，CuO，Cu 2 SO 4，CuCl 2，Cu有机金属化合物及其混合物，催化剂在浆料的有机材料加热时促进快速且完全地从成型制品中除去。

2. 发明授权

US4786674A Diffusion isolation layer for maskless cladding process 失效
标题翻译：用于无掩模包层工艺的扩散隔离层
公开(公告)号：US4786674A
公开(公告)日：1988-11-22
申请号：US817634
申请日：1986-01-10
申请人： Lester W. Herron , Ananda H. Kumar , Robert W. Nufer
发明人： Lester W. Herron , Ananda H. Kumar , Robert W. Nufer
IPC分类号： C23C10/04 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/24 , C08K3/36 , C08K3/22
CPC分类号： H01L21/4846 , C23C10/04 , H05K3/246 , H05K1/0306 , H05K1/092 , H05K2201/0317 , H05K2203/025 , H05K2203/0743 , H05K3/048
摘要： In a maskless metal cladding process for plating an existing metallurgical pattern, a protective layer is utilized to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal overlay. The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.
摘要翻译：在用于电镀现有冶金图案的无掩模金属包覆工艺中，使用保护层来隔离不期望附加金属镀覆的下方冶金的那些区域。该层用作隔离屏障，以保护底层冶金免受重金属覆层的沉积和随后的扩散。保护层的组成选择为具有足够的机械完整性的组合物，以承受工艺处理并支撑金覆层并具有耐热金属溅射和扩散过程中达到的高温的热完整性。隔离阻挡层具有作为粘合剂的有机组分，其在金属沉积之前的加热步骤或扩散循环期间热分解，不留下含碳残留物，而留下惰性的无机支架以支撑金属。在金属扩散之后，剩余的无机隔离层，覆盖的金属和残留在非图案化衬底上的任何未扩散的金属都可以通过诸如超声波的标准技术容易地去除。

3. 发明授权

US4582722A Diffusion isolation layer for maskless cladding process 失效
标题翻译：用于无掩模包层工艺的扩散隔离层
公开(公告)号：US4582722A
公开(公告)日：1986-04-15
申请号：US666954
申请日：1984-10-30
申请人： Lester W. Herron , Ananda H. Kumar , Robert W. Nufer
发明人： Lester W. Herron , Ananda H. Kumar , Robert W. Nufer
IPC分类号： H01L23/12 , C23C10/04 , H01L21/388 , H01L21/48 , H05K1/03 , H05K1/09 , H05K3/24 , B05D3/12 , B05D5/12 , C23C14/00
CPC分类号： H01L21/4846 , C23C10/04 , H05K3/246 , H01L2924/0002 , H05K1/0306 , H05K1/092 , H05K2201/0317 , H05K2203/025 , H05K2203/0743 , H05K3/048
摘要： Disclosed is a maskless metal cladding process for plating an existing metallurgical pattern by utilizing a protective layer to isolate those areas of underlying metallurgy on which additional metal plating is not desired. The layer acts as an isolation barrier to protect the underlying metallurgy from deposition and subsequent diffusion of the heavy metal (e.g., gold) overlay. The composition of the protective layer is selected as one having sufficient mechanical integrity to withstand process handling and support the gold overlay and having the thermal integrity to withstand the high temperatures reached during metal sputtering and diffusion processes. The isolation barrier layer has an organic component as a binder which thermally decomposes, either in a heating step before metal deposition or during the diffusion cycle, leaving no carbonaceous residue but leaving an inert, inorganic standoff to support the metal. After diffusion of the metal, the remaining inorganic standoff layer, overlying metal and any undiffused metal remaining on the non-patterned substrate is easily removed by a standard technique, such as ultrasonics.
摘要翻译：公开了一种无掩模金属包覆工艺，用于通过利用保护层来电镀现有的冶金图案，以隔离不期望附加金属镀覆的下方冶金的那些区域。该层用作隔离屏障，以保护底层冶金不沉积和随后扩散重金属（例如，金）覆盖层。保护层的组成选择为具有足够的机械完整性的组合物，以承受工艺处理并支撑金覆层并具有耐热金属溅射和扩散过程中达到的高温的热完整性。隔离阻挡层具有作为粘合剂的有机组分，其在金属沉积之前的加热步骤或扩散循环期间热分解，不留下含碳残留物，而留下惰性的无机支架以支撑金属。在金属扩散之后，剩余的无机隔离层，覆盖的金属和残留在非图案化衬底上的任何未扩散的金属都可以通过诸如超声波的标准技术容易地去除。

