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1. 发明申请

US20070017637A1 Inductively coupled plasma processing apparatus 审中-公开
标题翻译：电感耦合等离子体处理装置
公开(公告)号：US20070017637A1
公开(公告)日：2007-01-25
申请号：US11489656
申请日：2006-07-18
申请人： Kyu Lee , Han Kim , Do Kim , Myoung Kim
发明人： Kyu Lee , Han Kim , Do Kim , Myoung Kim
IPC分类号： C23F1/00 , C23C16/00
CPC分类号： H01J37/321
摘要： An inductively coupled plasma processing apparatus is disclosed. The inductively coupled plasma processing apparatus includes a reaction chamber, a substrate holder for forming a plasma space in the reaction chamber and for supporting a processing substrate therein, a shield provided at the lateral side of the substrate holder, a plurality of openings formed below the substrate, and a linear antenna in the lower portion of the reaction chamber to which a high frequency power signal is applied. Thus, the inductively coupled plasma processing apparatus can uniformly distribute the density of the plasma so that a large-sized flat panel display can be implemented.
摘要翻译：公开了一种电感耦合等离子体处理装置。电感耦合等离子体处理装置包括反应室，用于在反应室中形成等离子体空间并用于在其中支撑处理基板的基板保持件，设置在基板保持器的侧面的屏蔽件，基板和在其上施加高频功率信号的反应室下部的线性天线。因此，电感耦合等离子体处理装置可以均匀地分配等离子体的密度，从而可以实现大尺寸的平板显示器。

2. 发明申请

US20060257569A1 Method for in-situ polycrystalline thin film growth 有权
标题翻译：原位多晶薄膜生长方法
公开(公告)号：US20060257569A1
公开(公告)日：2006-11-16
申请号：US11433176
申请日：2006-05-12
申请人： Han Kim , Myoung Kim , Myung Huh , Seok Jeong , Hee Kang
发明人： Han Kim , Myoung Kim , Myung Huh , Seok Jeong , Hee Kang
IPC分类号： C23C16/00
CPC分类号： C23C16/24 , C23C16/44
摘要： A method for in-situ polycrystalline thin film growth is provided. A catalyst enhanced chemical vapor deposition (CECVD) apparatus is used to grow the polycrystalline silicon thin film. No subsequent annealing or dehydrogenating process is needed. The method comprises exhausting a chamber to form a vacuum chamber, and then purging vacuum chamber and introducing a catalyst. A substrate is then placed in the vacuum chamber and reaction gas is injected into the chamber. The reaction gas reacts with the catalyst in the chamber to grow a polycrystalline thin film on the substrate. The inventive method reduces processing time and production cost and can be used to fabricate larger devices due to the elimination of bulky annealing equipment.
摘要翻译：提供了一种原位多晶薄膜生长的方法。使用催化剂增强化学气相沉积（CECVD）装置来生长多晶硅薄膜。不需要随后的退火或脱氢过程。该方法包括排空室以形成真空室，然后净化真空室并引入催化剂。然后将基板放置在真空室中，并将反应气体注入室中。反应气体与室中的催化剂反应，以在衬底上生长多晶薄膜。本发明的方法减少了处理时间和生产成本，并且由于消除了大型退火设备而可用于制造更大的装置。

3. 发明申请

US20070128861A1 CVD apparatus for depositing polysilicon 审中-公开
标题翻译：用于沉积多晶硅的CVD装置
公开(公告)号：US20070128861A1
公开(公告)日：2007-06-07
申请号：US11405091
申请日：2006-04-17
申请人： Myoung Kim , Han Kim , Seok Jeong
发明人： Myoung Kim , Han Kim , Seok Jeong
IPC分类号： H01L21/84 , H01L21/44 , C23C16/00
CPC分类号： C23C16/44 , C23C16/24 , H01L27/13 , H01L29/6675
摘要： Disclosed is a CVD apparatus for depositing polysilicon without a separate following annealing process, the CVD apparatus comprising: a chamber to form a thin film on a substrate; a showerhead placed in an upper part of the chamber to inject reaction gas onto the substrate; a distributor formed with distributing holes to uniformly distribute the reaction gas; a catalyst hot wire unit to heat and dissolve the reaction gas injected through the distributing holes of the distributor; a chuck on which the substrate is mounted; a discharging hole to discharge the reaction gas; and a shielding wall provided as a lateral wall of the chamber and formed with a heater to suppress particle generation. With this configuration, the particle generation is minimized and thus the yield is enhanced. Also, the thin film has good crystallinity, and decreased hydrogen content.
摘要翻译：公开了一种用于在没有单独的跟随退火工艺的情况下沉积多晶硅的CVD装置，该CVD装置包括：在衬底上形成薄膜的腔室; 放置在所述室的上部的喷头，以将反应气体注入到所述基板上; 形成有分布孔以均匀分布反应气体的分配器; 用于加热和溶解通过分配器的分配孔注入的反应气体的催化剂热丝单元; 安装有基板的卡盘; 用于排出反应气体的排出孔; 以及作为室的侧壁设置的屏蔽壁，并且形成有用于抑制颗粒产生的加热器。利用这种构造，使颗粒生成最小化，从而提高了产率。此外，薄膜具有良好的结晶度，并降低了氢含量。

