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1. 发明申请

US20060220036A1 LED package using Si substrate and fabricating method thereof 失效
公开(公告)号：US20060220036A1
公开(公告)日：2006-10-05
申请号：US11312412
申请日：2005-12-21
申请人： Sung Lee , Woong Hwang , Sang Choi , Chang Lim , Ho Park , Seog Choi
发明人： Sung Lee , Woong Hwang , Sang Choi , Chang Lim , Ho Park , Seog Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/642 , H01L33/486 , H01L2224/16225 , H01L2224/48091 , H01L2224/48227 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： There are provided an LED package using a Si substrate and a fabricating method of the LED package. In the LED package, a supporting structure includes a Si substrate and an insulating layer formed on top and bottom surfaces of the Si substrate, and the supporting structure defines at least one groove in a bottom surface by partially removing the Si substrate and the insulating layer. A plurality of upper electrodes is formed on a top surface of the supporting structure. At least one LED is mounted on the top surface of the supporting structure, and the LED includes both terminals electrically connected to the upper electrodes. A metal filler is filled in the groove defined in the bottom surface of the supporting structure.

2. 发明申请

US20060214181A1 Light emitting diode package with protective function against electrostatic discharge 失效
标题翻译：具有防静电放电功能的发光二极管封装
公开(公告)号：US20060214181A1
公开(公告)日：2006-09-28
申请号：US11312365
申请日：2005-12-21
申请人： Chang Lim , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Sang Choi
发明人： Chang Lim , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Sang Choi
IPC分类号： H01L33/00
CPC分类号： H01L33/62 , H01L24/17 , H01L25/167 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/12035 , H01L2924/12041 , H01L2924/1461 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： The present invention provides an LED package having an MEMS switch operated by electrostatic force, capable of continuously protecting an LED from excessive current due to electrostatic discharge. The invention includes a submount with first and second electrode patterns formed thereon; an LED mounted on the submount, having an n-electrode electrically connected to the first electrode pattern and a p-electrode electrically connected to the second electrode pattern; and an MEMS switch including a first conductive plate and a second conductive plate bent to have an area over and vertically apart from the first conductive plate, wherein the first and second conductive plates are electrically connected to the first and second electrode patterns, and the second conductive plate comes in contact with the first conductive plate by electrostatic force upon being applied with voltage higher than a predetermined level of voltage.
摘要翻译：本发明提供一种具有由静电力操作的MEMS开关的LED封装，能够连续地保护LED免受由于静电放电引起的过大电流的影响。本发明包括其上形成有第一和第二电极图案的基座; 安装在所述基座上的LED，具有电连接到所述第一电极图案的n电极和与所述第二电极图案电连接的p电极; 以及包括第一导电板和第二导电板的MEMS开关，所述第一导电板和第二导电板被弯曲成具有与所述第一导电板上方并垂直分开的面积，其中所述第一和第二导电板电连接到所述第一和第二电极图案，导电板通过施加高于预定电压电压的静电力与第一导电板接触。

3. 发明申请

US20060214178A1 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20060214178A1
公开(公告)日：2006-09-28
申请号：US11320968
申请日：2005-12-30
申请人： Sang Choi , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Chang Lim
发明人： Sang Choi , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Chang Lim
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L33/486 , H01L33/642 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要翻译：本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片结合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

4. 发明申请

US20060192223A1 Nitride semiconductor light emitting device 审中-公开
标题翻译：氮化物半导体发光器件
公开(公告)号：US20060192223A1
公开(公告)日：2006-08-31
申请号：US11313515
申请日：2005-12-21
申请人： Sung Lee , Woong Hwang , Seog Choi , Ho Park , Sang Choi , Chang Lim
发明人： Sung Lee , Woong Hwang , Seog Choi , Ho Park , Sang Choi , Chang Lim
IPC分类号： H01L33/00
CPC分类号： H01L33/38 , H01L33/20 , H01L2224/16225
摘要： The invention relates to a flip-chip nitride semiconductor LED. In the LED, a light emitting structure has first and second conductivity type nitride semiconductor layers and an active layer interposed therebetween. Each of plurality of first and second electrodes has a bonding pad placed adjacent to a top corner of the light emitting structure and at least one electrode finger extended from the bonding pad. The first and second electrodes are connected to the first and second conductivity type nitride semiconductor layers, respectively. Also, bonding pads are arranged alternately along edges of the light emitting structure with different polarity, in a substantially symmetric configuration with respect to the center of the light emitting structure. In addition, each of electrode fingers is extended from a corresponding pad and bent at least once toward the center of the light emitting structure to adjoin the electrode finger having different polarity.
摘要翻译：本发明涉及倒装芯片氮化物半导体LED。在LED中，发光结构具有第一和第二导电型氮化物半导体层和插入其间的有源层。多个第一和第二电极中的每一个具有与发光结构的顶角相邻放置的接合焊盘和从接合焊盘延伸的至少一个电极指。第一和第二电极分别连接到第一和第二导电型氮化物半导体层。此外，接合焊盘以相对于发光结构的中心的基本对称的配置，以不同的极性交替地布置在发光结构的边缘处。此外，每个电极指从对应的垫延伸并且朝着发光结构的中心弯曲至少一次，以与具有不同极性的电极指相邻。

