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1. 发明授权

US08268644B2 Light emitting device, and method and apparatus for manufacturing same 有权
标题翻译：发光装置及其制造方法和装置
公开(公告)号：US08268644B2
公开(公告)日：2012-09-18
申请号：US12867145
申请日：2009-02-10
申请人： Kuniaki Konno , Hideo Tamura , Hiroaki Oshio , Tetsuro Komatsu , Reiji Ono
发明人： Kuniaki Konno , Hideo Tamura , Hiroaki Oshio , Tetsuro Komatsu , Reiji Ono
IPC分类号： H01L33/56
CPC分类号： H01L33/50 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/8592 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a light emitting device includes: measuring at least one of each wavelength of the emitted light of the light emitting element, each optical output of the emitted light of the light emitting element, and each chromaticity of the mixed light emitted through the mixed resin in a manufacturing process of the light emitting device; and adjusting chromaticity for each light emitting device by performing a prescribed chromaticity adjustment with regard to the mixed resin, on basis of a result obtained in the measuring, so that the chromaticity of the mixed light falls within a preset prescribed range.
摘要翻译：一种制造发光器件的方法包括：测量发光元件的发射光的每个波长中的至少一个，发光元件的发射光的每个光输出以及通过该发光元件发射的混合光的每个色度在发光装置的制造过程中混合树脂; 并且通过根据在测量中获得的结果执行关于混合树脂的规定的色度调整来调整每个发光器件的色度，使得混合光的色度落在预设的规定范围内。

2. 发明申请

US20110018026A1 LIGHT EMITTING DEVICE, AND METHOD AND APPARATUS FOR MANUFACTURING SAME 有权
标题翻译：发光装置及其制造方法和装置
公开(公告)号：US20110018026A1
公开(公告)日：2011-01-27
申请号：US12867145
申请日：2009-02-10
申请人： Kuniaki Konno , Hideo Tamura , Hiroaki Oshio , Tetsuro Komatsu , Reiji Ono
发明人： Kuniaki Konno , Hideo Tamura , Hiroaki Oshio , Tetsuro Komatsu , Reiji Ono
IPC分类号： H01L33/52 , H01L33/48
CPC分类号： H01L33/50 , H01L33/56 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/8592 , H01L2924/181 , H01L2933/0041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： A method for manufacturing a light emitting device includes: measuring at least one of each wavelength of the emitted light of the light emitting element, each optical output of the emitted light of the light emitting element, and each chromaticity of the mixed light emitted through the mixed resin in a manufacturing process of the light emitting device; and adjusting chromaticity for each light emitting device by performing a prescribed chromaticity adjustment with regard to the mixed resin, on basis of a result obtained in the measuring, so that the chromaticity of the mixed light falls within a preset prescribed range.
摘要翻译：一种制造发光器件的方法包括：测量发光元件的发射光的每个波长中的至少一个，发光元件的发射光的每个光输出以及通过该发光元件发射的混合光的每个色度在发光装置的制造过程中混合树脂; 并且通过根据在测量中获得的结果执行关于混合树脂的规定的色度调整来调整每个发光器件的色度，使得混合光的色度落在预设的规定范围内。

3. 外观设计

USD531140S1 Light emitting semiconductor device 有权
公开(公告)号：USD531140S1
公开(公告)日：2006-10-31
申请号：US29242542
申请日：2005-11-14
申请人： Kuniaki Konno , Hiroaki Oshio
设计人： Kuniaki Konno , Hiroaki Oshio

