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    • 5. 发明申请
    • Electric power connection part of electromagnetic clutch field coil assembly
    • 电磁离合器励磁线圈组件的电力连接部分
    • US20070017770A1
    • 2007-01-25
    • US11485821
    • 2006-07-13
    • Sung OhSung ChoDae ParkHwa ShinJun-Ho SongUk Lim
    • Sung OhSung ChoDae ParkHwa ShinJun-Ho SongUk Lim
    • F16D27/00
    • H02K5/225H01F17/06H01F27/402H01F2007/062H01R13/6666
    • An electric power connection part of an electromagnetic clutch field coil assembly connected with an electric power connector at a side of a vehicle engine includes a housing assembly connected to the field coil assembly with electric wires, which is extracted therefrom, interposed therebetween; a discharge device for absorbing a surge voltage; and a magnetic field elimination device for eliminating a residual magnetic field are injection molded and combonined within the housing assembly. Accordingly, on the electric power connection part has an advantage in that it is not directly influenced by heat radiated from a field coil assembly so that electric/electronic devices can be prevented from being damaged; since an epoxy applying process for attaching electric/electronic devices such as a discharge device and a magnetic field elimination device is omitted, a manufacturing process is greatly simplified; and the number of components are reduced so that manufacturing process thereby decreasing costs.
    • 与车辆发动机侧的电力连接器连接的电磁离合器励磁线圈组件的电力连接部分包括:与励磁线圈组件连接的外壳组件,电线从中提取; 用于吸收浪涌电压的放电装置; 并且用于消除残余磁场的磁场消除装置被注塑并组合在壳体组件内。 因此,在电力连接部上具有的优点在于,不直接受到来自场线圈组件的热辐射的影响,能够防止电气电子设备的损坏; 由于省略了用于安装诸如放电装置和磁场消除装置的电气/电子装置的环氧树脂施加工艺,所以制造工艺大大简化; 并且减少了部件的数量,从而降低制造工艺成本。
    • 9. 发明申请
    • Printed wiring board and method for manufacturing the same
    • 印刷电路板及其制造方法
    • US20070128855A1
    • 2007-06-07
    • US11634970
    • 2006-12-07
    • Hye ChoJae JoungSung Oh
    • Hye ChoJae JoungSung Oh
    • H01L21/4763
    • H05K3/4664H05K3/125H05K3/4647H05K2201/0154H05K2201/09881H05K2203/013
    • Provided is a method for manufacturing a printed wiring board, which can enhance the peel strength between an insulating layer and a conductive pattern by a two-step process, that is, a semi-hardening and full-hardening of the insulating layer. In the method for manufacturing the printed wiring board having one or more layers of a conductive pattern and an insulating pattern, an insulating pattern is formed on an insulating substrate, and at least one of the insulating substrate and the insulating pattern is semi-hardened. A conductive pattern is formed on the insulating substrate and/or the insulating pattern, thereby providing a stack structure. Then, a thermal treatment is performed on the stack structure to fully harden the semi-hardened insulating substrate and/or insulating pattern, and the conductive pattern is fired.
    • 提供一种印刷电路板的制造方法,其可以通过两步法(即,绝缘层的半硬化和全硬化)来提高绝缘层和导电图案之间的剥离强度。 在制造具有一层或多层导电图案和绝缘图案的印刷线路板的方法中,在绝缘基板上形成绝缘图案,绝缘基板和绝缘图案中的至少一个被半硬化。 在绝缘基板和/或绝缘图案上形成导电图案,从而提供堆叠结构。 然后,对堆叠结构进行热处理,以使半硬化绝缘基板和/或绝缘图案完全硬化,并且导电图案被烧制。