会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 2. 发明授权
    • Laser ablation apparatus and method
    • 激光消融装置及方法
    • US5491319A
    • 1996-02-13
    • US359228
    • 1994-12-19
    • Laertis EconomikosRobert HannonRichard P. Surprenant
    • Laertis EconomikosRobert HannonRichard P. Surprenant
    • B23K26/06
    • B23K26/066
    • A laser ablation apparatus and method removes undesired portions of a workpiece. An industrial laser generates a beam of optical energy and directs the beam at the workpiece. A mechanism in the path of the beam for shapes the cross-section of the beam and includes first and second linear actuators on opposite sides of the beam path. Each of the actuators includes a plurality of linear members, with each linear member being adjacent to and in contact with another linear member, and means for individually inserting and retracting each of said members into and out of said beam path a desired distance to thereby shape the beam so as to ablate only undesired portions of the workpiece.
    • 激光烧蚀装置和方法去除工件的不期望的部分。 工业激光产生光束并将光束引导到工件处。 梁的路径中的机构,用于使梁的横截面成形,并且包括在光束路径的相对侧上的第一和第二线性致动器。 每个致动器包括多个线性构件,每个线性构件与另一直线构件相邻并与其接触;以及用于将每个所述构件单独地插入和退出所述梁路径并使其离开所需距离的装置,从而形成 梁,以便仅烧蚀工件的不期望的部分。
    • 6. 发明授权
    • Method for quantifying the manufacturing complexity of electrical designs
    • 量化电气设计制造复杂度的方法
    • US08645875B2
    • 2014-02-04
    • US12914367
    • 2010-10-28
    • Michael S. CranmerRichard P. Surprenant
    • Michael S. CranmerRichard P. Surprenant
    • G06F17/50G06K9/00
    • G01R31/2848G06T7/0006G06T2207/30141
    • A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.
    • 用于量化电气设计的制造复杂性的方法和系统随机地将模拟缺陷放置在表示电气接线设计的图像数据上。 确定了没有模拟缺陷的图像数据中不同特征的数量和具有模拟缺陷的图像数据中不同特征的数量,并且得到两者之间的差异。 差值用作短路电位的指示或在电气布线设计中可能发生布线短路的概率。 可以重复对图像数据中的缺陷的模拟,并且可以使用来自每个模拟或运行的差值来获得设计的统计平均值或代表性的短路电位或概率。
    • 7. 发明授权
    • Seed metal delete process for thin film repair solutions using direct UV laser
    • 种子金属删除工艺用于使用直接UV激光的薄膜修复解决方案
    • US06235544B1
    • 2001-05-22
    • US09295131
    • 1999-04-20
    • Peter A. FranklinCharles J. HendricksRichard P. SurprenantStephen J. Tirch, IIIThomas A. WassickJames P. Wood
    • Peter A. FranklinCharles J. HendricksRichard P. SurprenantStephen J. Tirch, IIIThomas A. WassickJames P. Wood
    • G01R3126
    • H01L21/485
    • A multilayer thin film structure (MLTF) is provided having no extraneous via-pad connection strap plated metallurgy for defective vias needing removal. The method for making or repairing the MLTF comprises determining interconnection defects in the MLTF at a thin film layer adjacent to the top metal layer of the structure, applying a top surface dielectric layer and forming vias in the layer, applying a metal conducting layer and removing the metal conducting layer for via-pad connection straps of defective vias and at the intersection of XY lines used in the repair, defining the top surface metallization including a series of orthogonal X conductor repair lines and Y conductor repair lines using a photoresist and lithography and then using a phototool to selectively expose the photoresist to define top surface strap connections needed to repair the interconnections and/or make EC's, and forming the top surface metallization using additive or subtractive metallization techniques.
    • 提供了一种多层薄膜结构(MLTF),其中没有外部通孔焊盘连接带电镀冶金用于需要去除的缺陷通孔。 用于制造或修复MLTF的方法包括:在与该结构的顶部金属层相邻的薄膜层处确定MLTF中的互连缺陷,施加顶表面介电层并在该层中形成通孔,施加金属导电层并除去 用于通孔焊盘连接带的金属导电层和用于修复的XY线的相交处,限定包括一系列正交X导体修复线的顶表面金属化和使用光致抗蚀剂和光刻的Y导体修复线, 然后使用光学工具选择性地暴露光致抗蚀剂以限定修复互连和/或制造EC所需的顶表面带连接,以及使用添加或减色金属化技术形成顶表面金属化。
    • 9. 发明申请
    • METHOD FOR QUANTIFYING THE MANUFACTURING COMPLEXITY OF ELECTRICAL DESIGNS
    • 用于定量电气设计的制造复杂度的方法
    • US20110038525A1
    • 2011-02-17
    • US12914367
    • 2010-10-28
    • Michael S. CranmerRichard P. Surprenant
    • Michael S. CranmerRichard P. Surprenant
    • G06K9/00
    • G01R31/2848G06T7/0006G06T2207/30141
    • A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.
    • 用于量化电气设计的制造复杂性的方法和系统随机地将模拟缺陷放置在表示电气接线设计的图像数据上。 确定了没有模拟缺陷的图像数据中不同特征的数量和具有模拟缺陷的图像数据中不同特征的数量,并且得到两者之间的差异。 差值用作短路电位的指示或在电气布线设计中可能发生布线短路的概率。 可以重复对图像数据中的缺陷的模拟,并且可以使用来自每个模拟或运行的差值来获得设计的统计平均值或代表性的短路电位或概率。
    • 10. 发明授权
    • Method for quantifying the manufactoring complexity of electrical designs
    • 量化电气设计制造复杂度的方法
    • US07873936B2
    • 2011-01-18
    • US11969495
    • 2008-01-04
    • Michael S. CranmerRichard P. Surprenant
    • Michael S. CranmerRichard P. Surprenant
    • G06F17/50G06K9/00
    • G01R31/2848G06T7/0006G06T2207/30141
    • A method and system for quantifying manufacturing complexity of electrical designs randomly places simulated defects on image data representing electrical wiring design. The number of distinct features in the image data without the simulated defects and the number of distinct features in the image data with the simulated defects are determined and the differences between the two obtained. The difference number is used as an indication of shorting potential or probability that shorts in the wiring may occur in the electrical wiring design. The simulating of the defects in the image data may be repeated and the difference value from each simulation or run may be used to obtain a statistical average or representative shorting potential or probability for the design.
    • 用于量化电气设计的制造复杂性的方法和系统随机地将模拟缺陷放置在表示电气接线设计的图像数据上。 确定了没有模拟缺陷的图像数据中不同特征的数量和具有模拟缺陷的图像数据中不同特征的数量,并且得到两者之间的差异。 差值用作短路电位的指示或在电气布线设计中可能发生布线短路的概率。 可以重复对图像数据中的缺陷的模拟,并且可以使用来自每个模拟或运行的差值来获得设计的统计平均值或代表性的短路电位或概率。