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1. 发明申请

US20110195596A1 CONNECTOR 有权
标题翻译：连接器
公开(公告)号：US20110195596A1
公开(公告)日：2011-08-11
申请号：US13021836
申请日：2011-02-07
申请人： Kouji Sakakura , Daisuke Nakagawa
发明人： Kouji Sakakura , Daisuke Nakagawa
IPC分类号： H01R13/648 , H01R13/533
CPC分类号： H01R13/6581 , H01R13/516 , H01R13/582 , H01R13/73
摘要： A connector is provided for improving connection reliability between terminal fittings by preventing wires from shaking to prevent sliding movements of the terminal fittings. The connector includes a metallic shield shell (10) to be mounted at ends of a plurality of wires (50). The shield shell (10) includes a mounting portion (11) for fixing the connector to a case of a device, and the mounting portion (11) includes a wire fixing portion (20) for holding and fixing the plurality of wires (50) on a surface thereof at a draw-out side of the wires (50).
摘要翻译：提供了一种连接器，用于通过防止电线振动以防止端子配件的滑动运动来改善端子配件之间的连接可靠性。该连接器包括一个金属屏蔽外壳（10），用于安装在多条电线（50）的端部。屏蔽壳（10）包括用于将连接器固定到装置的壳体上的安装部分（11），并且安装部分（11）包括用于保持和固定多个电线（50）的电线固定部分（20）在电线（50）的拉出侧的表面上。

2. 发明授权

US08408934B2 Connector 有权
标题翻译：连接器
公开(公告)号：US08408934B2
公开(公告)日：2013-04-02
申请号：US13021836
申请日：2011-02-07
申请人： Kouji Sakakura , Daisuke Nakagawa
发明人： Kouji Sakakura , Daisuke Nakagawa
IPC分类号： H01R4/38
CPC分类号： H01R13/6581 , H01R13/516 , H01R13/582 , H01R13/73
摘要： A connector is provided for improving connection reliability between terminal fittings by preventing wires from shaking to prevent sliding movements of the terminal fittings. The connector includes a metallic shield shell (10) to be mounted at ends of a plurality of wires (50). The shield shell (10) includes a mounting portion (11) for fixing the connector to a case of a device, and the mounting portion (11) includes a wire fixing portion (20) for holding and fixing the plurality of wires (50) on a surface thereof at a draw-out side of the wires (50).
摘要翻译：提供了一种连接器，用于通过防止电线振动以防止端子配件的滑动运动来改善端子配件之间的连接可靠性。该连接器包括一个金属屏蔽外壳（10），用于安装在多条电线（50）的端部。屏蔽壳（10）包括用于将连接器固定到装置的壳体上的安装部分（11），并且安装部分（11）包括用于保持和固定多个电线（50）的电线固定部分（20）在电线（50）的拉出侧的表面上。

3. 发明申请

US20060273329A1 Semiconductor device 有权
公开(公告)号：US20060273329A1
公开(公告)日：2006-12-07
申请号：US11447567
申请日：2006-06-05
申请人： Hiroaki Ohta , Toshio Nishida , Daisuke Nakagawa
发明人： Hiroaki Ohta , Toshio Nishida , Daisuke Nakagawa
IPC分类号： H01L33/00 , H01L31/12 , H01L29/22 , H01L29/24 , H01L27/15 , H01L29/26
CPC分类号： H01L29/155 , B82Y20/00 , H01L29/2003 , H01L33/04 , H01L33/06 , H01L33/32 , H01S5/20 , H01S5/2009 , H01S5/3215 , H01S5/3216 , H01S5/34333
摘要： The semiconductor device according to the present invention includes a semiconductor layer containing plural band gap change thin films in which a band gap is continuously monotonously changed in a laminating direction. Therefore, the present invention provides a semiconductor device having high reliability and low electric resistance.

