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1. 发明授权

US06969456B2 Method of using vertically configured chamber used for multiple processes 有权
标题翻译：使用垂直配置的室用于多个过程的方法
公开(公告)号：US06969456B2
公开(公告)日：2005-11-29
申请号：US10041029
申请日：2001-12-28
申请人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
发明人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25D7/12 , H01L21/00 , H01L21/02 , H01L21/3063 , C25F3/00 , B08B3/04
CPC分类号： H01L21/6719 , C25D7/12 , C25D17/001 , H01L21/67028 , Y10S134/902
摘要： The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.
摘要翻译：本发明涉及一种用于进行多个处理步骤的容纳室，例如沉积，抛光，蚀刻，改性，漂洗，清洁和干燥工件上的表面。在本发明的一个实例中，室用于在半导体晶片上化学机械地沉积导电材料。然后可以使用相同的容纳室来冲洗和清洁相同的晶片。结果，本发明消除了对用于沉积导电材料和清洁晶片的单独处理站的需要。因此，利用本发明，降低了成本和物理空间，同时提供了使用容纳室在晶片表面上执行多个工艺的有效的装置和方法。

2. 发明授权

US06352623B1 Vertically configured chamber used for multiple processes 有权
公开(公告)号：US06352623B1
公开(公告)日：2002-03-05
申请号：US09466014
申请日：1999-12-17
申请人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
发明人： Konstantin Volodarsky , Boguslaw A. Nagorski , Rimma Volodarsky , Douglas W. Young , Cyprian Uzoh , Homayoun Talieh
IPC分类号： C25B900
CPC分类号： H01L21/6719 , C25D7/12 , C25D17/001 , H01L21/67028 , Y10S134/902
摘要： The present invention relates to a containment chamber that is used for carrying out multiple processing steps such as depositing on, polishing, etching, modifying, rinsing, cleaning, and drying a surface on the workpiece. In one example of the present invention, the chamber is used to electro chemically mechanically deposit a conductive material on a semiconductor wafer. The same containment chamber can then be used to rinse and clean the same wafer. As a result, the present invention eliminates the need for separate processing stations for depositing the conductive material and cleaning the wafer. Thus, with the present invention, costs and physical space are reduced while providing an efficient apparatus and method for carrying out multiple processes on the wafer surface using a containment chamber.

3. 发明授权

US06482307B2 Method of and apparatus for making electrical contact to wafer surface for full-face electroplating or electropolishing 有权
标题翻译：用于全面电镀或电解抛光的与晶片表面电接触的方法和装置
公开(公告)号：US06482307B2
公开(公告)日：2002-11-19
申请号：US09735546
申请日：2000-12-14
申请人： Jalal Ashjaee , Boguslaw A. Nagorski , Bulent M. Basol , Homayoun Talieh , Cyprian Uzoh
发明人： Jalal Ashjaee , Boguslaw A. Nagorski , Bulent M. Basol , Homayoun Talieh , Cyprian Uzoh
IPC分类号： C25D518
CPC分类号： C25D17/001 , C25D7/123 , C25D17/005 , C25F7/00 , H01L21/2885
摘要： Deposition of conductive material on or removal of conductive material from a wafer frontal side of a semiconductor wafer is performed by providing an anode having an anode area which is to face the wafer frontal side, and electrically connecting the wafer frontal side with at least one electrical contact, outside of the anode area, by pushing the electrical contact and the wafer frontal side into proximity with each other. A potential is applied between the anode and the electrical contact, and the wafer is moved with respect to the anode and the electrical contact. Full-face electroplating or electropolishing over the wafer frontal side surface, in its entirety, is thus permitted.
摘要翻译：通过提供具有面向晶片正面的阳极区域的阳极和将晶片正面与至少一个电气电连接来进行导电材料沉积在半导体晶片的晶片正面上或从晶片正面去除导电材料通过将电接触和晶片正面推动到彼此靠近来接触阳极区域外部。在阳极和电接触之间施加电势，并且晶片相对于阳极和电触点移动。因此允许在整个晶片正面侧面上进行全面电镀或电解抛光。