4. 发明授权

US5139975A Sintering arrangement for enhancing removal of carbon from ceramic substrate laminates 失效
标题翻译：用于增强从陶瓷基板层压板去除碳的烧结布置
公开(公告)号：US5139975A
公开(公告)日：1992-08-18
申请号：US757782
申请日：1991-09-11
申请人： Lester W. Herron , Sarah H. Knickerbocker , Ananda H. Kumar , Govindarajan Natarajan , Srinivasa S. N. Reddy
发明人： Lester W. Herron , Sarah H. Knickerbocker , Ananda H. Kumar , Govindarajan Natarajan , Srinivasa S. N. Reddy
IPC分类号： B32B18/00 , C04B35/634 , C04B35/638 , H01L21/48
CPC分类号： C04B35/638 , B32B18/00 , C04B35/634 , H01L21/4857 , C04B2235/6562 , C04B2235/658 , C04B2237/341 , C04B2237/343 , C04B2237/345 , C04B2237/348 , C04B2237/363 , C04B2237/565 , Y10S428/901 , Y10T428/24322
摘要： There is disclosed a sintering arrangement for enhancing the removal of carbon from multilayer ceramic substrate laminate during the sintering thereof. A multilayer ceramic substrate laminate having metallic lines and vias is provided with a reducible metal oxide in close proximity to the substrate laminate. The multilayer ceramic substrate laminate contains a polymeric binder which upon heating depolymerizes into carbon. The substrate laminate is sintered in an atmosphere which is reducing with respect to the reducible metal oxide and which is oxidizing with respect to the carbon.
摘要翻译：公开了一种烧结装置，用于在烧结期间增强从多层陶瓷衬底层压板去除碳。具有金属线和通孔的多层陶瓷基板层叠体设置有紧邻基板层叠体的可还原金属氧化物。多层陶瓷基板层叠体包含聚合物粘合剂，其在加热时解聚成碳。基板层压体在相对于可还原金属氧化物还原并相对于碳氧化的气氛中烧结。

5. 发明授权

US09466758B2 Composite substrates of silicon and ceramic 有权
公开(公告)号：US09466758B2
公开(公告)日：2016-10-11
申请号：US14957588
申请日：2015-12-02
申请人： Ananda H. Kumar , Tue Nguyen
发明人： Ananda H. Kumar , Tue Nguyen
IPC分类号： H01L33/00 , H01L31/18 , H01L21/762 , H01L31/0224
CPC分类号： H01L33/007 , H01L21/76254 , H01L31/022425 , H01L31/1804
摘要： Composite substrates include a single crystal silicon layer disposed on a ceramic layer, including a transparent glass layer. Combination of single crystal devices and non-single crystal devices can be fabricated on a ceramic substrate.

6. 发明授权

US08808800B2 Methods of forming three-dimensional structures having reduced stress and/or curvature 有权
标题翻译：形成具有减小的应力和/或曲率的三维结构的方法
公开(公告)号：US08808800B2
公开(公告)日：2014-08-19
申请号：US13409950
申请日：2012-03-01
申请人： Ananda H. Kumar , Jorge Sotelo Albarran , Adam L. Cohen , Kieun Kim , Michael S. Lockard , Uri Frodis , Dennis R. Smalley
发明人： Ananda H. Kumar , Jorge Sotelo Albarran , Adam L. Cohen , Kieun Kim , Michael S. Lockard , Uri Frodis , Dennis R. Smalley
IPC分类号： B05D3/00
CPC分类号： B81C1/00666 , C25D5/022
摘要： Electrochemical fabrication processes and apparatus for producing single layer or multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers includes operations for reducing stress and/or curvature distortion when the structure is released from a sacrificial material which surrounded it during formation and possibly when released from a substrate on which it was formed. Six primary groups of embodiments are presented which are divide into eleven primary embodiments. Some embodiments attempt to remove stress to minimize distortion while others attempt to balance stress to minimize distortion.
摘要翻译：用于生产单层或多层结构的电化学制造方法和装置，其中每个层包括至少两种材料的沉积，并且其中形成至少一些层包括当结构被释放时减少应力和/或曲率失真的操作牺牲材料，其在形成期间包围它，并且可能当从其形成的基底释放时。呈现了六个主要实施例的组，它们分为十一个主要实施例。一些实施例尝试去除应力以最小化失真，而另一些实施例试图平衡应力以最小化失真。

