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1. 发明申请

US20050110120A1 Scribe line structure of wafer 审中-公开
标题翻译：晶片划线结构
公开(公告)号：US20050110120A1
公开(公告)日：2005-05-26
申请号：US10707222
申请日：2003-11-27
申请人： Kun-Chih Wang , Paul Chen , Jui-Meng Jao , Chien-Li Kuo
发明人： Kun-Chih Wang , Paul Chen , Jui-Meng Jao , Chien-Li Kuo
IPC分类号： H01L21/301 , H01L21/78 , H01L23/544 , H01L23/58 , H01L29/06
CPC分类号： H01L22/34 , H01L21/78 , H01L23/585 , H01L2924/0002 , H01L2924/00
摘要： A wafer scribe line structure is provided. A plurality of lump patterns is set up to fill the entire scribe line area so that the amount of stress the wafer is subjected to during a dicing process is reduced, thereby reducing the probability of having a delamination at the interface of wafer layers. Moreover, the lump patterns can be formed simultaneously with metal interconnects in a metal interconnect process.
摘要翻译：提供晶片划线结构。设置多个块状图案以填充整个划线区域，使得在切割处理期间晶片受到的应力量减小，从而降低在晶片层的界面处发生分层的可能性。此外，块状图案可以在金属互连工艺中与金属互连同时形成。

2. 发明申请

US20060065976A1 METHOD FOR MANUFACTURING WAFER LEVEL CHIP SCALE PACKAGE STRUCTURE 有权
标题翻译：制造水平流片尺寸包装结构的方法
公开(公告)号：US20060065976A1
公开(公告)日：2006-03-30
申请号：US10711536
申请日：2004-09-24
申请人： Min-Chih Hsuan , Paul Chen , Hermen Liu , Kun-Chih Wang , Kai-Kuang Ho
发明人： Min-Chih Hsuan , Paul Chen , Hermen Liu , Kun-Chih Wang , Kai-Kuang Ho
IPC分类号： H01L23/48
CPC分类号： H01L24/97 , H01L23/15 , H01L23/3114 , H01L23/3128 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/13111 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/29075 , H01L2224/83851 , H01L2224/05099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a method for manufacturing a wafer level chip scale package structure including the following steps. After providing a glass substrate and a wafer comprising a plurality of chips, the active surface of the wafer is connected to the top surface of the glass substrate. The wafer is connected with the glass substrate through either bumps or pads thereon. After drilling the glass substrate to form a plurality of through holes, a plating process is performed to form a plurality of via plugs in the through holes. Afterwards, a singulation step is performed and a plurality of chip scale package structures is obtained.
摘要翻译：本发明涉及一种晶片级芯片级封装结构的制造方法，包括以下步骤。在提供玻璃基板和包括多个芯片的晶片之后，晶片的有效表面连接到玻璃基板的顶表面。晶片通过其上的凸块或焊盘与玻璃基板连接。在钻出玻璃基板以形成多个通孔之后，进行电镀工艺以在通孔中形成多个通孔塞。之后，进行分割步骤，并获得多个芯片级封装结构。

3. 发明授权

US07211500B2 Pre-process before cutting a wafer and method of cutting a wafer 有权
标题翻译：切割晶片前的预处理和切割晶片的方法
公开(公告)号：US07211500B2
公开(公告)日：2007-05-01
申请号：US10950909
申请日：2004-09-27
申请人： Kuo-Ming Chen , Kun-Chih Wang , Hermen Liu , Paul Chen , Kai-Kuang Ho
发明人： Kuo-Ming Chen , Kun-Chih Wang , Hermen Liu , Paul Chen , Kai-Kuang Ho
IPC分类号： H01L21/46 , H01L21/78 , H01L21/301
CPC分类号： H01L21/78
摘要： A pre-process before cutting a wafer is described. The wafer includes a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.
摘要翻译：描述切割晶片之前的预处理。晶片包括多个划痕线和由划线限定的多个管芯，并且材料层覆盖晶片。执行预处理步骤以去除靠近模具的拐角区域的划线上的材料层。在切割晶片之前在拐角区域去除材料层能够保持切割模具的拐角区域的完整性。