4. 发明申请

US20090315068A1 LIGHT EMITTING DEVICE 审中-公开
标题翻译：发光装置
公开(公告)号：US20090315068A1
公开(公告)日：2009-12-24
申请号：US12391282
申请日：2009-02-24
申请人： Hiroaki Oshio , Reiji Ono
发明人： Hiroaki Oshio , Reiji Ono
IPC分类号： H01L27/00
CPC分类号： H01L33/62 , H01L33/486 , H01L33/642 , H01L33/647 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A light emitting device includes: a light emitting element; a first lead including a die pad portion at its one end portion, the light emitting element being bonded to the die pad portion; a second lead with its one end portion being opposed to the one end portion of the first lead; and a resin molded body including a recess with at least part of the die pad portion being exposed to the bottom thereof so that emission light from the light emitting element can be emitted upward, a lower surface with at least part of the lower surface of the first lead and at least part of the lower surface of the second lead being exposed thereto, and a lateral surface with at least part of the lateral surface of the die pad portion being exposed thereto, the resin molded body embedding the first lead and the second lead so that the other end portion of the first lead and the other end portion of the second lead are projected in directions opposite to each other. The at least part of the lateral surface of the die pad portion which is exposed is located on a first plane which is generally coplanar with the lateral surface of the other end portion of the first lead and the lateral surface of the other end portion of the second lead.
摘要翻译：发光器件包括：发光元件; 第一引线，其一端部具有芯片焊盘部，所述发光元件与所述芯片焊盘部接合; 第二引线，其一端部与第一引线的一端部相对; 以及树脂成型体，其具有凹部，所述凹部的至少一部分露出在所述凹部的底部，使得来自所述发光元件的发光可以向上方射出，下表面的下表面的至少一部分第一引线和第二引线的下表面的至少一部分被暴露于其中，并且具有裸片焊盘部分的侧表面的至少一部分的侧表面暴露于其中，树脂模制体嵌入第一引线和第二引线引线使得第一引线的另一端部和第二引线的另一端部沿彼此相反的方向突出。露出的芯片焊盘部分的侧表面的至少一部分位于与第一引线的另一端部的侧表面和第一引线的另一端部的侧表面大致共面的第一平面上第二个领先。

5. 发明授权

US08497521B2 LED package 有权
标题翻译： LED封装
公开(公告)号：US08497521B2
公开(公告)日：2013-07-30
申请号：US12875566
申请日：2010-09-03
申请人： Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu
发明人： Naoya Ushiyama , Kazuhisa Iwashita , Tatsuo Tonedachi , Teruo Takeuchi , Hiroaki Oshio , Tetsuro Komatsu , Gen Watari , Satoshi Shimizu
IPC分类号： H01L33/00
CPC分类号： H01L33/48 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/85 , H01L24/97 , H01L2224/32245 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/48479 , H01L2224/73265 , H01L2224/78301 , H01L2224/85051 , H01L2224/85186 , H01L2224/85205 , H01L2224/97 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/00012 , H01L2224/4554 , H01L2224/85399 , H01L2224/05599
摘要： According to one embodiment, an LED package includes a first lead frame, a second lead frame, an LED chip, a wire, and a resin body. The first lead frame and the second lead frame are arranged with a space between each other. The LED chip is provided above the first lead frame and the second lead frame. The LED chip has a first terminal connected to the first lead frame and a second terminal connected to the second lead frame. The wire connects the first terminal to the first lead frame. The resin body covers the LED chip as well as a top surface, a part of a bottom surface, and a part of an edge surface of each of the first lead frame and the second lead frame. A remaining portion of each of the bottom surfaces and a remaining portion of each of the edge surfaces are exposed. A chip side angle formed by a top surface of the LED chip and a direction in which the wire is extracted from the first terminal is smaller than a frame side angle formed by the top surface of the first lead frame and a direction in which the wire is extracted from the first lead frame.
摘要翻译：根据一个实施例，LED封装包括第一引线框架，第二引线框架，LED芯片，线材和树脂体。第一引线框架和第二引线框架彼此之间具有空间。 LED芯片设置在第一引线框架和第二引线框架的上方。 LED芯片具有连接到第一引线框架的第一端子和连接到第二引线框架的第二端子。线将第一端子连接到第一引线框架。树脂体覆盖LED芯片以及第一引线框架和第二引线框架的每个的顶表面，底表面的一部分和边缘表面的一部分。每个底表面的剩余部分和每个边缘表面的剩余部分被暴露。由LED芯片的顶表面形成的芯片侧角和从第一端子拔出线的方向小于由第一引线框架的顶表面形成的框架侧角以及线的方向从第一引线框架提取。

