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1. 发明授权

US10399170B2 Die attachment apparatus and method utilizing activated forming gas 有权
公开(公告)号：US10399170B2
公开(公告)日：2019-09-03
申请号：US14141767
申请日：2013-12-27
申请人： Kui Kam Lam , Pingliang Tu , Zhao Yang , Jun Qi , Chun Hung Samuel Ip
发明人： Kui Kam Lam , Pingliang Tu , Zhao Yang , Jun Qi , Chun Hung Samuel Ip
IPC分类号： B23K3/08 , B23K1/00 , B23K1/20 , B23K3/06 , H01L23/00 , H01L21/60 , B23K101/42
摘要： A die attachment apparatus for attaching a semiconductor die onto a substrate having a metallic surface comprises a material dispensing station for dispensing a bonding material onto the substrate and a die attachment station for placing the semiconductor die onto the bonding material which has been dispensed onto the substrate. An activating gas generator positioned before the die attachment station introduces activated forming gas onto the substrate in order to reduce oxides on the substrate.

2. 发明申请

US20110272452A1 SYSTEM FOR DISPENSING SOFT SOLDER FOR MOUNTING SEMICONDUCTOR CHIPS USING MULTIPLE SOLDER WIRES 审中-公开
标题翻译：使用多条焊丝安装半导体芯片的软管分配系统
公开(公告)号：US20110272452A1
公开(公告)日：2011-11-10
申请号：US12773099
申请日：2010-05-04
申请人： Kui Kam Lam , Pingliang Tu , Chun Hung Samuel Ip
发明人： Kui Kam Lam , Pingliang Tu , Chun Hung Samuel Ip
IPC分类号： B23K31/02
CPC分类号： B23K1/20 , B23K1/0016 , B23K3/063 , B23K2101/40 , H01L24/743 , H01L2224/743 , H01L2924/07802 , H01L2924/14 , H01L2924/00
摘要： An apparatus for dispensing solder onto a substrate for mounting a semiconductor chip on the substrate comprises a dispensing body and first and second dispensing channels extending through the dispensing body. Each dispensing channel is operative to receive a separate solder wire to feed the solder wire to an end of the dispensing body facing the substrate. The dispensing channels are further operative to introduce the solder wires in a solid state simultaneously from the end of the dispensing body to be melted upon contact with the substrate which is heated.
摘要翻译：用于将衬底分配到衬底上用于将半导体芯片安装在衬底上的装置包括分配本体和延伸穿过分配本体的第一和第二分配通道。每个分配通道可操作以接收单独的焊丝，以将焊丝馈送到面向衬底的分配主体的端部。分配通道还可操作以从固化状态将焊丝从分配体的端部引入，以在与加热的基底接触时熔化。

3. 发明授权

US07735715B2 Dispensing solder for mounting semiconductor chips 有权
标题翻译：分配用于安装半导体芯片的焊料
公开(公告)号：US07735715B2
公开(公告)日：2010-06-15
申请号：US11952296
申请日：2007-12-07
申请人： Kui Kam Lam , Chun Hung Samuel Ip
发明人： Kui Kam Lam , Chun Hung Samuel Ip
IPC分类号： B23K31/02
CPC分类号： B23K1/0016 , B23K3/063 , B23K2101/40 , H01L24/743 , H01L2224/743 , H01L2924/07802 , H01L2924/14 , H01L2924/00
摘要： A method for mounting a semiconductor chip onto a substrate comprises the steps of positioning a solder dispenser over the substrate and passing a length of solder wire through the solder dispenser to the substrate. The feeding of the wire to the substrate in a feeding direction is controlled with a wire feeder. The solder dispenser is moved relative to the substrate with a positioning device along at least one of two orthogonal axes that are substantially perpendicular to the feeding direction contemporaneously with feeding the solder wire to the surface of the substrate to dispense a line of molten solder onto the substrate. The semiconductor chip is then mounted onto the molten solder that has been dispensed onto the substrate.
摘要翻译：将半导体芯片安装到衬底上的方法包括以下步骤：将焊料分配器定位在衬底上并将一定长度的焊丝通过焊料分配器传送到衬底。在送丝方向上将丝线馈送到基片上用送丝机进行控制。焊料分配器相对于基板移动，其中定位装置沿着两个正交轴线中的至少一个垂直于馈送方向，同时将焊丝馈送到基板的表面，以将熔融焊料线分配到基质。然后将半导体芯片安装到已经分配到基板上的熔融焊料上。