4. 发明申请

US20060254514A1 Catalyst enhanced chemical vapor deposition apparatus 有权
标题翻译：催化剂增强化学气相沉积装置
公开(公告)号：US20060254514A1
公开(公告)日：2006-11-16
申请号：US11413927
申请日：2006-04-28
申请人： Hee Kang , Kazuo Furuno , Han Kim , Myoung Kim
发明人： Hee Kang , Kazuo Furuno , Han Kim , Myoung Kim
IPC分类号： C23C16/00
CPC分类号： C23C16/44 , C23C16/4408 , C23C16/455
摘要： A catalyst enhanced chemical vapor deposition (CECVD) apparatus is provided in which the showerhead and catalyst support are separated from each other. The CECVD apparatus has excellent spacing between the showerhead, catalyst wire and substrate and can be purged to prevent contaminants from forming on parts functioning at low temperatures. The CECVD apparatus comprises a reaction chamber, a showerhead for introducing reaction gas into the reaction chamber, a catalyst wire for decomposing the reaction gas, a catalyst support for supporting the catalyst wire, a substrate on which the decomposed gas is deposited, and a substrate support for supporting the substrate.
摘要翻译：提供催化剂增强化学气相沉积（CECVD）装置，其中喷头和催化剂载体彼此分离。 CECVD装置在喷头，催化剂丝和基材之间具有优异的间距，并且可以被清除以防止在低温下起作用的部件上形成污染物。 CECVD装置包括反应室，用于将反应气体引入反应室的喷头，用于分解反应气体的催化剂丝，用于负载催化剂丝的催化剂载体，沉积有分解气体的基板和基板支持底物支撑。

5. 发明申请

US20070057625A1 Organic light emitting display and a deposition method 审中-公开
标题翻译：有机发光显示器和沉积方法
公开(公告)号：US20070057625A1
公开(公告)日：2007-03-15
申请号：US11501602
申请日：2006-08-08
申请人： Han Kim , Kyu Lee , Kyung Kim , Min Keum
发明人： Han Kim , Kyu Lee , Kyung Kim , Min Keum
IPC分类号： H01L51/52 , H01L51/56 , C23C14/34
CPC分类号： H01L27/3258 , C23C14/35 , C23C14/352 , H01L51/0021 , H01L51/5221
摘要： Disclosed are an organic light emitting display and a deposition method for depositing an electrode or a passivation layer by means of a box cathode sputtering method or a facing target sputtering method by mixing Ar with an inert gas heavier than Ar gas. The present embodiments provide an organic light emitting display including a substrate; a thin film transistor formed on the substrate; a first electrode formed on the thin film transistor; an organic layer formed on the first electrode; and a second electrode layer sputter-deposited on the organic layer by mixing Ar gas with an inert gas heavier than said Ar using a box cathode sputtering method or a facing target sputtering method.
摘要翻译：公开了通过将Ar与比Ar气体重的惰性气体混合的方式，通过箱式阴极溅射法或面对靶溅射法沉积电极或钝化层的有机发光显示器和沉积方法。本实施例提供一种包括基板的有机发光显示器; 形成在所述基板上的薄膜晶体管; 形成在薄膜晶体管上的第一电极; 形成在所述第一电极上的有机层; 以及通过使用箱式阴极溅射法或面对靶溅射法将Ar气体与比所述Ar重的惰性气体混合在有机层上溅射沉积的第二电极层。

