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1. 发明申请

US20050197145A1 Mobile phone capable of input of phone number without manipulating buttons and method of inputting phone number to the same 审中-公开
标题翻译：能够输入电话号码的手机，无需操作按钮和输入电话号码的方式相同
公开(公告)号：US20050197145A1
公开(公告)日：2005-09-08
申请号：US10899037
申请日：2004-07-27
申请人： Kyoung Chae , Ghun Hahm , Ho Park , Sang Choi , Won Sim
发明人： Kyoung Chae , Ghun Hahm , Ho Park , Sang Choi , Won Sim
IPC分类号： H04B1/40 , H04M1/00 , H04M1/27 , H04Q7/20
CPC分类号： H04M1/26 , G06F3/017 , G06F3/0346 , H04M1/725 , H04M2250/12
摘要： The present invention relates to a mobile phone, which allows a user to input a phone number by simply moving the body of the mobile phone without manipulating the buttons of a key pad, thus providing the user with convenience. The mobile phone includes a vibration/inclination detection means for detecting the numbers and directions of movements of a body of the mobile phone, an interface means for converting the detection signals of the vibration/inclination detection means into signals detectable by a control means and transmitting the signals to the control means, an auxiliary input means, which is placed on an outside of the mobile phone to be easily manipulated, for generating an on or off signal according to the operation of the user, and the control means for receiving the numbers and directions detected by the vibration/inclination detection means, converting the received numbers and directions into successive input numbers according to a predetermined rule, and attempting a call connection using the converted input numbers.
摘要翻译：移动电话技术领域本发明涉及一种移动电话，其允许用户通过简单地移动移动电话的主体来输入电话号码，而无需操纵键盘的按钮，从而为用户提供方便。移动电话包括用于检测移动电话机身的移动的数量和方向的振动/倾斜检测装置，用于将振动/倾斜检测装置的检测信号转换成由控制装置可检测的信号和发送向控制装置发送的信号，辅助输入装置，其被放置在移动电话的外部以便于操纵，用于根据用户的操作产生开或关信号，以及用于接收数字的控制装置和由振动/倾斜检测装置检测到的方向，根据预定规则将接收的号码和方向转换成连续的输入号码，并使用转换的输入号码尝试呼叫连接。

2. 发明申请

US20050132805A1 Capacitance accelerometer having compensation electrode 审中-公开
标题翻译：具有补偿电极的电容加速度计
公开(公告)号：US20050132805A1
公开(公告)日：2005-06-23
申请号：US10823706
申请日：2004-04-14
申请人： Ho Park , Kyoung Chae , Won Sim
发明人： Ho Park , Kyoung Chae , Won Sim
IPC分类号： G01P15/125
CPC分类号： G01P15/125 , G01P2015/0814
摘要： Disclosed is an accelerometer capable of compensating initial capacitance. In the accelerometer, support beams are extended from a beam-fixing section to elastically support both ends of a horizontally movable floating mass. Movable electrodes are extended outward from both sides of the mass to a predetermined length. Fixed electrodes are extended from electrode-fixing sections to a predetermined length, and alternate with the movable electrodes with a predetermined gap. Compensation electrode sections displace the mass in a moving direction of the mass to equalize an initial capacitance between the movable and fixed electrodes at one side with that between the movable and fixed electrodes at the other side. The invention can simply displace the mass compensation electrodes to equalize initial capacitances at the both ends.
摘要翻译：公开了一种能够补偿初始电容的加速度计。在加速度计中，支撑梁从梁固定部分延伸，以弹性地支撑水平移动浮动块的两端。可移动电极从质量的两侧向外延伸到预定长度。固定电极从电极固定部分延伸到预定长度，并且以可移动电极与预定间隙交替。补偿电极部分使质量沿质量的移动方向移动，以使在一侧的可移动和固定电极之间的初始电容与另一侧的可移动和固定电极之间的初始电容相等。本发明可以简单地移动质量补偿电极以平衡两端的初始电容。