6. 外观设计

USD578082S1 Light emitting diode 有权
公开(公告)号：USD578082S1
公开(公告)日：2008-10-07
申请号：US29287884
申请日：2007-09-28
申请人： Shota Shimonishi , Mitsuhiro Nawashiro , Tetsuro Komatsu , Hiroaki Oshio
设计人： Shota Shimonishi , Mitsuhiro Nawashiro , Tetsuro Komatsu , Hiroaki Oshio

7. 发明授权

US08319320B2 LED module 失效
标题翻译： LED模块
公开(公告)号：US08319320B2
公开(公告)日：2012-11-27
申请号：US12874406
申请日：2010-09-02
申请人： Kazuhiro Inoue , Kazuhisa Iwashita , Teruo Takeuchi , Tatsuo Tonedachi , Hiroaki Oshio , Tetsuro Komatsu , Naoya Ushiyama
发明人： Kazuhiro Inoue , Kazuhisa Iwashita , Teruo Takeuchi , Tatsuo Tonedachi , Hiroaki Oshio , Tetsuro Komatsu , Naoya Ushiyama
IPC分类号： H01L23/495
CPC分类号： H01L24/97 , F21K9/00 , H01L25/0753 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15787 , H01L2924/181 , H01L2933/0033 , H01L2933/005 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED module includes a board, an interconnection and an LED package. The interconnection is formed on an upper surface of the board. The LED package is mounted on the board. The LED package includes first and second lead frames disposed to be apart from each other, and connected to portions of the interconnection insulated from each other. The LED package includes an LED chip provided above the first and second lead frames. The LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the LED package includes a resin body covering an upper surface, portions of a lower surface and an edge surface of each of the first and second lead frames, also covering the LED chip, but exposing remaining portions of the lower surface and the edge surface. And, an appearance of the resin body is an appearance of the LED package.
摘要翻译：根据一个实施例，LED模块包括板，互连和LED封装。互连形成在板的上表面上。 LED封装安装在电路板上。 LED封装包括彼此分开布置的第一和第二引线框架，并且连接到彼此绝缘的互连部分。 LED封装包括设置在第一引线框架和第二引线框架之上的LED芯片。 LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一端子。此外，LED封装包括覆盖第一引线框架和第二引线框架中的每一个的上表面，下表面和边缘表面的树脂体，还覆盖LED芯片，但是暴露下表面的剩余部分和边缘表面。并且，树脂体的外观是LED封装的外观。