4. 发明授权

US08804136B2 Apparatus and method for locating a plurality of placement positions on a carrier object 有权
标题翻译：用于在载体物体上定位多个放置位置的装置和方法
公开(公告)号：US08804136B2
公开(公告)日：2014-08-12
申请号：US13706418
申请日：2012-12-06
申请人： Kui Kam Lam , Yen Hsi Tang , Wenling Chan , Shun Ming Fung
发明人： Kui Kam Lam , Yen Hsi Tang , Wenling Chan , Shun Ming Fung
IPC分类号： G01B11/14
CPC分类号： G01B11/14 , G01B11/002 , G01B2210/52 , H01L21/681
摘要： Disclosed is an optical apparatus for locating a plurality of placement positions on a carrier object. The optical apparatus comprises: i) an imaging device having a plurality of imaging sensors, each imaging sensor being operative to capture an image of a part of a selected row of placement positions on the carrier object and the plurality of imaging sensors defining a combined field of view that includes all the selected row of placement positions; ii) a positioning device coupled to the imaging device, the positioning device being operative to position the imaging device relative to successive rows of placement positions on the carrier object; and iii) a processor connected to the imaging device and which is configured to receive the images captured by the plurality of imaging sensors for image processing in order to identify exact locations of the placement positions comprised in the selected row of placement positions. A method of locating a plurality of placement positions on a carrier object is also disclosed.
摘要翻译：公开了一种用于在载体物体上定位多个放置位置的光学装置。光学装置包括：i）具有多个成像传感器的成像装置，每个成像传感器可操作以捕获载体对象上所选择的一排放置位置的一部分的图像，并且所述多个成像传感器限定组合场包括所有选定的展示位置行; ii）耦合到所述成像装置的定位装置，所述定位装置可操作以相对于所述载体对象上的连续的放置位置排定位所述成像装置; 以及iii）连接到所述成像装置并且被配置为接收由所述多个成像传感器捕获的图像以进行图像处理的处理器，以便识别包括在所选择的放置位置行中的所述放置位置的确切位置。还公开了一种在载体物体上定位多个放置位置的方法。

5. 发明授权

US08956892B2 Method and apparatus for fabricating a light-emitting diode package 有权
标题翻译：用于制造发光二极管封装的方法和装置
公开(公告)号：US08956892B2
公开(公告)日：2015-02-17
申请号：US13347388
申请日：2012-01-10
申请人： Kui Kam Lam , Ka Yee Mak , Yiu Yan Wong , Ming Li
发明人： Kui Kam Lam , Ka Yee Mak , Yiu Yan Wong , Ming Li
IPC分类号： H01L33/50
CPC分类号： H01L33/50 , H01L2224/48091 , H01L2924/15311 , H01L2933/0041 , H01L2924/00014
摘要： Disclosed is a method of fabricating a light-emitting diode package, which comprises a light-emitting chip operative to emit light of a first wavelength range. The method comprises the steps of: dispensing a photoluminescent mixture on the light-emitting chip, the photoluminescent mixture being capable of absorbing a portion of light of the first wavelength range emitted from the light-emitting chip to re-emit light of a second wavelength range; partially curing the photoluminescent mixture by heating the photoluminescent mixture to a pre-curing temperature and then cooling the photoluminescent mixture to below the pre-curing temperature; and fully curing the photoluminescent mixture to harden the photoluminescent mixture. An apparatus for fabricating a light-emitting diode package is also disclosed.
摘要翻译：公开了一种制造发光二极管封装的方法，其包括可发射第一波长范围的光的发光芯片。该方法包括以下步骤：在发光芯片上分配光致发光混合物，所述光致发光混合物能够吸收从发光芯片发射的第一波长范围的一部分光，以重新发射第二波长的光范围; 通过将光致发光混合物加热至预固化温度，然后将光致发光混合物冷却至预固化温度以下来部分固化光致发光混合物; 并充分固化光致发光混合物以硬化光致发光混合物。还公开了一种用于制造发光二极管封装的装置。