4. 发明申请

US20050040406A1 Semiconductor light emitting device 审中-公开
标题翻译：半导体发光器件
公开(公告)号：US20050040406A1
公开(公告)日：2005-02-24
申请号：US10889409
申请日：2004-07-12
申请人： Daisuke Nakagawa
发明人： Daisuke Nakagawa
IPC分类号： H01L27/15 , H01L33/06 , H01L33/32 , H01L33/42 , H01S5/323 , H01S5/343
CPC分类号： H01L33/32 , B82Y20/00 , H01L33/04
摘要： In a gallium nitride compound semiconductor, making small the thickness of a metal electrode layer in order to enhance the efficiency of taking light out relatively increases the resistance value of the metal electrode layer as measured in a direction that is parallel with this layer compared to that of it in a direction that is vertical with respect thereto. As a result of this, when a voltage has been applied across relevant electrodes, electric current ceases to be sufficiently supplied to the entire metal electrode layer. The semiconductor light emitting device of the invention is equipped, between the metal electrode layer and an active layer, with a superlattice layer for enhancing the efficiency of taking out the light that has been emitted in the active layer.
摘要翻译：在氮化镓化合物半导体中，为了提高取出光的效率，使金属电极层的厚度变小，相比于与该层平行的方向测定的金属电极层的电阻值相对地增加在相对于其垂直的方向上。结果，当跨相关电极施加电压时，电流不再充分地供应到整个金属电极层。本发明的半导体发光器件在金属电极层和有源层之间配置有超晶格层，用于提高取出在有源层中发射的光的效率。

5. 发明申请

US20120070678A1 ADHESIVE COMPOSITION, BONDING METHOD, LAMINATE AND TIRE 有权
标题翻译：粘合组合物，粘合方法，层压板和轮胎
公开(公告)号：US20120070678A1
公开(公告)日：2012-03-22
申请号：US13264101
申请日：2010-04-14
申请人： Yuwa Takahashi , Daisuke Nohara , Daisuke Nakagawa
发明人： Yuwa Takahashi , Daisuke Nohara , Daisuke Nakagawa
IPC分类号： B32B25/04 , C09D123/26 , B32B37/12
CPC分类号： B32B7/10 , B32B7/12 , B32B25/04 , B32B25/08 , B60C1/0008 , C08G59/302 , C08J5/124 , C08J2309/00 , C08J2329/04 , C08J2375/04 , C08J2463/00 , C09J5/06 , C09J119/006 , C09J163/00 , C09J2409/006 , C09J2421/006 , C09J2423/006 , C09J2423/046 , C09J2429/006 , C09J2463/00 , C09J2475/006 , Y10T156/12 , Y10T428/31725 , Y10T428/31855 , Y10T428/31931 , Y10T428/31938
摘要： An object of the present invention is to provide an adhesive composition which can bond a film to unvulcanized rubber strongly, and is flexible and rarely undergoes cracking under low temperature conditions; and a method for bonding a film to unvulcanized rubber using the adhesive composition. In addition, an object of the present invention is to provide a laminate formed by the bonding method; and a tire produced using the laminate. The adhesive composition of the present invention contains a polymer component which has a glass transition temperature or both a glass transition temperature and a melting point of 40° C. or lower, has a main chain having a random structure, has epoxy groups, and has sulfur-crosslinkable sites. The bonding method of the present invention is characterized by using the adhesive composition.
摘要翻译：本发明的目的是提供一种粘合剂组合物，其可以强力地将膜与未硫化橡胶结合，并且在低温条件下是柔性的并且很少发生开裂; 以及使用粘合剂组合物将膜粘合到未硫化橡胶的方法。另外，本发明的目的是提供一种通过接合方法形成的层压体; 以及使用该层叠体制造的轮胎。本发明的粘合剂组合物含有玻璃化转变温度或玻璃化转变温度和熔点为40℃以下的聚合物成分，具有无规结构的主链，具有环氧基，并具有硫交联点。本发明的粘合方法的特征在于使用粘合剂组合物。

