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    • 7. 发明授权
    • Arrangement for heating the suction gases of an internal combustion
engine
    • 用于加热内燃机的吸入气体的装置
    • US3970062A
    • 1976-07-20
    • US612519
    • 1975-09-11
    • Masahiko NakadaTakehiko Maekawa
    • Masahiko NakadaTakehiko Maekawa
    • F02M31/08F28D7/00F02M31/00
    • F28D7/0008F02M31/0825Y02T10/126
    • An internal combustion with an arrangement for heating the suction gases in order to promote the vaporization of the fuel contained within the suction gases is disclosed. In the arrangement, the exhaust gases exhausted from the engine are routed around fins formed on the exterior wall of the bottom floor of the intake manifold for receiving the heat of the exhaust gases, and a covering is provided for enclosing the fins of the intake manifold in a closed chamber which is defined between the covering and the exterior wall of the intake manifold. The covering is provided with inlet and outlet ports so as to introduce the exhaust gases into the chamber and so as to drain the exhaust gases from the chamber. The introduced exhaust gases heat the entire surface of each fin so that the heat of the exhaust gases is transmitted to the fuel within the suction gases thereby accelerating vaporization of the fuel.
    • 公开了一种具有用于加热吸入气体以便促进吸入气体中所含的燃料蒸发的装置的内部燃烧。 在该布置中,从发动机排出的废气绕在形成在进气歧管的底部底部的外壁上的翅片周围,以接收排气的热量,并且设置用于封闭进气歧管的翅片的盖 在封闭的腔室中,其被限定在进气歧管的覆盖物和外壁之间。 覆盖物设置有入口和出口,以便将废气引入室中,以便从室中排出废气。 引入的废气加热每个翅片的整个表面,使得废气的热量传递到吸入气体内的燃料,从而加速燃料的汽化。
    • 8. 发明授权
    • Apparatus and method for measuring alignment accuracy, as well as method and system for manufacturing semiconductor device
    • 用于测量对准精度的装置和方法,以及用于制造半导体器件的方法和系统
    • US06897956B2
    • 2005-05-24
    • US10235656
    • 2002-09-06
    • Minori NoguchiMasahiko NakadaTakahiko SuzukiTaketo UenoToshihiko NakataShunji Maeda
    • Minori NoguchiMasahiko NakadaTakahiko SuzukiTaketo UenoToshihiko NakataShunji Maeda
    • G01B11/00G01B11/27H01L21/027H01L21/66H05K1/02H05K3/46
    • G01B11/272H05K1/0269H05K3/4638
    • An apparatus for measuring an alignment accuracy between overlaid alignment marks formed to each of alignment mark portions on every plural chip units or exposure units arranged on a substrate to be measured, comprising: an XY stage running in a direction x and in a direction y while mounting the substrate; an illumination optical system for illuminating each of the alignment mark portions in a state where the XY stage runs in a direction x which is a direction of arranging the chips; a detecting optical system having an objective lens for collecting a reflection light in the running state obtained from the overlaid alignment marks, a focusing optical system for focusing the reflection light in the running state obtained from the objective lens, a scanning optical system for scanning reflection light image in the running state focused by the focusing optical system in a direction opposite to that of the running and a linear image sensor receiving reflection light image substantially in a static state being scanned in the opposite direction by the scanning optical system and converting them into image signal; and an alignment accuracy calculation device for measuring the alignment accuracy between the overlaid alignment marks at least for a direction perpendicular to the running direction based on the image signal converted by the linear image sensor.
    • 一种用于测量在布置在待测量基板上的每个多个芯片单元或曝光单元上形成的每个对准标记部分上的重叠对准标记之间的对准精度的装置,包括:沿x方向和y方向运行的XY台, 安装基板; 照明光学系统,用于在XY台在作为排列芯片的方向的方向x上行进的状态下照亮每个对准标记部分; 一种检测光学系统,具有用于收集从重叠的对准标记获得的运行状态的反射光的物镜,用于将反射光聚焦在从物镜获得的运行状态的聚焦光学系统,用于扫描反射的扫描光学系统 聚焦光学系统以与行进方向相反的方向聚焦的运行状态的光图像和接收基本处于静止状态的反射光图像的线性图像传感器被扫描光学系统沿相反方向扫描并将其转换成 图像信号; 以及对准精度计算装置,用于根据由线性图像传感器转换的图像信号,至少对垂直于行进方向的方向测量重叠的对准标记之间的对准精度。