6. 发明授权

US07977231B1 Die bonder incorporating dual-head dispenser 有权
标题翻译：带有双头分配器的贴片机
公开(公告)号：US07977231B1
公开(公告)日：2011-07-12
申请号：US12941174
申请日：2010-11-08
申请人： Kui Kam Lam , Yen Hsi Tang , Yiu Yan Wong , Hok Man Wan
发明人： Kui Kam Lam , Yen Hsi Tang , Yiu Yan Wong , Hok Man Wan
IPC分类号： H01L21/44
CPC分类号： H01L21/6715 , H01L24/27 , H01L24/29 , H01L24/743 , H01L2224/27312 , H01L2224/29036 , H01L2224/2919 , H01L2224/743 , H01L2224/75611 , H01L2224/75744 , H01L2224/759 , H01L2224/83192 , H01L2224/8385 , H01L2924/00 , H01L2924/00014 , H01L2924/0665
摘要： Adhesive is dispensed for conducting die bonding onto a substrate including rows of bond pads aligned along a first axis and columns of bond pads aligned along a second axis transverse to the first axis where target dispensing positions are located. A first dispensing head incorporating a first nozzle and a second dispensing head incorporating a second nozzle are provided and the substrate is fed along the first axis to a position where the first and second dispensing heads are located. Pattern recognition of a columnar section of the substrate comprising one or more consecutive columns of bond pads with an optical system may be conducted by moving the optical system along the second axis relative to the substrate. Thereafter, the first nozzle and the second nozzle are driven concurrently to dispense adhesive from the first and second nozzles onto the target dispensing positions in the same columnar section of the substrate.
摘要翻译：粘合剂被分配用于导电管芯接合到基底上，该衬底包括沿着第一轴线排列的接合焊盘列，以及沿着与目标分配位置所在的第一轴线相交的第二轴线排列的接合焊盘列。提供了包括第一喷嘴的第一分配头和结合有第二喷嘴的第二分配头，并且基板沿着第一轴线被供给到第一和第二分配头所在的位置。可以通过沿相对于衬底的第二轴移动光学系统来进行包括具有光学系统的一个或多个连续的接合焊盘的衬底的柱状截面的图案识别。此后，同时驱动第一喷嘴和第二喷嘴，以将粘合剂从第一和第二喷嘴分配到基板的相同柱状部分中的目标分配位置上。

7. 发明授权

US07179346B2 Semiconductor apparatus with multiple delivery devices for components 有权
标题翻译：具有用于部件的多个输送装置的半导体装置
公开(公告)号：US07179346B2
公开(公告)日：2007-02-20
申请号：US10454259
申请日：2003-06-03
申请人： Kui Kam Lam , Man Chung Raymond Ng , Yen Hsi Terry Tang
发明人： Kui Kam Lam , Man Chung Raymond Ng , Yen Hsi Terry Tang
IPC分类号： B32B37/00 , H01L21/52
CPC分类号： H01L21/67144 , Y10T156/1092 , Y10T156/1097 , Y10T156/12 , Y10T156/1707 , Y10T156/1754 , Y10T156/1776
摘要： An apparatus is provided for transferring components from a pick-up position amongst a supply of components to a placement position on a receptor, such as a die pad, during semiconductor processing. It includes a first delivery device and a second delivery device operative to alternatively transfer the components from the pick-up position to the placement position. The second delivery device is arranged opposite the first delivery device about a line passing through the pick-up position and the placement position.
摘要翻译：提供了一种装置，用于在半导体处理期间将组件从元件供应部件中的拾取位置传送到接收器（例如管芯焊盘）上的放置位置。其包括第一输送装置和第二输送装置，其可操作以将部件从拾取位置交替地转移到放置位置。第二输送装置围绕穿过拾取位置和放置位置的线布置成与第一输送装置相对。