6. 发明授权

US08853560B2 Electromagnetic bandgap structure and printed circuit board 有权
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US08853560B2
公开(公告)日：2014-10-07
申请号：US13411005
申请日：2012-03-02
申请人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
发明人： Dae-Hyun Park , Han Kim , Mi-Ja Han , Ja-Bu Koo
IPC分类号： H05K1/11 , H05K1/02
CPC分类号： H05K1/0236 , H05K1/0219 , H05K1/0222 , H05K1/115 , H05K2201/09309 , H05K2201/09536 , H05K2201/09618 , H05K2201/09718 , H05K2201/09781 , Y10T29/4913 , Y10T29/49165 , Y10T428/12465
摘要： An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, stacked in the first metal layer; a second metal layer, stacked in the first dielectric layer, and having a holed formed at a position of the second dielectric layer; a second dielectric layer, stacked in the second metal layer; a metal plate, stacked in the second dielectric layer; a first via, penetrating the hole formed in the second metal layer and connecting the first metal layer and the metal plate; a third dielectric layer, stacked in the metal plate and the second dielectric layer; a third metal layer, stacked in the third dielectric layer; and a second via, connecting the second metal layer to the third metal layer.
摘要翻译：公开了一种解决混合信号问题的电磁带隙结构和印刷电路板。根据本发明的实施例，电磁带隙结构包括第一金属层; 第一介电层，堆叠在第一金属层中; 第二金属层，堆叠在第一介电层中，并且具有形成在第二介电层的位置的孔; 第二介电层，堆叠在第二金属层中; 金属板，堆叠在第二介电层中; 穿过形成在第二金属层中的孔并连接第一金属层和金属板的第一通孔; 第三电介质层，堆叠在所述金属板和所述第二介电层中; 第三金属层，堆叠在第三介电层中; 以及将第二金属层连接到第三金属层的第二通孔。

7. 发明授权

US08699234B2 EMI noise shield board including electromagnetic bandgap structure 有权
标题翻译： EMI噪声屏蔽板包括电磁带隙结构
公开(公告)号：US08699234B2
公开(公告)日：2014-04-15
申请号：US12984935
申请日：2011-01-05
申请人： Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
发明人： Han Kim , Mi-Ja Han , Dae-Hyun Park , Hyo-Jic Jung , Kang-Wook Bong
IPC分类号： H05K1/18
CPC分类号： H05K1/0236 , H01L2224/16227 , H01L2224/16235 , H01L2224/48091 , H01L2224/48227 , H01L2224/48228 , H01L2924/15313 , H01L2924/16251 , H01L2924/3025 , H05K3/4694
摘要： An EMI noise shield board, in which an EBG structure is inserted, includes a first board portion and a second board portion. The first board portion has an upper surface, on which an electronic part is disposed, and a circuit for transferring a signal and power to the electronic part. The second board portion is located on a lower surface of the first board portion. The electromagnetic bandgap structure is inserted into the second board portion, and has a band stop frequency property such that an EMI noise transferred from the first board portion is shielded from being radiated to the outside of the EMI noise shield board.
摘要翻译：其中插入有EBG结构的EMI噪声屏蔽板包括第一板部分和第二板部分。第一板部分具有设置有电子部件的上表面和用于将信号和电力传送到电子部件的电路。第二板部分位于第一板部分的下表面上。电磁带隙结构被插入到第二板部分中，并且具有阻挡频率特性，使得从第一板部分传送的EMI噪声被屏蔽而不被辐射到EMI噪声屏蔽板的外部。

