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    • 7. 发明申请
    • SCRIBE LINE STRUCTURE
    • 可选线结构
    • US20060022195A1
    • 2006-02-02
    • US10710761
    • 2004-08-01
    • Kun-Chih Wang
    • Kun-Chih Wang
    • H01L23/58
    • H01L22/32H01L2223/54426H01L2223/5446H01L2924/0002H01L2924/00
    • The present invention provides a scribe line structure, which includes a substrate, a plurality of dielectric layers of low dielectric constant materials formed on the substrate, at least a process monitor pattern made of materials of metal formed between the dielectric layers, and a dummy metal structure connected to the process monitor pattern. The dummy metal structure includes a plurality of dummy metal layers and a plurality of dummy vias. The dummy metal structure is formed on the surface of the substrate and is exposed in the region of the scribe line, thus facilitating heat dissipation and energy release from the scribe line structure.
    • 本发明提供一种划片线结构,其包括基板,形成在基板上的多个低介电常数材料的电介质层,至少由形成在电介质层之间的金属材料制成的工艺监视图案,以及虚设金属 结构连接到过程监控模式。 虚拟金属结构包括多个虚拟金属层和多个虚拟通孔。 虚设金属结构形成在基板的表面上,并且在划线的区域中露出,从而有利于散热和从划线结构释放能量。
    • 8. 发明授权
    • Bonding pad structure
    • 粘接垫结构
    • US06710448B2
    • 2004-03-23
    • US09880518
    • 2001-06-12
    • Kun-Chih Wang
    • Kun-Chih Wang
    • H01L2940
    • H01L24/05H01L2224/05093H01L2224/05556H01L2924/00014H01L2924/01014H01L2924/01033H01L2924/01082H01L2924/05042H01L2924/10253H01L2924/14H01L2924/00
    • A bonding pad structure. The bonding pad structure includes independently built current conduction structure and mechanical support structure between a bonding pad layer and a substrate. The current conduction structure is constructed using a plurality of serially connected conductive metallic layers each at a different height between the bonding pad layer and the substrate. The conductive metallic layers connect with each other via a plurality of plugs. At least one of the conductive metallic layers connects electrically with a portion of the device in the substrate by a signal conduction line. The mechanical support structure is constructed using a plurality of serially connected supportive metallic layers each at a different height between the bonding pad layer and the substrate. The supportive metallic layers connect with each other via a plurality of plugs. Furthermore, the mechanical support structure connects with a non-device section of the substrate so that stresses on the bonding pads are distributed evenly through the substrate.
    • 焊盘结构。 焊盘结构包括独立构建的导电结构和在焊盘层和衬底之间的机械支撑结构。 电流传导结构使用在接合焊盘层和衬底之间的不同高度上的多个串联连接的导电金属层来构造。 导电金属层通过多个插头彼此连接。 至少一个导电金属层通过信号传导线与衬底中的器件的一部分电连接。 机械支撑结构使用多个串联连接的支撑金属层来构造,每个支撑金属层在接合焊盘层和衬底之间的不同高度处。 支撑金属层通过多个插头彼此连接。 此外,机械支撑结构与衬底的非器件部分连接,使得焊盘上的应力均匀地分布在衬底上。
    • 10. 发明授权
    • Deposition method with improved step coverage
    • 沉积方法具有改进的台阶覆盖
    • US6046097A
    • 2000-04-04
    • US274599
    • 1999-03-23
    • Kevin HsiehKun-Chih WangWen-Yi Hsieh
    • Kevin HsiehKun-Chih WangWen-Yi Hsieh
    • H01L21/768H01L21/28
    • H01L21/76843
    • A deposition method for improving the step coverage of contact holes is disclosed. The method includes initially placing a semiconductor substrate on a chuck of a chamber, wherein the substrate has some contact holes. The chuck is firstly adjusted and conductive material is firstly deposited onto the substrate, wherein the direction of the first deposition is about vertical to the surface of the substrate, and therefore the bottom of the contact holes is then substantially deposited with the conductive material. Next, the chuck is secondly adjusted so that it has a tilt angle between the direction of the second deposition and rotation axis of the chuck. Finally, the chuck is continuously rotated and the conductive material is secondly deposited onto the substrate, and therefore the sidewall of the contact holes is then substantially deposited with the conductive material.
    • 公开了一种用于改善接触孔的台阶覆盖的沉积方法。 该方法包括最初将半导体衬底放置在室的卡盘上,其中衬底具有一些接触孔。 首先调整卡盘,并且首先将导电材料沉积到基底上,其中第一沉积的方向大约垂直于基底的表面,因此接触孔的底部然后基本上沉积有导电材料。 接下来,卡盘被二次调节,使得其在第二沉积的方向和卡盘的旋转轴线之间具有倾斜角。 最后,卡盘连续旋转,导电材料第二次沉积在基片上,因此接触孔的侧壁然后基本上沉积有导电材料。