7. 发明申请

US20110155580A1 Method of Electrochemically Fabricating Multilayer Structures Having Improved Interlayer Adhesion 审中-公开
标题翻译：电化学制造具有改善的层间粘附性的多层结构的方法
公开(公告)号：US20110155580A1
公开(公告)日：2011-06-30
申请号：US13021939
申请日：2011-02-07
申请人： Gang Zhang , Adam L. Cohen , Michael S. Lockard , Ananda H. Kumar , Ezekiel J. J. Kruglick , Kieun Kim
发明人： Gang Zhang , Adam L. Cohen , Michael S. Lockard , Ananda H. Kumar , Ezekiel J. J. Kruglick , Kieun Kim
IPC分类号： C25D5/02 , C25D5/50
CPC分类号： C25D5/50 , C25D1/003 , C25D5/022 , C25D5/10 , C25D5/12 , C25D5/14 , C25D5/18 , C25D5/34 , C25D5/40 , C25D5/48 , H01L21/2885 , H01L21/76879 , H05K3/241 , H05K3/243
摘要： Multi-layer microscale or mesoscale structures are fabricated with adhered layers (e.g. layers that are bonded together upon deposition of successive layers to previous layers) and are then subjected to a heat treatment operation that enhances the interlayer adhesion significantly. The heat treatment operation is believed to result in diffusion of material across the layer boundaries and associated enhancement in adhesion (i.e. diffusion bonding). Interlayer adhesion and maybe intra-layer cohesion may be enhanced by heat treating in the presence of a reducing atmosphere that may help remove weaker oxides from surfaces or even from internal portions of layers.
摘要翻译：多层微尺度或中尺度结构用粘附层（例如在连续层沉积到先前层上时结合在一起的层）制造，然后进行显着增强层间粘合的热处理操作。认为热处理操作导致材料在层边界上的扩散，并且附着力增强（即扩散粘合）。可以通过在有助于从表面甚至从内部部分去除较弱的氧化物的还原气氛的热处理来增强层间粘附和可能的层内内聚力。

8. 发明申请

US20100119917A1 Seal compositions, methods, and structures for planar solid oxide fuel cells 有权
标题翻译：平面固体氧化物燃料电池的密封组合物，方法和结构
公开(公告)号：US20100119917A1
公开(公告)日：2010-05-13
申请号：US12292078
申请日：2008-11-12
申请人： Ananda H. Kumar , Dien Nguyen , Martin Janousek , Tad Armstrong
发明人： Ananda H. Kumar , Dien Nguyen , Martin Janousek , Tad Armstrong
IPC分类号： C03C8/00 , B28B1/00 , H01M2/08
CPC分类号： H01M8/0286 , C03C8/02 , C03C8/24 , H01M8/0282 , H01M8/1246 , H01M2008/1293 , Y02E60/50
摘要： A seal composition includes a first alkaline earth metal oxide, a second alkaline earth metal oxide which is different from the first alkaline earth metal oxide, aluminum oxide, and silica in an amount such that molar percent of silica in the composition is at least five molar percent greater than two times a combined molar percent of the first alkaline earth metal oxide and the second alkaline earth metal oxide. The composition is substantially free of boron oxide and phosphorus oxide. The seal composition forms a glass ceramic seal which includes silica containing glass cores located in a crystalline matrix comprising barium aluminosilicate, and calcium aluminosilicate crystals located in the glass cores.
摘要翻译：密封组合物包括第一碱土金属氧化物，与第一碱土金属氧化物不同的第二碱土金属氧化物，氧化铝和二氧化硅，其量使得组合物中二氧化硅的摩尔百分比为至少五摩尔百分比大于第一碱土金属氧化物和第二碱土金属氧化物的组合摩尔百分数的两倍。该组合物基本上不含氧化硼和氧化磷。密封组合物形成玻璃陶瓷密封件，其包括位于包括硅铝酸钡的晶体基质中的含二氧化硅的玻璃核心和位于玻璃核心中的硅铝酸钙晶体。