5. 发明申请

US20080038854A1 Light emitting diode package and fabrication method thereof 有权
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20080038854A1
公开(公告)日：2008-02-14
申请号：US11882167
申请日：2007-07-31
申请人： Sang Choi , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Chang Lim
发明人： Sang Choi , Woong Hwang , Seog Choi , Ho Park , Sung Lee , Chang Lim
IPC分类号： H01L21/00
CPC分类号： H01L33/641 , H01L33/486 , H01L33/642 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2224/0401
摘要： The present invention provides a light emitting diode (LED) package and the fabrication method thereof. The LED package includes a lower metal layer, and a first silicon layer, a first insulation layer, a second silicon layer, a second insulation layer, and a package electrode pattern formed in their order on the lower metal layer. The LED package also includes a spacer having a cavity, formed on the electrode pattern. The LED package further includes an LED mounted in the cavity by flip-chip bonding to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要翻译：本发明提供一种发光二极管（LED）封装及其制造方法。 LED封装包括下金属层，以及在下金属层上依次形成的第一硅层，第一绝缘层，第二硅层，第二绝缘层和封装电极图案。 LED封装还包括形成在电极图案上的具有空腔的间隔物。 LED封装还包括通过与电极图案倒装芯片接合而安装在腔中的LED以及附接到间隔件的上表面的光学元件。

6. 发明申请

US20060192084A1 Light emitting diode package including monitoring photodiode 有权
标题翻译：发光二极管封装包括监控光电二极管
公开(公告)号：US20060192084A1
公开(公告)日：2006-08-31
申请号：US11313508
申请日：2005-12-21
申请人： Sung Lee , Woong Hwang , Seog Choi , Ho Park , Sang Choi , Chang Lim
发明人： Sung Lee , Woong Hwang , Seog Choi , Ho Park , Sang Choi , Chang Lim
IPC分类号： H01L31/00 , H01L27/15
CPC分类号： H01L31/147 , H01L25/167 , H01L2224/48091 , H01L2224/48137 , H01L2224/48139 , H01L2924/00014
摘要： The present invention relates to an LED package including photo diode. The LED package includes a silicon substrate, and a photo diode is formed in an upper part thereof. Also, an insulation layer is formed on the silicon substrate excluding at least a light-receiving area of the photodiode. In the LED package, an LED terminal is formed on the insulation layer to be connected to the photo diode. First and second LED connecting pads are formed on the insulation layer, and arranged on both sides of the photo diode. In addition, an LED chip is mounted on the silicon substrate, and connected to the first and second LED connecting pads.
摘要翻译：本发明涉及一种包括光电二极管的LED封装。 LED封装包括硅衬底，并且在其上部形成光电二极管。而且，除了光电二极管的光接收面积以外，在硅基板上形成绝缘层。在LED封装中，在绝缘层上形成LED端子以连接到光电二极管。第一和第二LED连接焊盘形成在绝缘层上，并布置在光电二极管的两侧。此外，LED芯片安装在硅衬底上，并连接到第一和第二LED连接焊盘。

7. 发明申请

US20060186430A1 Light emitting diode package and fabrication method thereof 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20060186430A1
公开(公告)日：2006-08-24
申请号：US11312366
申请日：2005-12-21
申请人： Ho Park , Woong Hwang , Seog Choi , Sung Lee , Sang Choi , Chang Lim
发明人： Ho Park , Woong Hwang , Seog Choi , Sung Lee , Sang Choi , Chang Lim
IPC分类号： H01L33/00
CPC分类号： H01L33/641 , H01L33/46 , H01L2224/16225 , H01L2224/97
摘要： The present invention provides an LED package and the fabrication method thereof. The present invention provides an LED package including a submount silicon substrate and insulating film and electrode patterns formed on the submount silicon substrate. The LED package also includes a spacer having a through hole, formed on the electrode patterns. The LED package further includes an LED received in the through hole, flip-chip bonded to the electrode patterns, and an optical element attached to the upper surface of the spacer.
摘要翻译：本发明提供一种LED封装及其制造方法。本发明提供了一种LED封装，其包括基座硅基板和绝缘膜以及形成在基座硅基板上的电极图案。 LED封装还包括形成在电极图案上的具有通孔的间隔物。 LED封装还包括接收在通孔中的LED，与芯片接合的倒装芯片，以及附着到间隔物的上表面的光学元件。