6. 发明申请

US20070108519A1 Semiconductor light emitting device and method for manufacturing the same 审中-公开
标题翻译：半导体发光器件及其制造方法
公开(公告)号：US20070108519A1
公开(公告)日：2007-05-17
申请号：US10583092
申请日：2004-12-16
申请人： Norikazu Ito , Masayuki Sonobe , Daisuke Nakagawa
发明人： Norikazu Ito , Masayuki Sonobe , Daisuke Nakagawa
IPC分类号： H01L29/76
CPC分类号： H01L33/32 , H01L33/145
摘要： A semiconductor lamination portion (6) is formed by laminating at least an n-type layer (3) and a p-type layer (5) made of gallium nitride based compound semiconductor so as to form a light emitting portion, and a light transmitting conductive layer (7) is formed on a surface of the semiconductor lamination portion. An upper electrode (8) is formed so as to adhere to an exposed surface of the semiconductor lamination portion exposed by etching a part of the light transmitting conductive layer, and to the light transmitting conductive layer. An electric current blocking means (10) is formed on the exposed surface of the semiconductor lamination portion which is exposed through an opening (7a) of the light transmitting conductive layer, thereby significantly preventing electric current from flowing into a part under the upper electrode while ensuring good adhesion between the upper electrode and the surface of the semiconductor lamination portion. Consequently, there can be obtained a semiconductor light emitting device using gallium nitride based compound semiconductor wherein external quantum efficiency is improved by suppressing light emission under the upper electrode while enhancing adhesion between the upper electrode and the semiconductor layer.
摘要翻译：半导体层叠部分（6）通过层叠至少一个由氮化镓基化合物半导体制成的n型层（3）和p型层（5）形成，以形成发光部分导电层（7）形成在半导体层叠部分的表面上。形成上电极（8），以便通过蚀刻一部分透光导电层而露出的半导体层叠部分的露出表面和透光导电层。在通过透光导电层的开口（7a）暴露的半导体层叠部分的暴露表面上形成电流阻挡装置（10），从而显着地防止电流流入上电极同时确保上电极和半导体层叠部分的表面之间的良好粘合。因此，可以获得使用氮化镓基化合物半导体的半导体发光器件，其中通过抑制上部电极下的发光，同时增强上部电极和半导体层之间的粘附性来提高外部量子效率。

7. 发明授权

US08257096B2 Device connector 有权
标题翻译：设备连接器
公开(公告)号：US08257096B2
公开(公告)日：2012-09-04
申请号：US12942681
申请日：2010-11-09
申请人： Hiroyuki Matsuoka , Daisuke Nakagawa
发明人： Hiroyuki Matsuoka , Daisuke Nakagawa
IPC分类号： H01R12/00
CPC分类号： H01R13/748 , H01R13/504
摘要： A device connector is provided with a metal reinforcing plate (30) including an opening (31) for permitting the passage of terminal fittings, a housing main body (10), a flange (11) formed by insert molding using the reinforcing plate (30) and synthetic resin, a device-side housing portion (12) to be accommodated into a connector mounting hole, and terminal fittings (15) held in the housing main body (10) while being passed through the opening (31). The reinforcing plate (30) is beveled along a peripheral edge thereof to form an R-surface (36). Thus, the device connector is produced at a low cost and eliminates possible starting points of cracks created in the synthetic resin covering the peripheral edge of the metal reinforcing plate (30).
摘要翻译：一种设备连接器设置有金属加强板（30），其包括用于允许端子接头通过的开口（31），壳体主体（10），通过使用加强板（30）插入成型形成的凸缘（11））和合成树脂，容纳在连接器安装孔中的装置侧容纳部分（12）和在通过开口（31）的同时保持在壳体主体（10）中的端子接头（15）。加强板（30）沿着其周边边缘倾斜以形成R表面（36）。因此，以低成本制造器件连接器，并且消除了覆盖金属加强板（30）的周边边缘的合成树脂产生的裂缝的可能起点。

8. 发明授权

US08187030B2 Device connector 有权
标题翻译：设备连接器
公开(公告)号：US08187030B2
公开(公告)日：2012-05-29
申请号：US12917714
申请日：2010-11-02
申请人： Hiroyuki Matsuoka , Daisuke Nakagawa
发明人： Hiroyuki Matsuoka , Daisuke Nakagawa
IPC分类号： H01R13/73
CPC分类号： H01R13/5202 , H01R4/34 , H01R13/504 , H01R13/707 , H01R13/748 , H01R2105/00
摘要： A device connector has a housing main body (10), a device-side housing portion (12) to be accommodated in a connector mounting hole, a reinforcing plate (30) including an opening (31) for permitting the passage of terminal fittings, and a flange (11) formed by insert molding using the reinforcing plate (30) and synthetic resin, and terminal fittings 15. An outer peripheral end surface of the reinforcing plate (30) is exposed. The device connector is produced with a reduced cost by insert molding using a metal reinforcing plate as an insert while preventing a crack from being created in a synthetic resin portion covering the reinforcing plate (30).
摘要翻译：装置连接器具有壳体主体（10），容纳在连接器安装孔中的装置侧容纳部分（12），包括用于允许端子配件通过的开口（31）的加强板（30）以及通过使用加强板（30）和合成树脂的嵌件成型以及端子接头15形成的凸缘（11）。加强板（30）的外周端面露出。通过使用金属加强板作为插入件通过嵌入成型降低成本，同时防止在覆盖加强板（30）的合成树脂部分中产生裂纹。