4. 发明授权

US07170167B2 Method for manufacturing wafer level chip scale package structure 有权
标题翻译：制造晶圆级芯片级封装结构的方法
公开(公告)号：US07170167B2
公开(公告)日：2007-01-30
申请号：US10711536
申请日：2004-09-24
申请人： Min-Chih Hsuan , Paul Chen , Hermen Liu , Kun-Chih Wang , Kai-Kuang Ho
发明人： Min-Chih Hsuan , Paul Chen , Hermen Liu , Kun-Chih Wang , Kai-Kuang Ho
IPC分类号： H01L23/48
CPC分类号： H01L24/97 , H01L23/15 , H01L23/3114 , H01L23/3128 , H01L23/49816 , H01L24/48 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/05001 , H01L2224/05026 , H01L2224/05568 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/05666 , H01L2224/13111 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73265 , H01L2224/8121 , H01L2224/81815 , H01L2224/97 , H01L2924/00011 , H01L2924/00014 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/09701 , H01L2924/10253 , H01L2924/15311 , H01L2924/181 , H01L2924/351 , H01L2224/81 , H01L2924/00 , H01L2924/00012 , H01L2224/29075 , H01L2224/83851 , H01L2224/05099 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： The present invention relates to a method for manufacturing a wafer level chip scale package structure including the following steps. After providing a glass substrate and a wafer comprising a plurality of chips, the active surface of the wafer is connected to the top surface of the glass substrate. The wafer is connected with the glass substrate through either bumps or pads thereon. After drilling the glass substrate to form a plurality of through holes, a plating process is performed to form a plurality of via plugs in the through holes. Afterwards, a singulation step is performed and a plurality of chip scale package structures is obtained.
摘要翻译：本发明涉及一种晶片级芯片级封装结构的制造方法，包括以下步骤。在提供玻璃基板和包括多个芯片的晶片之后，晶片的有效表面连接到玻璃基板的顶表面。晶片通过其上的凸块或焊盘与玻璃基板连接。在钻出玻璃基板以形成多个通孔之后，进行电镀工艺以在通孔中形成多个通孔塞。之后，进行分割步骤，并获得多个芯片级封装结构。

5. 发明申请

US20060073676A1 Pre-process before cutting a wafer and method of cutting a wafer 有权
标题翻译：切割晶片前的预处理和切割晶片的方法
公开(公告)号：US20060073676A1
公开(公告)日：2006-04-06
申请号：US10950909
申请日：2004-09-27
申请人： Kuo-Ming Chen , Kun-Chih Wang , Hermen Liu , Paul Chen , Kai-Kuang Ho
发明人： Kuo-Ming Chen , Kun-Chih Wang , Hermen Liu , Paul Chen , Kai-Kuang Ho
IPC分类号： H01L21/78
CPC分类号： H01L21/78
摘要： A pre-process before cutting a wafer is described. The wafer comprises a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the corner regions of the dies. Removing the material layer at the corner regions before cutting the wafer is able to preserve the integrity of the corner regions of the cut dies.
摘要翻译：描述切割晶片之前的预处理。晶片包括多个划痕线和由划线限定的多个管芯，并且材料层覆盖晶片。执行预处理步骤以去除靠近模具的拐角区域的划线上的材料层。在切割晶片之前在拐角区域去除材料层能够保持切割模具的拐角区域的完整性。

6. 发明公开

US20230356021A1 WEIGHT MEMBER AND THE USE IN BARBELL AND DUMBBELL DEVICES 审中-公开
公开(公告)号：US20230356021A1
公开(公告)日：2023-11-09
申请号：US17736051
申请日：2022-05-03
申请人： Paul Chen
发明人： Paul Chen
IPC分类号： A63B21/075 , A63B21/072
CPC分类号： A63B21/075 , A63B21/0722 , A63B21/0724 , A63B21/0726 , A63B21/0728
摘要： A weight member and the use in barbell and dumbbell devices are provided, wherein the weight member has a first side and a second side opposite to each other, and a split groove through the first side and the second side. A first mortise and a first tenon are arranged on the first side, and a second mortise and a second tenon are arranged on the second side. The first mortise and the second tenon are arranged in opposite direction correspondingly, and the first mortise and the second tenon are opposite to each other and arranged correspondingly. When the weight members are assembled together, the first mortise and the first tenon of one weight member is sliding interlocked with the second tenon and the second mortise of another weight member respectively.

