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    • 2. 发明申请
    • PHOTORESIST COMPOSITIONS AND PROCESS FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER PHOTORESIST SYSTEMS
    • 多层次光电子系统的多光照组合物和工艺
    • US20090130590A1
    • 2009-05-21
    • US11942062
    • 2007-11-19
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara R. Varanasi
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara R. Varanasi
    • G03C1/73G03F7/26
    • G03F7/0048G03F7/0035G03F7/0397G03F7/40
    • A photoresist composition and methods using the photoresist composition in multiple exposure/multiple layer processes. The photoresist composition includes a polymer comprising repeat units having a hydroxyl moiety; a photoacid generator; and a solvent. The polymer when formed on a substrate is substantially insoluble to the solvent after heating to a temperature of about 150° C. or greater. One method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second non photoresist layer on the substrate and patterned first photoresist layer. Another method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second photoresist layer on the substrate and patterned first photoresist layer and patternwise exposing the second photoresist layer.
    • 光致抗蚀剂组合物和在多次曝光/多层工艺中使用光致抗蚀剂组合物的方法。 光致抗蚀剂组合物包括包含具有羟基部分的重复单元的聚合物; 光致酸发生器; 和溶剂。 形成在基材上的聚合物在加热至约150℃或更高的温度之后基本上不溶于溶剂。 一种方法包括在衬底上形成第一光致抗蚀剂层,图案地暴露第一光致抗蚀剂层,在衬底上形成第二非光致抗蚀剂层并且形成图案化的第一光致抗蚀剂层。 另一种方法包括在衬底上形成第一光致抗蚀剂层,以图形方式暴露第一光致抗蚀剂层,在衬底上形成第二光致抗蚀剂层并图案化的第一光致抗蚀剂层和图案地曝光第二光致抗蚀剂层。
    • 3. 发明申请
    • PHOTORESIST COMPOSITIONS AND PROCESS FOR MULTIPLE EXPOSURES WITH MULTIPLE LAYER PHOTORESIST SYSTEMS
    • 多层次光电子系统的多光照组合物和工艺
    • US20100248147A1
    • 2010-09-30
    • US12813628
    • 2010-06-11
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara R. Varanasi
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara R. Varanasi
    • G03F7/004
    • G03F7/0048G03F7/0035G03F7/0397G03F7/40
    • A photoresist composition and methods using the photoresist composition in multiple exposure/multiple layer processes. The photoresist composition includes a polymer comprising repeat units having a hydroxyl moiety; a photoacid generator; and a solvent. The polymer when formed on a substrate is substantially insoluble to the solvent after heating to a temperature of about 150° C. or greater. One method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second non photoresist layer on the substrate and patterned first photoresist layer. Another method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second photoresist layer on the substrate and patterned first photoresist layer and patternwise exposing the second photoresist layer.
    • 光致抗蚀剂组合物和在多次曝光/多层工艺中使用光致抗蚀剂组合物的方法。 光致抗蚀剂组合物包括包含具有羟基部分的重复单元的聚合物; 光致酸发生器; 和溶剂。 形成在基材上的聚合物在加热至约150℃或更高的温度之后基本上不溶于溶剂。 一种方法包括在衬底上形成第一光致抗蚀剂层,图案地暴露第一光致抗蚀剂层,在衬底上形成第二非光致抗蚀剂层并且形成图案化的第一光致抗蚀剂层。 另一种方法包括在衬底上形成第一光致抗蚀剂层,以图形方式暴露第一光致抗蚀剂层,在衬底上形成第二光致抗蚀剂层并图案化的第一光致抗蚀剂层和图案地曝光第二光致抗蚀剂层。
    • 4. 发明授权
    • Photoresist compositions and method for multiple exposures with multiple layer resist systems
    • 具有多层抗蚀剂体系的多次曝光的光刻胶组合物和方法
    • US07838198B2
    • 2010-11-23
    • US11955451
    • 2007-12-13
    • Kuang-Jung ChenWu-Song HuangWai-kin LiPushkara R. Varanasi
    • Kuang-Jung ChenWu-Song HuangWai-kin LiPushkara R. Varanasi
    • G03F7/00G03F7/004G03F7/20G03F7/26G03F7/40
    • G03F7/0045G03F7/0397G03F7/40
    • A method and a resist composition. The resist composition includes a polymer having repeating units having a lactone moiety, a thermal base generator capable of generating a base and a photosensitive acid generator. The polymer has the properties of being substantially soluble in a first solvent and becoming substantially insoluble after heating the polymer. The method includes forming a film of a photoresist including a polymer, a thermal base generator capable of releasing a base, a photosensitive acid generator, and a solvent. The film is patternwise imaged. The imaging includes exposing the film to radiation, resulting in producing an acid catalyst. The film is developed in an aqueous base, resulting in removing base-soluble regions and forming a patterned layer. The patterned layer is baked above the temperature, resulting in the thermal base generator releasing a base within the patterned layer and the patterned layer becoming insoluble in the solvent.
