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1. 发明授权

US4166498A Vapor-condensing, heat-transfer wall 失效
标题翻译：蒸汽冷凝，传热墙
公开(公告)号：US4166498A
公开(公告)日：1979-09-04
申请号：US815028
申请日：1977-07-12
申请人： Kunio Fujie , Wataru Nakayama , Takahiro Daikoku , Shigeki Hirasawa , Kimio Kakizaki
发明人： Kunio Fujie , Wataru Nakayama , Takahiro Daikoku , Shigeki Hirasawa , Kimio Kakizaki
IPC分类号： F25B39/04 , F28F13/02 , F28F13/04 , F28B9/08 , F28F3/04 , F28F13/18
CPC分类号： F28F13/04
摘要： A condensing, a heat-transfer wall for liquefying vapor having a temperature higher than the wall by bringing the vapor in contact therewith. There are provided many parallel grooves in the basic surface of the heat-transfer wall, thereby defining ridge portions or build-up portions thereamong. These ridge portions have their tip portions tapered at sharp acute angle. Recessed or concave portions are provided in the tip portions of these ridge portions, and these recessed portions have their surfaces inclined to the basic surface of the heat-transfer wall. The width of the respective grooves ranges from 0.05 to 2.5 mm, and the depth thereof is not more than 10 mm. The thickness of the respective ridge portions ranges from 0.01 to 2.5 mm, and the height there of is not more than 10 mm. The depth of the recessed portions ranges from 0.02 to 0.8 times the depth of the grooves, and the pitch of recessed portion is not more than 2.0 mm. The width of the tip portions of the portions is 0.01 to 1.0 times the pitch of the recessed portions.
摘要翻译：冷凝物，通过使蒸气与其接触而液化具有高于壁温度的蒸气的传热壁。在传热壁的基面上设有许多平行的凹槽，从而在其之间形成脊部或组合部分。这些脊部的尖端部分以锐角锐化。在这些脊部的前端设置有凹部或凹部，这些凹部的表面倾斜于传热壁的基面。各槽的宽度为0.05〜2.5mm，其深度为10mm以下。各脊部的厚度为0.01〜2.5mm，高度为10mm以下。凹部的深度为凹槽深度的0.02〜0.8倍，凹部的间距为2.0mm以下。这些部分的前端部的宽度为凹部的间距的0.01〜1.0倍。

2. 发明授权

US4195688A Heat-transfer wall for condensation and method of manufacturing the same 失效
标题翻译：用于冷凝的传热壁及其制造方法
公开(公告)号：US4195688A
公开(公告)日：1980-04-01
申请号：US921076
申请日：1978-06-30
申请人： Kunio Fujie , Wataru Nakayama , Heikichi Kuwahara , Takahiro Daikoku , Kimio Kakizaki
发明人： Kunio Fujie , Wataru Nakayama , Heikichi Kuwahara , Takahiro Daikoku , Kimio Kakizaki
IPC分类号： B21C37/20 , B21D31/00 , F28F13/04 , F28B9/08 , F28F1/36
CPC分类号： F28F13/04 , B21C37/20 , B21D31/00
摘要： A heat-transfer wall kept at a low temperature so that hot vapor brought into contact with its surface condenses thereon. The surface is grooved at a fine pitch, having thin and sharply tapering ridges in between, with shallower fine-pitch grooves or notches formed in the ridges. The wall may be that of a tube, the grooves may consist of a continuous root in the form of a helix, and the ridges may be bent into the grooves to form rounded crests. The wall contour is made by forming fine-pitch shallow grooves crosswise by knurling and then forming fine-pitch deep grooves by cutting and turning up the surfaces in a plowing manner, for example on a lathe. A grooved die may be used to deform and bend the edges of the ridges toward the deep grooves.
摘要翻译：保持在低温下的传热壁使得与其表面接触的热蒸气在其上冷凝。该表面以细间距开槽，在其间具有薄而尖锐的脊，与较小的细间距沟槽或凹槽形成在脊中。壁可以是管的壁，凹槽可以由螺旋形式的连续根组成，并且脊可以弯曲成凹槽以形成圆形顶部。壁轮廓是通过通过滚花形成细间距浅槽，然后通过例如在车床上切割和翻转表面而形成细间距深槽而制成的。可以使用带槽的模具来使脊的边缘朝向深槽变形和弯曲。

