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    • 7. 发明授权
    • Semiconductor device
    • 半导体器件
    • US08441010B2
    • 2013-05-14
    • US13164806
    • 2011-06-21
    • Mitsuhiro IchijoToshiya EndoKunihiko SuzukiYasuhiko Takemura
    • Mitsuhiro IchijoToshiya EndoKunihiko SuzukiYasuhiko Takemura
    • H01L29/786
    • H01L29/7869
    • In a transistor including an oxide semiconductor, hydrogen in the oxide semiconductor leads to degradation of electric characteristics of the transistor. Thus, an object is to provide a semiconductor device having good electrical characteristics. An insulating layer in contact with an oxide semiconductor layer where a channel region is formed is formed by a plasma CVD method using a silicon halide. The insulating layer thus formed has a hydrogen concentration less than 6×1020 atoms/cm3 and a halogen concentration greater than or equal to 1×1020 atoms/cm3; accordingly, hydrogen diffusion into the oxide semiconductor layer can be prevented and hydrogen in the oxide semiconductor layer is inactivated or released from the oxide semiconductor layer by the halogen, whereby a semiconductor device having good electrical characteristics can be provided.
    • 在包括氧化物半导体的晶体管中,氧化物半导体中的氢导致晶体管的电特性的劣化。 因此,目的在于提供具有良好的电气特性的半导体器件。 通过使用卤化硅的等离子体CVD法形成与形成沟道区的氧化物半导体层接触的绝缘层。 如此形成的绝缘层的氢浓度小于6×1020原子/ cm3,卤素浓度大于或等于1×1020原子/ cm3; 因此,可以防止氢扩散到氧化物半导体层中,并且氧化物半导体层中的氢被卤素氧化半导体层失活或释放,从而可以提供具有良好电特性的半导体器件。