8. 发明授权

US08432706B2 Printed circuit board and electro application 有权
标题翻译：印刷电路板和电子应用
公开(公告)号：US08432706B2
公开(公告)日：2013-04-30
申请号：US12654541
申请日：2009-12-22
申请人： Han Kim , Chang-Sup Ryu
发明人： Han Kim , Chang-Sup Ryu
IPC分类号： H05K1/11
CPC分类号： H05K1/0237 , H01L2224/16225 , H01L2224/16235 , H01L2224/16237 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73253 , H01L2924/15153 , H01L2924/15192 , H01L2924/15313 , H01L2924/16251 , H01L2924/3025 , H01Q1/526 , H05K1/0224 , H05K1/0236 , H05K1/0298 , H05K1/144 , H05K1/183 , H05K9/0009 , H05K9/0052 , H05K2201/09681 , H05K2201/10371
摘要： A printed circuit board and an electronic product are disclosed. In accordance with an embodiment of the present invention, the printed circuit board includes a first board, which has an electronic component mounted thereon, and a second board, which is positioned on an upper side of the first board and covers at least a portion of an upper surface of the first board and in which an EBG structure is inserted into the second board such that a noise radiating upwards from the first board is shielded. Thus, the printed circuit board can readily absorb various frequencies, be easily applied without any antenna effect and be cost-effective in manufacturing.
摘要翻译：公开了印刷电路板和电子产品。根据本发明的实施例，印刷电路板包括：第一板，其上安装有电子部件;第二板，其位于第一板的上侧，并且覆盖至少一部分第一板的上表面，并且其中EBG结构插入到第二板中，使得从第一板向上辐射的噪声被屏蔽。因此，印刷电路板可以容易地吸收各种频率，容易应用而没有任何天线效应，并且在制造中是成本有效的。

9. 发明授权

US08368488B2 Electromagnetic bandgap structure and printed circuit board 有权
标题翻译：电磁带隙结构和印刷电路板
公开(公告)号：US08368488B2
公开(公告)日：2013-02-05
申请号：US12155941
申请日：2008-06-11
申请人： Han Kim , Hyung-Sik Choi , Sang-Hoon Kim , Joon-Sung Kim
发明人： Han Kim , Hyung-Sik Choi , Sang-Hoon Kim , Joon-Sung Kim
IPC分类号： H01P1/203
CPC分类号： H05K1/116 , H01L2224/16225 , H01L2924/00011 , H01L2924/00014 , H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H01L2224/0401
摘要： An electromagnetic bandgap structure and a printed circuit board that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. In accordance with an embodiment of the present invention, an electromagnetic bandgap structure is stacked with a first metal layer, a first dielectric layer, a metal plate, a second dielectric layer and a second metal layer, and an odd number of vias can be serially connected through a metal line between the first metal layer and the metal plate. This electromagnetic bandgap structure can have a small size and a low bandgap frequency.
摘要翻译：公开了可解决模拟电路和数字电路之间的混合信号问题的电磁带隙结构和印刷电路板。根据本发明的实施例，电磁带隙结构层叠有第一金属层，第一介电层，金属板，第二介电层和第二金属层，并且可以串联奇数个通孔通过第一金属层和金属板之间的金属线连接。该电磁带隙结构可以具有小尺寸和低带隙频率。

10. 发明授权

US08289099B2 Electromagnetic bandgap structure and circuit board 有权
标题翻译：电磁带隙结构和电路板
公开(公告)号：US08289099B2
公开(公告)日：2012-10-16
申请号：US12568362
申请日：2009-09-28
申请人： Han Kim , Ja-Bu Koo , Dae-Hyun Park
发明人： Han Kim , Ja-Bu Koo , Dae-Hyun Park
IPC分类号： H03H7/00
CPC分类号： H01P1/2005 , H01P1/203 , H05K1/0236 , H05K2201/09309 , H05K2201/09627 , H05K2201/09681
摘要： An electromagnetic bandgap structure includes: first conductive plates, placed on a first planar surface, in which the first conductive plates are lined up in a first direction; second conductive plates, placed on a second planar surface and arranged at an area corresponding to an area in which the first conductive plates are disposed, in which the second conductive plates are lined up in the first direction; a first stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the first planar surface; and a second stitching via, electrically connecting any two adjacent conductive portions with each other and in which the two adjacent conductive portions are lined up in a direction that is different from the first direction on the second planar surface.
摘要翻译：电磁带隙结构包括：第一导电板，放置在第一平面上，第一导电板沿第一方向排列; 第二导电板，放置在第二平坦表面上并且布置在与设置有第一导电板的区域相对应的区域中，其中第二导电板沿第一方向排列; 第一缝合通孔，将任何两个相邻的导电部分彼此电连接，并且其中两个相邻的导电部分沿与第一平坦表面上的第一方向不同的方向排列; 以及第二缝合通孔，将任何两个相邻的导电部彼此电连接，并且其中两个相邻的导电部分在与第二平面上的第一方向不同的方向上排列。

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