3. 发明授权

US4194384A Method of manufacturing heat-transfer wall for vapor condensation 失效
标题翻译：制造用于蒸气冷凝的传热壁的方法
公开(公告)号：US4194384A
公开(公告)日：1980-03-25
申请号：US913823
申请日：1978-06-08
申请人： Kunio Fujie , Wataru Nakayama , Heikichi Kuwahara , Takahiro Daikoku , Kimio Kakizaki
发明人： Kunio Fujie , Wataru Nakayama , Heikichi Kuwahara , Takahiro Daikoku , Kimio Kakizaki
IPC分类号： B21C37/20 , B21D31/00 , F28F13/04 , B21D53/06
CPC分类号： B21C37/20 , B21D31/00 , F28F13/04 , Y10T29/49385
摘要： A method of manufacturing a heat-transfer wall for vapor condensation comprising the step of forming on the heat-transfer surface, a number of shallow grooves substantially in parallel at a fine pitch, and then forming, on the heat-transfer surface and in the direction across said shallow grooves, a number of grooves deeper than the shallow grooves at a fine pitch by cutting and turning up the heat-transfer surface in the plowing manner. Said method may further comprise a subsequent step of curling the edges of the ridges formed in the above-mentioned step into said deep grooves.
摘要翻译：一种制造用于蒸气冷凝的传热壁的方法，包括以下步骤：在传热表面上形成许多基本上以细间距平行的浅槽，然后在传热表面和横跨所述浅槽的方式，通过以犁耕方式切割和转动传热表面，以细间距形成比浅槽更深的多个凹槽。所述方法还可以包括将上述步骤中形成的脊的边缘卷曲到所述深槽中的后续步骤。

4. 发明授权

US4060125A Heat transfer wall for boiling liquids 失效
标题翻译：用于沸腾液体的传热壁
公开(公告)号：US4060125A
公开(公告)日：1977-11-29
申请号：US586930
申请日：1975-06-16
申请人： Kunio Fujie , Wataru Nakayama , Heikichi Kuwahara , Kimio Kakizaki
发明人： Kunio Fujie , Wataru Nakayama , Heikichi Kuwahara , Kimio Kakizaki
IPC分类号： F28F13/02 , F28F1/12 , F28F13/18 , F28F13/00
CPC分类号： F28F13/187 , Y10T29/4935 , Y10T29/49377
摘要： A heat transfer wall for boiling liquids having a multiplicity of minute tunnels parallelly extending and spaced a distance of not more than 1 mm under the metal wall surface in contact with liquid. Each tunnel is communicated with the outside by a multiplicity of tiny holes formed at regular intervals of not more than 1 mm along the tunnel. The wall surface portion is in one piece with the wall body. The holes combinedly account for from 2 to 50% of the total surface area of the wall. The regularly formed holes are substantially triangular shaped. The wall is made of either copper or aluminum.
摘要翻译：用于沸腾液体的传热壁，其具有多个微小的隧道，平行延伸并且在与液体接触的金属壁表面下方间隔不超过1mm的距离。每个隧道与外部通过沿着隧道以不超过1mm的规则间隔形成的多个微小孔连通。壁面部分与壁体成一体。孔的总和占墙面总面积的2〜50％。规则形成的孔基本上是三角形的。墙壁由铜或铝制成。