9. 发明授权

US07670688B2 Erosion-resistant components for plasma process chambers 有权
标题翻译：等离子体处理室的耐腐蚀组件
公开(公告)号：US07670688B2
公开(公告)日：2010-03-02
申请号：US09892212
申请日：2001-06-25
申请人： Tony S. Kaushal , You Wang , Ananda H. Kumar
发明人： Tony S. Kaushal , You Wang , Ananda H. Kumar
IPC分类号： B32B15/04 , B32B9/00 , C23C16/00
CPC分类号： H01J37/32467 , H01J37/32477 , Y10T428/12576 , Y10T428/1259 , Y10T428/12736
摘要： An erosion-resistant article for use as a component in plasma process chamber. The erosion-resistant article comprises a support and an oxide coating comprising yttrium, which is disposed over the support. The support and the oxide coating preferably have material compositions that differ from one another in coefficient of thermal expansion by no more than 5×10−6/K. Preferred oxide coating compositions include yttria and yttrium aluminum garnet. Preferred supports include alumina supports and aluminum-silicon carbide supports.
摘要翻译：用作等离子体处理室中的组分的耐腐蚀制品。防侵蚀制品包括载体和包含钇的氧化物涂层，其被设置在载体上。载体和氧化物涂层优选具有不同于热膨胀系数不超过5×10-6 / K的材料组成。优选的氧化物涂层组合物包括氧化钇和钇铝石榴石。优选的载体包括氧化铝载体和铝 - 碳化硅载体。

10. 发明授权

US07273812B2 Microprobe tips and methods for making 有权
标题翻译：微型笔尖和制作方法
公开(公告)号：US07273812B2
公开(公告)日：2007-09-25
申请号：US11178145
申请日：2005-07-07
申请人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
发明人： Kieun Kim , Adam L. Cohen , Willa M. Larsen , Richard T. Chen , Ananda H. Kumar , Ezekiel J. J. Kruglick , Vacit Arat , Gang Zhang , Michael S. Lockard , Christopher A. Bang
IPC分类号： H01L21/44
CPC分类号： C25D1/003 , G01R3/00 , Y10T29/49222
摘要： Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include a coating material. In some embodiments, the tips are formed before the main portions of the probes and the tips are formed in proximity to or in contact with a temporary substrate. Probe tip patterning may occur in a variety of different ways, including, for example, via molding in patterned holes that have been isotropically or anisotropically etched silicon, via molding in voids formed in exposed photoresist, via molding in voids in a sacrificial material that have formed as a result of the sacrificial material mushrooming over carefully sized and located regions of dielectric material, via isotropic etching of the tip material around carefully sized and placed etching shields, via hot pressing, and the like.
摘要翻译：本发明的实施例涉及形成具有各种构造的微探针尖元件。在一些实施例中，尖端由与探针本身相同的建筑材料形成，而在其它实施例中，尖端可以由不同的材料形成和/或可以包括涂层材料。在一些实施例中，尖端在探针的主要部分之前形成，并且尖端形成在临时衬底附近或与临时衬底接触。探针尖端图案化可以以各种不同的方式发生，包括例如通过在各向异性或各向异性地蚀刻硅的图案化孔中模制，通过在曝光的光致抗蚀剂中形成的空隙中模制，通过在牺牲材料中的空隙中模制，由于牺牲材料通过电介质材料的细小尺寸和定位的区域，经由热压等等仔细地尺寸和放置的蚀刻屏蔽部分上的尖端材料的各向同性蚀刻而形成。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式