9. 发明申请

US20100008391A1 Nitride based semiconductor device and fabrication method for the same 有权
标题翻译：氮化物基半导体器件及其制造方法
公开(公告)号：US20100008391A1
公开(公告)日：2010-01-14
申请号：US12379945
申请日：2009-03-04
申请人： Daisuke Nakagawa , Yoshinori Tanaka , Masahiro Murayama , Takao Fujimori , Shinichi Kohda
发明人： Daisuke Nakagawa , Yoshinori Tanaka , Masahiro Murayama , Takao Fujimori , Shinichi Kohda
IPC分类号： H01S5/00 , H01L29/205 , H01L29/15
CPC分类号： H01S5/34333 , B82Y20/00 , H01L29/2003 , H01S5/0021 , H01S5/0202 , H01S5/028 , H01S5/0282 , H01S5/0287 , H01S5/0425 , H01S5/2009 , H01S5/22 , H01S5/2214 , H01S5/305 , H01S5/3063 , H01S5/3201 , H01S5/3211 , H01S5/3215 , H01S5/3216 , H01S2301/173 , H01S2301/185
摘要： A nitride based semiconductor device includes: an n-type cladding layer; an n-type GaN based guide layer placed on the n-type cladding layer; an active layer placed on the n-type GaN based guide layer; a p-type GaN based guide layer placed on the active layer; an electron block layer placed on the p-type GaN based guide layer; a stress relaxation layer placed on the electron block layer; and a p-type cladding layer placed on the stress relaxation layer, and the nitride based semiconductor device alleviates the stress occurred under the influence of the electron block layer, does not affect light distribution by the electron block layer, reduces threshold current, can suppress the degradation of reliability, can suppress degradation of the emitting end surface of the laser beam, can improve the far field pattern, and is long lasting, and fabrication method of the device is also provided.
摘要翻译：氮化物基半导体器件包括：n型覆层; 放置在n型覆层上的n型GaN基引导层; 置于n型GaN基引导层上的有源层; 放置在有源层上的p型GaN基引导层; 放置在p型GaN基引导层上的电子阻挡层; 放置在电子阻挡层上的应力松弛层; 和位于应力松弛层上的p型覆层，并且氮化物基半导体器件减轻在电子阻挡层的影响下发生的应力，不影响电子阻挡层的光分布，降低阈值电流，可以抑制可靠性的劣化可以抑制激光束的发射端面的劣化，可以提高远场图案，并且持久，并且还提供了该装置的制造方法。

10. 发明申请

US20090114328A1 INNERLINER FOR TIRE AND TIRE USING THE SAME 审中-公开
标题翻译：轮胎和轮胎内胆使用相同
公开(公告)号：US20090114328A1
公开(公告)日：2009-05-07
申请号：US12265403
申请日：2008-11-05
申请人： Yuuwa Takahashi , Daisuke Nohara , Daisuke Nakagawa , Kentaro Fujino
发明人： Yuuwa Takahashi , Daisuke Nohara , Daisuke Nakagawa , Kentaro Fujino
IPC分类号： B60C19/00 , B29D30/06
CPC分类号： C08J7/123 , B29C35/02 , B29C65/14 , B29C65/1403 , B29C65/1406 , B29C65/1422 , B29C65/8223 , B29C65/8253 , B29C66/1122 , B29C66/45 , B29C66/71 , B29C66/712 , B29C66/72141 , B29C66/72341 , B29C66/7392 , B29C2035/085 , B29C2035/0877 , B29D30/0681 , B29D2030/0682 , B29L2030/008 , B32B2038/0076 , B32B2310/0887 , B32B2319/00 , B32B2398/00 , B60C1/0008 , B60C5/14 , C08J2321/00 , B29K2021/00 , B29K2021/003 , B29K2075/00 , B29K2023/086 , B29K2077/00
摘要： An innerliner for tire is formed by laminating a composition containing an elastomer component onto a resin layer and then irradiating energy beams required for generating partial crosslinking between the resin layer and the elastomer component.
摘要翻译：轮胎用内衬通过将含有弹性体成分的组合物层压到树脂层上，然后在树脂层和弹性体成分之间照射产生部分交联所需的能量束而形成。

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