5. 发明授权

US4678029A Evaporating heat transfer wall 失效
标题翻译：蒸发传热墙
公开(公告)号：US4678029A
公开(公告)日：1987-07-07
申请号：US652294
申请日：1984-09-19
申请人： Toshi Sasaki , Hiromichi Yoshida , Shigeho Fukuda , Kiyoshi Oizumi , Kimio Kakizaki , Wataru Nakayama , Takahiro Daikoku , Tadakatsu Nakajima , Yoshihiko Nakayama
发明人： Toshi Sasaki , Hiromichi Yoshida , Shigeho Fukuda , Kiyoshi Oizumi , Kimio Kakizaki , Wataru Nakayama , Takahiro Daikoku , Tadakatsu Nakajima , Yoshihiko Nakayama
IPC分类号： F28F13/02 , F28F1/10 , F28F1/32 , F28F13/18 , F28F19/02
CPC分类号： F28F13/187 , Y10S165/911
摘要： In a heat transfer wall having a number of fine and elongate tunnels adjacent to each other with a minute distance under the surface thereof being in contact with liquid on the heat transfer wall, and a number of fine openings for communicating the tunnels to the outside thereof defined on ceilings of the tunnels along the longitudinal directions thereof with each minute distance, a tongue-like projection is provided which protrudes from an edge of the opening or vicinity of the opening across the opening 1 whereby a flow of fluid passing through the openings provided with the projections is controlled so that heat transfer performance characteristics are improved.
摘要翻译：在具有彼此相邻的多个细长的隧道的传热壁上，其表面下的微小距离与传热壁上的液体接触，以及用于将隧道连通到其外部的多个细孔以每分钟距离沿着其纵向方向限定在隧道的天花板上，设置舌状的突起，其从开口的开口的边缘或开口附近突出，从而通过所述开口的流体流动控制突起，提高传热性能。

6. 发明授权

US4602681A Heat transfer surface with multiple layers 失效
标题翻译：传热面多层
公开(公告)号：US4602681A
公开(公告)日：1986-07-29
申请号：US545644
申请日：1983-10-26
申请人： Takahiro Daikoku , Wataru Nakayama , Tadakatsu Nakajima , Heikichi Kuwahara , Hiromichi Yoshida
发明人： Takahiro Daikoku , Wataru Nakayama , Tadakatsu Nakajima , Heikichi Kuwahara , Hiromichi Yoshida
IPC分类号： F28F13/02 , B01D1/22 , F28F1/10 , F28F13/18 , F28F13/00 , F25B39/02
CPC分类号： F28F13/187 , B01D1/22
摘要： In a heat transfer wall provided with a plurality of cells and restricted holes, the cells are formed in a plurality of laminated layers in a direction from an outer surface of the heat transfer wall to an inside thereof, and the cells of the upper and lower layers and the outside of the outer surface are communicated to one another through the holes.
摘要翻译：在设置有多个电池和限制孔的传热壁中，电池在从传热壁的外表面到其内部的方向上形成多个层叠层，并且上下电池层和外表面的外部通过孔彼此连通。

7. 发明授权

US4561497A Heat transfer surface and manufacturing method for same 失效
标题翻译：传热面及其制造方法相同
公开(公告)号：US4561497A
公开(公告)日：1985-12-31
申请号：US561070
申请日：1983-12-14
申请人： Tadakatsu Nakajima , Wataru Nakayama , Takahiro Daikoku , Heikichi Kuwahara , Akira Yasukawa , Katsuhiko Kasuya , Kazuaki Yokoi , Hideo Nakae , Hiromichi Yoshida
发明人： Tadakatsu Nakajima , Wataru Nakayama , Takahiro Daikoku , Heikichi Kuwahara , Akira Yasukawa , Katsuhiko Kasuya , Kazuaki Yokoi , Hideo Nakae , Hiromichi Yoshida
IPC分类号： F28F13/02 , F28F1/10 , F28F13/18
CPC分类号： F28F13/187 , Y10T29/49378
摘要： In a heat transfer surface having cavity groups and restricted opening groups in an outer surface region, the cavity groups are composed of a plurality of rows of void strip members. The cavity strip members are arranged in parallel on a base member of the heat transfer surface and are laminated in one or more layers. Each strip member has a number of elongate cavities laterally arranged in parallel. The elongate cavities are closed at upper surfaces and have at both ends openings. The adjacent cavities in the same layer are communicated with each other by communicating portions each provided between the cavity strip members and by the openings. The restricted opening groups are formed on the upper surfaces of the communicating portions. The restricted opening groups render the communicating portions in one layer, the communicating portions in another layer and the outside to communicate with each another. The method of manufacturing such a heat transfer surface is also disclosed.
摘要翻译：在具有空腔组和外表面区域中的限制开口组的传热表面中，空腔组由多排空隙条构件组成。空腔条构件平行地布置在传热表面的基底构件上，并且层叠成一层或多层。每个带状构件具有横向布置成平行的多个细长空腔。细长的空腔在上表面封闭并且在两端开口。相同层中的相邻空腔通过各个设置在空腔条形构件之间的连通部分和开口彼此连通。限制的开口组形成在连通部的上表面上。受限制的开口组使一个层中的通信部分，另一层中的通信部分和外部彼此通信。还公开了制造这种传热表面的方法。

