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    • 2. 发明授权
    • Magnetoresistive sensor with overlaid combined leads and shields
    • 具有重叠组合引线和屏蔽的磁阻传感器
    • US07768748B2
    • 2010-08-03
    • US11638974
    • 2006-12-14
    • Kuok San HoEdward Hin Pong LeeDavid John SeagleChing Hwa Tsang
    • Kuok San HoEdward Hin Pong LeeDavid John SeagleChing Hwa Tsang
    • G11B5/33
    • G11B5/3929B82Y25/00G01R33/093G11B5/3912G11B5/398
    • An improved magnetic head for a hard disk drive including a lead overlaid read head in which the read width and read gap are reduced. The read width, which corresponds to the distance between the inner ends of the overlaid electrical leads, is reduced by the fabrication of a thin read width insulation member prior to the fabrication of the overlaid electrical leads. The read gap is reduced by fabricating the overlaid electrical leads from a magnetic, electrically conductive material such as NiFe, whereby the overlaid electrical leads also function as a magnetic shield. The read gap, which is the distance between the first and second magnetic shields is thus reduced as compared to the prior art by the thickness of the electrical leads and the thickness of the prior art second insulation layer formed between the electrical leads and the second magnetic shield.
    • 一种用于硬盘驱动器的改进磁头,包括读出宽度和读取间隙减小的引线重叠读头。 通过在制造覆盖的电引线之前制造薄的读宽度绝缘部件,减小对应于重叠的电引线的内端之间的距离的读宽度。 通过从诸如NiFe的磁性导电材料制造覆盖的电引线来减小读取间隙,由此重叠的电引线也用作磁屏蔽。 因此,与现有技术相比,通过电引线的厚度和形成在电引线和第二磁屏蔽之间的现有技术的第二绝缘层的厚度相比,第一和第二磁屏蔽之间的距离减小了读取间隙 屏蔽。
    • 7. 发明授权
    • Fabrication of magnetoresistive sensors and electronic lapping guides
    • 磁阻传感器和电子研磨导轨的制造
    • US08361541B2
    • 2013-01-29
    • US12462104
    • 2009-07-28
    • Edward Hin Pong LeeDavid John Seagle
    • Edward Hin Pong LeeDavid John Seagle
    • G11B5/33G11B5/127
    • G11B5/3909B82Y10/00B82Y25/00G11B5/3906G11B2005/3996Y10T428/1107Y10T428/1121
    • The subject matter disclosed herein provides methods for manufacturing an electronic lapping guide and a magnetic read head assembly. The magnetoresistive head assembly includes a sensing element that has a front edge and a front flux guide that has a back edge, such that the sensing element front edge and the front flux guide back edge share a common interface that defines an interface plane normal to the surface of a wafer substrate. The electronic lapping guide comprises a conductive material adapted to attach to two electrical leads for measuring a resistance through the conductive material. The conductive material may include a conductive material back edge aligned with the interface plane. The resistance of the conductive material may be inversely proportional to a conductive material length normal to the interface plane.
    • 本文公开的主题提供了用于制造电子研磨导向器和磁读头组件的方法。 磁阻头组件包括具有前边缘的感测元件和具有后边缘的前通量引导件,使得感测元件前边缘和前导流引导后边缘共享公共接口,该公共接口限定与 晶片基板的表面。 电子研磨引导件包括适于附接到两个电引线的导电材料,用于测量通过导电材料的电阻。 导电材料可以包括与界面平面对准的导电材料后边缘。 导电材料的电阻可能与与界面平面垂直的导电材料长度成反比。