8. 发明授权

US08293043B2 Automatic level adjustment for die bonder 有权
标题翻译：芯片焊接机的自动电平调整
公开(公告)号：US08293043B2
公开(公告)日：2012-10-23
申请号：US11459503
申请日：2006-07-24
申请人： Kwok Kee Chung , Kui Kam Lam , Chi Keung Leung , Wai Yuen Cheung
发明人： Kwok Kee Chung , Kui Kam Lam , Chi Keung Leung , Wai Yuen Cheung
IPC分类号： B32B37/00
CPC分类号： H01L24/83 , H01L22/26 , H01L24/29 , H01L24/75 , H01L2224/29101 , H01L2224/2919 , H01L2224/83 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/00
摘要： A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.
摘要翻译：提供管芯接合装置和方法来自动调节管芯接合器的水平以补偿在接合期间在管芯接合器中发生的任何物理变化。接合臂支撑件可驱动到结合水平以将模具定位到接合表面上，并且接合臂可滑动地安装到接合臂支撑件以保持和接合模具。接合臂被配置为当接合到接合表面时被接合表面推动以相对于接合臂支撑件移动。提供测量装置，用于确定在接合期间由接合臂相对于接合臂支撑件移动的距离，并且控制器响应于由测量装置确定的距离，以改变键合臂支撑件被驱动到的结合水平。

9. 发明申请

US20080017293A1 AUTOMATIC LEVEL ADJUSTMENT FOR DIE BONDER 有权
标题翻译： DIE BONDER自动调整水平
公开(公告)号：US20080017293A1
公开(公告)日：2008-01-24
申请号：US11459503
申请日：2006-07-24
申请人： Kwok Kee Chung , Kui Kam Lam , Chi Keung Leung , Wai Yuen Cheung
发明人： Kwok Kee Chung , Kui Kam Lam , Chi Keung Leung , Wai Yuen Cheung
IPC分类号： B32B37/00
CPC分类号： H01L24/83 , H01L22/26 , H01L24/29 , H01L24/75 , H01L2224/29101 , H01L2224/2919 , H01L2224/83 , H01L2224/83801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/0665 , H01L2924/14 , H01L2924/00
摘要： A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.
摘要翻译：提供管芯接合装置和方法来自动调节管芯接合器的水平以补偿在接合期间在管芯接合器中发生的任何物理变化。接合臂支撑件可驱动到结合水平以将模具定位到接合表面上，并且接合臂可滑动地安装到接合臂支撑件以保持和接合模具。接合臂被配置为当接合到接合表面时被接合表面推动以相对于接合臂支撑件移动。提供测量装置，用于确定在接合期间由接合臂相对于接合臂支撑件移动的距离，并且控制器响应于由测量装置确定的距离，以改变键合臂支撑件被驱动到的结合水平。

10. 发明授权

US08590143B2 Apparatus for delivering semiconductor components to a substrate 有权
标题翻译：用于将半导体部件输送到基板的装置
公开(公告)号：US08590143B2
公开(公告)日：2013-11-26
申请号：US13115261
申请日：2011-05-25
申请人： Kui Kam Lam , Yen Hsi Tang , Wai Yuen Cheung , Wing Kin Lam
发明人： Kui Kam Lam , Yen Hsi Tang , Wai Yuen Cheung , Wing Kin Lam
IPC分类号： B23P19/00
CPC分类号： H01L21/67144 , H01L24/75 , Y10T29/515 , Y10T29/53174 , Y10T29/53178 , Y10T29/53183
摘要： An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.
摘要翻译：用于将半导体部件212输送到基板206a的装置200; 206b; 500a 500b; 500c在半导体封装制造过程中。装置200包括平台216和固定到平台216的多个传送模块202a，202b。多个传送模块202a，202b中的每一个具有支撑装置204a; 204b，用于支撑基板206a; 206b; 500a; 500b; 500c，以及输送装置208a; 208b，用于将半导体部件212传送到基板206a; 206b; 500a; 500b; 500c。特别地，支撑装置204a，204的高度相互平齐以输送基板206a; 206b; 500a; 500b; 500c在多个传送模块202a，202b之间。

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