8. 发明申请

US20120080674A1 LED PACKAGE 有权
标题翻译： LED封装
公开(公告)号：US20120080674A1
公开(公告)日：2012-04-05
申请号：US13289587
申请日：2011-11-04
申请人： Satoshi Shimizu , Kazuhisa Iwashita , Teruo Takeguchi , Tetsuro Komatsu , Hiroaki Oshio , Tatsuo Tonedachi , Naoya Ushiyama , Kazuhiro Inoue , Gen Watari
发明人： Satoshi Shimizu , Kazuhisa Iwashita , Teruo Takeguchi , Tetsuro Komatsu , Hiroaki Oshio , Tatsuo Tonedachi , Naoya Ushiyama , Kazuhiro Inoue , Gen Watari
IPC分类号： H01L33/62 , H01L33/50
CPC分类号： H01L33/62 , H01L24/73 , H01L24/97 , H01L25/0753 , H01L25/167 , H01L33/486 , H01L2224/26175 , H01L2224/32245 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/48471 , H01L2224/49113 , H01L2224/73265 , H01L2224/97 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01025 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01065 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2933/0066 , H01L2224/85 , H01L2924/00 , H01L2924/00012 , H01L2224/48227 , H01L2224/4554
摘要： According to one embodiment, an LED package includes first and second lead frames spaced from each other, and an LED chip. Each of the first and second lead frames includes a base portion and a plurality of extending portions extending from the base portion. A part of a lower surface of the base portion, side surfaces of the base portion, lower surfaces of the extending portions and side surfaces of the extending portions are covered by resin. A remaining part of the lower surface of the base portion and tip surfaces of the extending portions are not covered by resin. The part of the lower surface of the base portion includes a first edge of the first lead frame and a second edge of the second lead frame. The first edge and the second edge are opposed each other.
摘要翻译：根据一个实施例，LED封装包括彼此间隔开的第一和第二引线框架和LED芯片。第一引线框架和第二引线框架中的每一个包括基部和从基部延伸的多个延伸部。基部的下表面的一部分，基部的侧表面，延伸部的下表面和延伸部的侧表面被树脂覆盖。基部的下表面的剩余部分和延伸部分的末端表面不被树脂覆盖。基部的下表面的一部分包括第一引线框的第一边缘和第二引线框的第二边缘。第一边缘和第二边缘彼此相对。

9. 发明申请

US20110186900A1 LED PACKAGE, METHOD FOR MANUFACTURING LED PACKAGE, AND PACKING MEMBER FOR LED PACKAGE 有权
标题翻译： LED封装，制造LED封装的方法和用于LED封装的封装构件
公开(公告)号：US20110186900A1
公开(公告)日：2011-08-04
申请号：US12849102
申请日：2010-08-03
申请人： Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
发明人： Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
IPC分类号： H01L33/52 , H01L33/62
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.
摘要翻译：根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。第一和第二引线框彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，并且LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。此外，树脂体覆盖第一和第二引线框架和LED芯片，并且具有表面粗糙度为0.15μm以上的上表面和具有高于上表面的表面粗糙度的表面粗糙度的侧表面。

10. 发明授权

US08525202B2 LED package, method for manufacturing LED package, and packing member for LED package 有权
标题翻译： LED封装，LED封装制造方法，LED封装用包装件
公开(公告)号：US08525202B2
公开(公告)日：2013-09-03
申请号：US12849102
申请日：2010-08-03
申请人： Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
发明人： Gen Watari , Satoshi Shimizu , Mami Yamamoto , Hidenori Egoshi , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
IPC分类号： H01L33/00
CPC分类号： H01L24/97 , H01L24/73 , H01L2224/32013 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/48465 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/0102 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01045 , H01L2924/01047 , H01L2924/01056 , H01L2924/01058 , H01L2924/01063 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/01322 , H01L2924/014 , H01L2924/12035 , H01L2924/12041 , H01L2924/181 , H01L2924/351 , H01L2924/00014 , H01L2224/85 , H01L2924/00 , H01L2924/00012
摘要： According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are apart from each other. The LED chip is provided above the first and second lead frames, and the LED chip has one terminal connected to the first lead frame and another terminal connected to the second lead frame. In addition, the resin body covers the first and second lead frames and the LED chip, and has an upper surface with a surface roughness of 0.15 μm or higher and a side surface with a surface roughness higher than the surface roughness of the upper surface.
摘要翻译：根据一个实施例，LED封装包括第一和第二引线框架，LED芯片和树脂体。第一和第二引线框架彼此分开。 LED芯片设置在第一引线框架和第二引线框架之上，并且LED芯片具有连接到第一引线框架的一个端子和连接到第二引线框架的另一个端子。此外，树脂体覆盖第一和第二引线框架和LED芯片，并且具有表面粗糙度为0.15μm或更高的上表面和具有高于上表面的表面粗糙度的表面粗糙度的侧表面。

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