    • 一种方法和抗蚀剂组合物。 抗蚀剂组合物包括具有内酯部分的重复单元的聚合物,能够产生碱的热碱发生剂和感光酸产生剂。 聚合物具有基本上可溶于第一溶剂的性质,并且在加热聚合物之后变得基本上不溶。 该方法包括形成包含聚合物的光致抗蚀剂膜,能够释放碱的热碱发生器,光敏酸产生剂和溶剂。 该影片被图案化成像。 成像包括将膜暴露于辐射,导致产生酸催化剂。 该膜在水性碱中显影,导致去除碱溶性区域并形成图案层。 图案化层被烘烤高于该温度,导致热基发生器释放图案化层内的基底并且图案化层变得不溶于溶剂。
    • 5. 发明授权
    • Photoresist compositions and process for multiple exposures with multiple layer photoresist systems
    • 光刻胶组合物和多层光刻胶系统的多次曝光工艺
    • US07803521B2
    • 2010-09-28
    • US11942062
    • 2007-11-19
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara R. Varanasi
    • Kuang-Jung ChenWu-Song HuangWai-Kin LiPushkara R. Varanasi
    • G03F7/30
    • G03F7/0048G03F7/0035G03F7/0397G03F7/40
    • A photoresist composition and methods using the photoresist composition in multiple exposure/multiple layer processes. The photoresist composition includes a polymer comprising repeat units having a hydroxyl moiety; a photoacid generator; and a solvent. The polymer when formed on a substrate is substantially insoluble to the solvent after heating to a temperature of about 150° C. or greater. One method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second non photoresist layer on the substrate and patterned first photoresist layer. Another method includes forming a first photoresist layer on a substrate, patternwise exposing the first photoresist layer, forming a second photoresist layer on the substrate and patterned first photoresist layer and patternwise exposing the second photoresist layer.
    • 光致抗蚀剂组合物和在多次曝光/多层工艺中使用光致抗蚀剂组合物的方法。 光致抗蚀剂组合物包括包含具有羟基部分的重复单元的聚合物; 光致酸发生器; 和溶剂。 形成在基材上的聚合物在加热至约150℃或更高的温度之后基本上不溶于溶剂。 一种方法包括在衬底上形成第一光致抗蚀剂层,图案地暴露第一光致抗蚀剂层,在衬底上形成第二非光致抗蚀剂层并且形成图案化的第一光致抗蚀剂层。 另一种方法包括在衬底上形成第一光致抗蚀剂层,以图形方式暴露第一光致抗蚀剂层,在衬底上形成第二光致抗蚀剂层并图案化的第一光致抗蚀剂层和图案地曝光第二光致抗蚀剂层。
    • 8. 发明授权
    • Photoresist compositions
    • 光刻胶组合物
    • US08846296B2
    • 2014-09-30
    • US13461960
    • 2012-05-02
    • Kuang-Jung ChenWu-Song HuangRanee Wai-Ling KwongSen LiuPushkara R. Varanasi
    • Kuang-Jung ChenWu-Song HuangRanee Wai-Ling KwongSen LiuPushkara R. Varanasi
    • G03F7/004G03F7/028
    • G03F7/038G03F7/0045G03F7/0382G03F7/0392G03F7/095G03F7/20G03F7/2022G03F7/30G03F7/38G03F7/70466Y10S430/12
    • A composition is provided. The composition includes a polymer and a photosensitive acid generator capable of generating a first amount of acid upon exposure to a first dose of radiation and a second amount of acid upon exposure to a second dose of radiation. The second amount of acid is greater than the first amount of acid. The second dose is greater than the first dose. The composition includes a photosensitive base generator capable of generating a first amount of base upon exposure to the first dose and a second amount of base upon exposure to the second dose, where the first amount of base is greater than the first amount of acid and the second amount of base is less than the second amount of acid. The photosensitive base generator may include benzoin carbamates, O-carbamoylhydroxylamines, O-carbamoyloximes, aromatic sulfonamides, α-lactones, N-(2-Arylethenyl)amides, azides, amides, oximines, quaternary ammonium salts, or amineimides.
    • 提供了组合物。 组合物包括聚合物和感光酸产生剂,其能够在暴露于第一剂量的辐射时产生第一量的酸,并且在暴露于第二剂量的辐射时能够产生第二量的酸。 第二量的酸大于第一量的酸。 第二剂量大于第一剂量。 所述组合物包括能够在暴露于第一剂量时产生第一量碱的光敏碱产生剂,以及暴露于第二剂量时第二量的碱,其中第一量的碱大于第一量的酸, 碱的第二量少于第二量的酸。 光敏基底产生剂可以包括安息香氨基甲酸酯,O-氨基甲酰羟基胺,O-氨基甲酰肟,芳族磺酰胺,α-内酯,N-(2-亚乙烯基)酰胺,叠氮化物,酰胺,肟,季铵盐或胺酰胺。