3. 发明申请

US20050132804A1 Capacitance z-axis accelerometer 失效
标题翻译：电容z轴加速度计
公开(公告)号：US20050132804A1
公开(公告)日：2005-06-23
申请号：US10822692
申请日：2004-04-13
申请人： Ho Park , Kyoung Chae
发明人： Ho Park , Kyoung Chae
IPC分类号： G01P15/125
CPC分类号： G01P15/125
摘要： Disclosed is a capacitance accelerometer comprising a fixed electrode, a movable electrode and support beams. The fixed electrode has rectangular fixed electrode plates arranged parallel with a top surface of an insulation board. The fixed electrode plates are placed one above another via posts, and arranged on an electrode-fixing section of the insulation board. The movable electrode has rectangular movable electrode plates alternating with the fixed electrode plates. The movable electrode plates are placed one above another via connector posts placed within guide holes perforated through the fixed electrode plates. The support beams connect the movable electrode with beam-fixing sections to elastically support the movable electrode. The capacitance z-axis accelerometer can be integrated together with x- and y-axis accelerometers into a single chip, maximize the change of capacitance to achieve excellent acceleration sensitivity, and utilize an amplifier and a filter of low cost.
摘要翻译：公开了一种电容加速度计，其包括固定电极，可动电极和支撑梁。固定电极具有与绝缘板的顶表面平行布置的矩形固定电极板。固定电极板一个放置在另一个通孔上，并布置在绝缘板的电极固定部分上。可动电极具有与固定电极板交替的矩形可动电极板。可动电极板通过设置在穿过固定电极板的引导孔内的连接器柱放置在另一个之上。支撑梁将可动电极与光束固定部分连接起来，弹性地支撑可动电极。电容z轴加速度计可以与x轴和y轴加速度计集成在单个芯片中，最大化电容的变化，实现出色的加速度灵敏度，并利用低成本的放大器和滤波器。

4. 发明申请

US20060214178A1 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20060214178A1
公开(公告)日：2006-09-28
申请号：US11320968
申请日：2005-12-30
申请人： Sang Choi , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Chang Lim
发明人： Sang Choi , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Chang Lim
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L33/486 , H01L33/642 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要翻译：本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片结合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

5. 发明申请

US20060192223A1 Nitride semiconductor light emitting device 审中-公开
标题翻译：氮化物半导体发光器件
公开(公告)号：US20060192223A1
公开(公告)日：2006-08-31
申请号：US11313515
申请日：2005-12-21
申请人： Sung Lee , Woong Hwang , Seog Choi , Ho Park , Sang Choi , Chang Lim
发明人： Sung Lee , Woong Hwang , Seog Choi , Ho Park , Sang Choi , Chang Lim
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , H01L33/20 , H01L2224/16225
摘要： The invention relates to a flip-chip nitride semiconductor LED. In the LED, a light emitting structure has first and second conductivity type nitride semiconductor layers and an active layer interposed therebetween. Each of plurality of first and second electrodes has a bonding pad placed adjacent to a top corner of the light emitting structure and at least one electrode finger extended from the bonding pad. The first and second electrodes are connected to the first and second conductivity type nitride semiconductor layers, respectively. Also, bonding pads are arranged alternately along edges of the light emitting structure with different polarity, in a substantially symmetric configuration with respect to the center of the light emitting structure. In addition, each of electrode fingers is extended from a corresponding pad and bent at least once toward the center of the light emitting structure to adjoin the electrode finger having different polarity.
摘要翻译：本发明涉及倒装芯片氮化物半导体LED。在LED中，发光结构具有第一和第二导电型氮化物半导体层和插入其间的有源层。多个第一和第二电极中的每一个具有与发光结构的顶角相邻放置的接合焊盘和从接合焊盘延伸的至少一个电极指。第一和第二电极分别连接到第一和第二导电型氮化物半导体层。此外，接合焊盘以相对于发光结构的中心的基本对称的配置，以不同的极性交替地布置在发光结构的边缘处。此外，每个电极指从对应的垫延伸并且朝着发光结构的中心弯曲至少一次，以与具有不同极性的电极指相邻。

6. 发明申请

US20060220036A1 LED package using Si substrate and fabricating method thereof 失效
公开(公告)号：US20060220036A1
公开(公告)日：2006-10-05
申请号：US11312412
申请日：2005-12-21
申请人： Sung Lee , Woong Hwang , Sang Choi , Chang Lim , Ho Park , Seog Choi
发明人： Sung Lee , Woong Hwang , Sang Choi , Chang Lim , Ho Park , Seog Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.