8. 发明申请

US20070091443A1 Method of manufacturing high sag lens and high sag lens manufactured thereby 审中-公开
标题翻译：制造由此制造高凹陷透镜和高凹陷透镜的方法
公开(公告)号：US20070091443A1
公开(公告)日：2007-04-26
申请号：US11544631
申请日：2006-10-10
申请人： Chang Lim , Seog Choi , Sung Lee , Won Jeung , Ji Park
发明人： Chang Lim , Seog Choi , Sung Lee , Won Jeung , Ji Park
IPC分类号： G02B27/10
CPC分类号： G02B3/0056 , G02B3/0018 , G02B19/0014 , G02B19/0066 , G02B19/0095 , G02B27/0961 , G03F7/0005 , G03F7/0017 , G03F7/162 , G03F7/36
摘要： The invention relates to a method of manufacturing a high-sag micro lens and a high-sag lens manufactured thereby. According to the method, high viscosity photoresists are coated and baked for multiple times and undergo a reflow to obtain a micro lens structures having a high sag, thereby manufacturing high-sag micro lenses.
摘要翻译：本发明涉及一种制造高凹陷微透镜的方法和由此制造的高凹陷透镜。根据该方法，将高粘度光致抗蚀剂涂布并烘烤多次，并进行回流以获得具有高凹陷的微透镜结构，从而制造高凹陷微透镜。

9. 发明申请

US20070063214A1 Light emitting diode package and method for manufacturing the same 审中-公开
标题翻译：发光二极管封装及其制造方法
公开(公告)号：US20070063214A1
公开(公告)日：2007-03-22
申请号：US11524278
申请日：2006-09-21
申请人： Yong Kim , Seog Choi , Chang Lim , Yong Kim
发明人： Yong Kim , Seog Choi , Chang Lim , Yong Kim
IPC分类号： H01L33/00
CPC分类号： H01L33/507 , H01L33/58
摘要： The invention relates to a light emitting diode package that can prevent deterioration of phosphor and a method of manufacturing the same. The light emitting diode package includes a package body having a recessed part, a light emitting diode chip mounted on a floor surface of the recessed part and a lens structure disposed on an upper surface of the package body, apart from the light emitting diode chip. Phosphor is dispersed in at least a part of the lens structure.
摘要翻译：本发明涉及能够防止荧光体劣化的发光二极管封装及其制造方法。发光二极管封装包括具有凹部的封装主体，安装在凹部的地板表面上的发光二极管芯片和设置在封装体的上表面上的透镜结构，与发光二极管芯片分开。荧光体分散在透镜结构的至少一部分中。

10. 发明申请

US20060267037A1 Light emitting diode package 审中-公开
标题翻译：发光二极管封装
公开(公告)号：US20060267037A1
公开(公告)日：2006-11-30
申请号：US11442964
申请日：2006-05-31
申请人： Chang Lim , Seog Choi , Won Jeung
发明人： Chang Lim , Seog Choi , Won Jeung
IPC分类号： H01L33/00
CPC分类号： H01L25/0753 , F21V5/00 , F21V5/008 , F21Y2113/13 , F21Y2115/10 , H01L33/58 , H01L2924/0002 , H01L2933/0091 , H01L2924/00
摘要： The invention relates to an LED package capable of effectively mixing different colors of lights emitted from a plurality of LEDs to be focused into a desired region. The LED package includes a plurality of LEDs disposed on a substrate, and a side wall formed around an area with the LEDs disposed therein. The LED package also includes a diffusion plate disposed above in a predetermined interval from the LEDs and fixed to the side wall, and a micro lens array disposed above in a predetermined interval from the diffusion plate and fixed to the side wall.
摘要翻译：本发明涉及一种能够将从多个LED发射的不同颜色的光有效地混合以聚焦到所需区域的LED封装。 LED封装包括设置在基板上的多个LED和围绕设置有LED的区域周围形成的侧壁。 LED封装还包括扩散板，其设置在距LED的预定间隔高度并固定到侧壁上，以及微透镜阵列，其从扩散板设置在预定间隔上并固定到侧壁。

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