8. 再颁专利

USRE35721E Cooling device of semiconductor chips 失效
公开(公告)号：USRE35721E
公开(公告)日：1998-02-03
申请号：US451761
申请日：1989-12-18
申请人： Takahiro Daikoku , Tadakatsu Nakajima , Noriyuki Ashiwake , Keizo Kawamura , Motohiro Sato , Fumiyuki Kobayashi , Wataru Nakayama
发明人： Takahiro Daikoku , Tadakatsu Nakajima , Noriyuki Ashiwake , Keizo Kawamura , Motohiro Sato , Fumiyuki Kobayashi , Wataru Nakayama
IPC分类号： H01L23/433 , F28F7/00
CPC分类号： H01L23/4338 , H01L2224/16
摘要： A cooling device for providing cooling of integrated circuit semiconductor chips is so arranged as to transfer a heat via thin fin members which are fitted with each other with a small clearance. The bottom surface of one of thermal conductive members which is provided integrally with the fin members is made greater in surface area than a back planar surface of the semiconductor chip, and the thermal conductive member and the semiconductor chip are kept at all times in plane contact with each other, thereby enhancing the cooling performance.

9. 发明授权

US4823863A Thermal conduction device 失效
标题翻译：导热装置
公开(公告)号：US4823863A
公开(公告)日：1989-04-25
申请号：US28202
申请日：1987-03-20
申请人： Tadakatsu Nakajima , Wataru Nakayama , Shigeo Oohashi , Heikichi Kuwabara , Takahiro Daikoku
发明人： Tadakatsu Nakajima , Wataru Nakayama , Shigeo Oohashi , Heikichi Kuwabara , Takahiro Daikoku
IPC分类号： H01L23/36 , H01L23/373 , H01L23/433 , F28F7/00
CPC分类号： H01L23/433 , H01L23/3733 , H01L23/3737 , H01L2224/16 , H01L2224/16225 , H01L2224/16227 , H01L2224/32245 , H01L2224/73253 , H01L2924/01014 , H01L2924/15312 , H01L2924/16152 , Y10S165/907
摘要： The present invention relates to a thermal conduction device well suited to cool electronic components such as semiconductor devices, in which a porous layer is provided at the surface part of the contact interface of a heat generating element or a heat sink element, and a liquid such as oil is contained in cavities formed in the porous layer, the heat generating element and the heat sink element being held in close contact by the surface tension of the liquid, whereby heat generated by the heat generating element is transferred to the heat sink element.
摘要翻译：本发明涉及一种非常适合于冷却诸如半导体器件的电子部件的导热器件，其中在发热元件或散热元件的接触界面的表面部分设有多孔层，当油被包含在形成于多孔层中的空腔中时，发热元件和散热元件通过液体的表面张力保持紧密接触，由此由发热元件产生的热量传递到散热元件。

10. 发明授权

US4606405A Heat transfer wall 失效
标题翻译：传热墙
公开(公告)号：US4606405A
公开(公告)日：1986-08-19
申请号：US701161
申请日：1985-02-13
申请人： Wataru Nakayama , Tadakatsu Nakajima , Heikichi Kuwahara , Akira Yasukawa , Takahiro Daikoku , Hiromichi Yoshida
发明人： Wataru Nakayama , Tadakatsu Nakajima , Heikichi Kuwahara , Akira Yasukawa , Takahiro Daikoku , Hiromichi Yoshida
IPC分类号： F28F13/02 , F28F1/10 , F28F13/00 , F28F13/18
CPC分类号： F28F13/187 , F28F13/00
摘要： In a perforated heat conductive surface structure having voids under an outer surface and openings in the outer surface, in order to obtain a high performance in particular at a low pressure and low temperature region, there is provided a heat transfer wall in which a thickness of a wall at a ceiling of each void and a length of a passage of the respective openings are increased in predetermined ranges.
摘要翻译：在具有在外表面下方的空隙和外表面中的开口的穿孔导热表面结构中，为了获得特别是在低压和低温区域的高性能，提供了一种传热壁，其中，每个空隙的顶部的壁和各个开口的通道的长度在预定范围内增加。

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