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    • 2. 发明授权
    • Desiccant in a MEMS device
    • 干燥剂在MEMS器件中
    • US08040587B2
    • 2011-10-18
    • US11750279
    • 2007-05-17
    • Lauren Palmateer
    • Lauren Palmateer
    • G02B26/00G02F1/29
    • G02B26/001B81B7/0038B81B2201/047B81B2203/053B81C2203/019G02B26/0833
    • A package structure and method for packaging a MEMS device is described. In one embodiment, the MEMS base device can include a substrate having a MEMS device formed thereon, a backplate, an exposed or activated desiccant disposed between the backplate and the transparent substrate, and a cover at least partially encapsulating said desiccant. In another embodiment, a MEMS display device can be manufactured by contacting the substrate and/or backplate with a cover which at least partially encapsulates a desiccant, joining the backplate and the substrate to form a package, and exposing or activating the desiccant.
    • 描述了用于封装MEMS器件的封装结构和方法。 在一个实施例中,MEMS基底器件可以包括其上形成有MEMS器件的衬底,背板,设置在背板和透明衬底之间的暴露或激活的干燥剂,以及至少部分地封装所述干燥剂的盖。 在另一个实施例中,可以通过使衬底和/或背板接触至少部分地包封干燥剂,连接背板和衬底以形成封装以及暴露或激活干燥剂的盖来制造MEMS显示装置。
    • 3. 发明授权
    • Optical interference display panel and manufacturing method thereof
    • 光干涉显示面板及其制造方法
    • US07532385B2
    • 2009-05-12
    • US10807128
    • 2004-03-24
    • Wen-Jian LinBrian ArbuckleBrian GallyPhilip FloydLauren Palmateer
    • Wen-Jian LinBrian ArbuckleBrian GallyPhilip FloydLauren Palmateer
    • G02B26/00H01L21/00
    • G02B26/001B81B7/0012B81B2201/045
    • A first electrode and a sacrificial layer are sequentially formed on a substrate, and then first openings for forming supports inside are formed in the first electrode and the sacrificial layer. The supports are formed in the first openings, and then a second electrode is formed on the sacrificial layer and the supports, thus forming a micro electro mechanical system structure. Afterward, an adhesive is used to adhere and fix a protection structure to the substrate for forming a chamber to enclose the micro electro mechanical system structure, and at least one second opening is preserved on sidewalls of the chamber. A release etch process is subsequently employed to remove the sacrificial layer through the second opening in order to form cavities in an optical interference reflection structure. Finally, the second opening is closed to seal the optical interference reflection structure between the substrate and the protection structure.
    • 第一电极和牺牲层依次形成在基板上,然后在第一电极和牺牲层中形成用于形成支撑件的第一开口。 支撑件形成在第一开口中,然后在牺牲层和支撑件上形成第二电极,从而形成微机电系统结构。 之后,使用粘合剂将保护结构粘附并固定到基底上以形成腔室以包围微机电系统结构,并且至少一个第二开口保留在腔室的侧壁上。 随后采用释放蚀刻工艺以通过第二开口去除牺牲层,以便在光学干涉反射结构中形成空腔。 最后,关闭第二个开口以密封衬底和保护结构之间的光学干涉反射结构。
    • 4. 发明申请
    • SYSTEM AND METHOD OF TESTING HUMIDITY IN A SEALED MEMS DEVICE
    • 密封MEMS器件测试湿度的系统和方法
    • US20080115596A1
    • 2008-05-22
    • US12021218
    • 2008-01-28
    • Brian GallyLauren PalmateerManish KothariWilliams Cummings
    • Brian GallyLauren PalmateerManish KothariWilliams Cummings
    • G01G9/00
    • B81C99/0045G01M3/002G01M3/02G01M3/186G01M3/229G02B26/001Y10T29/49002
    • One embodiment provides a method of testing humidity. The method includes measuring i) a first weight of a first device which encloses a plurality of interferometric modulators and ii) a second weight of a second device which encloses a plurality of interferometric modulators, wherein the first and second devices contain a different amount of water vapor. The method further includes comparing the weights of the first and second devices and determining a relative humidity value or a degree of the relative humidity inside one of the two devices based at least in part upon the weight comparison. In one embodiment, the relative humidity value or degree is determined considering at least one of the following parameters: i) temperature-humidity combination inside at least one of the devices, ii) the thickness and width of a seal of the at least one device, iii) adhesive permeability of a component of the at least one device, iv) a desiccant capacity inside the at least one device and v) a device size.
    • 一个实施例提供了测试湿度的方法。 该方法包括测量i)包围多个干涉式调制器的第一装置的第一权重和ii)封闭多个干涉式调制器的第二装置的第二权重,其中第一和第二装置含有不同量的水 汽。 该方法还包括比较第一和第二装置的重量,并且至少部分地基于重量比较来确定两个装置之一内的相对湿度值或相对湿度的程度。 在一个实施例中,考虑以下参数中的至少一个来确定相对湿度值或度数:i)至少一个装置内的温度 - 湿度组合,ii)至少一个装置的密封件的厚度和宽度 ,iii)所述至少一个装置的部件的粘合剂渗透性,iv)所述至少一个装置内的干燥剂容量,以及v)装置尺寸。