7. 发明授权

US10166429B2 Adjustable kettlebell device 有权
公开(公告)号：US10166429B2
公开(公告)日：2019-01-01
申请号：US15381231
申请日：2016-12-16
申请人： Paul Chen
发明人： Paul Chen
IPC分类号： A63B21/00 , A63B21/072 , A63B21/075
摘要： An adjustable kettlebell device includes a kettlebell base having a housing formed below a handle, the housing includes a chamber formed by an upper wall and a bottom wall, one or more weight elements each include a tubular member for engaging into the chamber of the housing, and a latch is slidably received in the housing and movable to engage with the tubular members of the weight elements for detachably attaching the tubular member of the weight elements to the kettlebell base. The tubular member includes a channel formed by a rib, and the latch includes a projection for engaging with the channel of the tubular member of the weight elements.

8. 发明申请

US20130157812A1 Exercise apparatus adjustable for sidewise moving 审中-公开
标题翻译：运动装置可以侧向移动调节
公开(公告)号：US20130157812A1
公开(公告)日：2013-06-20
申请号：US13374164
申请日：2011-12-14
申请人： Paul Chen
发明人： Paul Chen
IPC分类号： A63B22/04
CPC分类号： A63B22/0056 , A63B21/068 , A63B2022/003 , A63B2022/0038 , A63B2022/0051 , A63B2022/0053
摘要： An exercise apparatus includes a base having an upright support, two brackets attached to the upright support and adjustable relative to upright support between a forwardly directed position and a sidewise directed position, and two foot supports pivotally attached to the brackets and to be pivoted and swung forwardly and rearwardly relative to the brackets and the upright support when the brackets are attached to the carrier at the forwardly directed position, and the foot supports are allowed to be pivoted and swung sidewise relative to the brackets and the upright support when the brackets are attached to the upright support at the sidewise directed position.
摘要翻译：运动装置包括具有直立支撑件的基座，两个支架，其连接到直立支撑件上，并且相对于在向前指向位置和侧向指向位置之间的直立支撑件可调节;以及两个脚部支撑件，其可枢转地附接到支架并且枢转和摆动当支架在向前指向的位置处附接到托架时，相对于支架和直立支撑件向前和向后向前和向后，并且当支架被附接时，允许脚支撑件相对于托架和直立支撑件侧向地摆动和摆动到侧面指向位置处的直立支撑件。

9. 发明授权

US08411108B2 Rotational display system 有权
公开(公告)号：US08411108B2
公开(公告)日：2013-04-02
申请号：US12646422
申请日：2009-12-23
申请人： Mark D. Gilbert , Paul Chen , Lawrence Moens
发明人： Mark D. Gilbert , Paul Chen , Lawrence Moens
IPC分类号： G09G5/00
CPC分类号： G09G5/36 , B60K35/00 , B60K37/06 , B60K2350/1024 , B60K2350/1028 , B60K2350/924 , B60Q1/326 , B60Q2900/30 , B60R13/00 , G06T3/60 , G06T15/00 , G09F1/06 , G09F9/33 , G09F21/045 , G09G3/005 , G09G2340/0492 , G09G2380/10
摘要： The present invention provides a system which integrates unique lighting technologies, switching systems, mounting systems, information delivery systems and power supply systems within a support such as vehicular wheel to provide an advanced, high quality visual display apparatus in various surfaces of rotation. A displayed image may be three dimensional. These technologies, and their many unique applications, provide for a novel and useful series of video display devices that are small, lightweight, efficient and can have the capability of producing a clear, bright, high definition image that is equivalent to that of a modern day TV or high quality computer monitor.

10. 外观设计

USD671259S1 Non-opaque light cover for a light fixture 有权
标题翻译：用于灯具的非不透明灯罩
公开(公告)号：USD671259S1
公开(公告)日：2012-11-20
申请号：US29408328
申请日：2011-12-09
申请人： Paul Chen
设计人： Paul Chen

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