7. 发明申请

US20060214181A1 Light emitting diode package with protective function against electrostatic discharge 失效
标题翻译：具有防静电放电功能的发光二极管封装
公开(公告)号：US20060214181A1
公开(公告)日：2006-09-28
申请号：US11312365
申请日：2005-12-21
申请人： Chang Lim , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Sang Choi
发明人： Chang Lim , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Sang Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/17 , H01L25/167 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/1461 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention provides an LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The invention includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.
摘要翻译：本发明提供一种具有由静电力操作的MEMS开关的LED封装，能够连续地保护LED免受由于静电放电引起的过大电流的影响。本发明包括其上形成有第一和第二电极图案的基座; 安装在所述基座上的LED，具有电连接到所述第一电极图案的n电极和与所述第二电极图案电连接的p电极; 以及包括第一导电板和第二导电板的MEMS开关，所述第一导电板和第二导电板被弯曲成具有与所述第一导电板上方并垂直分开的面积，其中所述第一和第二导电板电连接到所述第一和第二电极图案，导电板通过施加高于预定电压电压的静电力与第一导电板接触。

8. 发明申请

US20080038854A1 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20080038854A1
公开(公告)日：2008-02-14
申请号：US11882167
申请日：2007-07-31
申请人： Sang Choi , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Chang Lim
发明人： Sang Choi , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Chang Lim
IPC分类号： H01L21/00
CPC分类号： H01L33/641 , H01L33/486 , H01L33/642 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要翻译：本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

9. 发明申请

US20060192084A1 Light emitting diode package including monitoring photodiode 有权
标题翻译：发光二极管封装包括监控光电二极管
公开(公告)号：US20060192084A1
公开(公告)日：2006-08-31
申请号：US11313508
申请日：2005-12-21
申请人： Sung Lee , Woong Hwang , Seog Choi , Ho Park , Sang Choi , Chang Lim
发明人： Sung Lee , Woong Hwang , Seog Choi , Ho Park , Sang Choi , Chang Lim
IPC分类号： H01L31/00 , H01L27/15
CPC分类号： H01L31/147 , H01L25/167 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2924/00014
摘要： The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.
摘要翻译：本发明涉及一种包括光电二极管的LED封装。 LED封装包括硅衬底，并且在其上部形成光电二极管。而且，除了光电二极管的光接收面积以外，在硅基板上形成绝缘层。在LED封装中，在绝缘层上形成LED端子以连接到光电二极管。第一和第二LED连接焊盘形成在绝缘层上，并布置在光电二极管的两侧。此外，LED芯片安装在硅衬底上，并连接到第一和第二LED连接焊盘。

10. 发明申请

US20060186430A1 Light emitting diode package and fabrication method thereof 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20060186430A1
公开(公告)日：2006-08-24
申请号：US11312366
申请日：2005-12-21
申请人： Ho Park , Woong Hwang , Seog Choi , Sung Lee , Sang Choi , Chang Lim
发明人： Ho Park , Woong Hwang , Seog Choi , Sung Lee , Sang Choi , Chang Lim
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L33/46 , H01L2224/16225 , H01L2224/97
摘要： The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要翻译：本发明提供一种LED封装及其制造方法。本发明提供了一种LED封装，其包括基座硅基板和绝缘膜以及形成在基座硅基板上的电极图案。 LED封装还包括形成在电极图案上的具有通孔的间隔物。 LED封装还包括接收在通孔中的LED，与芯片接合的倒装芯片，以及附着到间隔物的上表面的光学元件。

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