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1. 发明申请

US20110254039A1 LIGHT EMITTING DIODE PACKAGE, LIGHTING APPARATUS HAVING THE SAME, AND METHOD FOR MANUFACTURING LIGHT EMITTING DIODE PACKAGE 审中-公开
标题翻译：发光二极管封装，具有该发光二极管封装的照明装置，以及制造发光二极管封装的方法
公开(公告)号：US20110254039A1
公开(公告)日：2011-10-20
申请号：US13087799
申请日：2011-04-15
申请人： Kyu Sang KIM , Jin Ha Kim , Jae Yoo Jeong , Moo Youn Park , Chung Bae Jeon
发明人： Kyu Sang KIM , Jin Ha Kim , Jae Yoo Jeong , Moo Youn Park , Chung Bae Jeon
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , H01L24/97 , H01L25/0753 , H01L33/44 , H01L33/46 , H01L33/56 , H01L2224/14 , H01L2224/48091 , H01L2224/48465 , H01L2224/49107 , H01L2224/73265 , H01L2224/8592 , H01L2924/12041 , H01L2924/15787 , H01L2924/181 , H01L2933/0091 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A light emitting diode (LED) package, a lighting apparatus including the same, and a method for manufacturing an LED package are disclosed. The LED package includes: a package substrate; an LED chip mounted on the package substrate; and a wavelength conversion layer formed to cover at least a portion of an upper surface of the LED chip when a surface formed by the LED chip when viewed from above is defined as the upper surface of the LED chip, wherein the wavelength conversion layer is formed so as not to exceed the area of the upper surface of the LED chip and includes a flat surface parallel to the upper surface of the LED chip and curved surfaces connecting the corners of the upper surface of the LED chip.
摘要翻译：公开了一种发光二极管（LED）封装，包括该发光二极管（LED）封装的照明装置以及制造LED封装的方法。 LED封装包括：封装基板; 安装在封装基板上的LED芯片; 以及波长转换层，形成为当从上方观察由LED芯片形成的表面时，将LED芯片的上表面的至少一部分覆盖为LED芯片的上表面，形成波长转换层以便不超过LED芯片的上表面的面积，并且包括平行于LED芯片的上表面的平坦表面和连接LED芯片的上表面的拐角的曲面。

2. 发明申请

US20220274807A1 PILE LIFTING DEVICE CAPABLE OF PREVENTING OVERTURNING 有权
公开(公告)号：US20220274807A1
公开(公告)日：2022-09-01
申请号：US17753151
申请日：2020-08-25
申请人： Kyu Sang KIM
发明人： Kyu Sang KIM
IPC分类号： B66C1/66 , E02D13/04 , E02D11/00
摘要： The present disclosure provides a pile lifting device capable of preventing the overturning of piles that can lift piles by chucking the piles using hydraulic pressure and prevent the overturning of the piles even when chucking is released during lifting, thus preventing accidents. According to an embodiment of the present disclosure, the pile lifting device capable of preventing the overturning of piles, which is connected to lifting equipment and used to lift piles, includes a balance plate which is connected to the lifting equipment to maintain a horizontal balance and a pile lifting chuck which is connected to the balance plate directly or via a plurality of first lifting cable and inserted into an upper inner diameter portion of the pile to hold the pile using a hydraulic force.

3. 发明申请

US20210010219A1 HYDRAULIC JACK EXPANSION-TYPE ROTARY PENETRATION DEVICE FOR CIRCULAR PIPE 有权
公开(公告)号：US20210010219A1
公开(公告)日：2021-01-14
申请号：US16500050
申请日：2018-04-05
申请人： Kyu Sang KIM
发明人： Kyu Sang KIM
IPC分类号： E02D7/22 , E02D5/58
摘要： A hydraulic jack expansion-type rotary penetration device for a circular pipe comprises: a rotating head which receives torque from the outside; one or more hollow shafts arranged in series downward along the central axis of the rotating head; shaft-connection socket which interconnect the first hollow shaft which is connected to the rotating head with the remaining adjacent hollow shafts, to thereby transmit the torque of the rotating head; and one or more clamp modules which are installed in the hollow shafts and pressed against the inner surface of the circular pipe by hydraulic pressure generated in the rotating head to thereby generate clamping force.

4. 发明申请

US20120104439A1 SEMICONDUCTOR LIGHT EMITTING DEVICE 有权
标题翻译：半导体发光器件
公开(公告)号：US20120104439A1
公开(公告)日：2012-05-03
申请号：US13173392
申请日：2011-06-30
申请人： Kyu Sang KIM
发明人： Kyu Sang KIM
IPC分类号： H01L33/50
CPC分类号： H01L33/501 , H01L33/08 , H01L33/20 , H01L33/505 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2933/0091 , H01L2924/00014
摘要： A semiconductor light emitting device includes: a light emission structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; and a wavelength conversion layer formed on at least a portion of a light emission surface of the light emission structure, made of a light-transmissive material including phosphor particles, and having a void therein. A semiconductor light emitting device includes: a light emission structure including a first conductive semiconductor layer, an active layer, and a second conductive semiconductor layer; and a wavelength conversion layer formed on at least a portion of a light emission surface of the light emission structure, made of a light-transmissive material including phosphor particles or quantum dots, and having a void therein.
摘要翻译：半导体发光器件包括：发光结构，包括第一导电半导体层，有源层和第二导电半导体层; 以及波长转换层，形成在由包含荧光体颗粒的透光材料制成并且在其中具有空隙的发光结构的发光表面的至少一部分上。半导体发光器件包括：发光结构，包括第一导电半导体层，有源层和第二导电半导体层; 以及波长转换层，其形成在由包含荧光体颗粒或量子点的透光材料制成并且在其中具有空隙的发光结构的发光表面的至少一部分上。

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