4. 发明授权

US07059944B2 Integrated system for processing semiconductor wafers 有权
公开(公告)号：US07059944B2
公开(公告)日：2006-06-13
申请号：US10369118
申请日：2003-02-18
申请人： Jalal Ashjaee , Boris Govzman , Bernard M. Frey , Boguslaw A. Nagorski , Douglas W. Young , Bulent M. Basol , Homayoun Talieh
发明人： Jalal Ashjaee , Boris Govzman , Bernard M. Frey , Boguslaw A. Nagorski , Douglas W. Young , Bulent M. Basol , Homayoun Talieh
IPC分类号： B24B1/00
CPC分类号： H01L21/67745 , B24B37/345 , G05B19/41865 , G05B2219/32272 , G05B2219/45031 , H01L21/67028 , H01L21/67034 , H01L21/67046 , H01L21/67051 , H01L21/67173 , H01L21/67219 , H01L21/68707 , H01L21/68728 , Y02P90/20
摘要： An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable housing. In the cleaning and drying module, a cleaning mechanism is used to clean the workpiece while the workpiece is rotated and held by a support stucture of the movable housing. A drying mechanism of the cleaning and drying module picks up the workpiece from the moveable housing and spin dries it. Throughout the CMP process, cleaning and drying, the processed surface of the wafer faces down.

5. 发明授权

US5558568A Wafer polishing machine with fluid bearings 失效
标题翻译：晶圆抛光机带流体轴承
公开(公告)号：US5558568A
公开(公告)日：1996-09-24
申请号：US333463
申请日：1994-11-02
申请人： Homayoun Talieh , David E. Weldon , Boguslaw A. Nagorski
发明人： Homayoun Talieh , David E. Weldon , Boguslaw A. Nagorski
IPC分类号： B24B21/00 , B24B21/06 , B24B37/12 , B24B37/20 , H01L21/304
CPC分类号： B24B37/20 , B24B21/06 , B24B37/12
摘要： A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. The support includes multiple fluid bearings that support the polishing pad assembly on the support. These fluid bearings are arranged concentrically to provide concentric regions of support for the polishing pad assembly, and each fluid bearing is coupled to a respective source of pressurized fluid at a respective pressure.
摘要翻译：具有抛光垫组件和晶片保持器的半导体晶片抛光机包括邻近抛光垫组件定位的支撑件。支撑件包括支撑在支撑件上的抛光垫组件的多个流体轴承。这些流体轴承同心布置以提供用于抛光垫组件的同心的支撑区域，并且每个流体轴承在相应的压力下联接到相应的加压流体源。

6. 发明授权

US07211174B2 Method and system to provide electrical contacts for electrotreating processes 失效
标题翻译：为电镀工艺提供电接点的方法和系统
公开(公告)号：US07211174B2
公开(公告)日：2007-05-01
申请号：US10283025
申请日：2002-10-28
申请人： Bulent M Basol , Homayoun Talieh , Boguslaw A. Nagorski , Cyprian E. Uzoh , Jeffrey A. Bogart
发明人： Bulent M Basol , Homayoun Talieh , Boguslaw A. Nagorski , Cyprian E. Uzoh , Jeffrey A. Bogart
IPC分类号： C25D17/00
CPC分类号： C25D17/001 , C25D17/005 , H01L21/2885 , H01L21/3212 , H01L21/67086 , H01L21/76877
摘要： Systems and methods to provide electrical contacts to a workpiece to facilitate electrotreating processes, including electroplating and electroetching processes are presented.
摘要翻译：提供了向工件提供电接触以促进电镀工艺（包括电镀和电蚀工艺）的系统和方法。

7. 发明授权

US5593344A Wafer polishing machine with fluid bearings and drive systems 失效
标题翻译：晶圆抛光机带流体轴承和驱动系统
公开(公告)号：US5593344A
公开(公告)日：1997-01-14
申请号：US321085
申请日：1994-10-11
申请人： David E. Weldon , Boguslaw A. Nagorski , Homayoun Talieh
发明人： David E. Weldon , Boguslaw A. Nagorski , Homayoun Talieh
IPC分类号： B24B21/00 , B24B21/06 , B24B37/12 , B24B37/20 , H01L21/304
CPC分类号： B24B37/20 , B24B21/06 , B24B37/12
摘要： A semi-conductor wafer polishing machine having a polishing pad assembly and a wafer holder includes a support positioned adjacent the polishing pad assembly. This support has at least one fluid inlet connectable to a source of fluid at a higher pressure, at least one fluid outlet connectable to a fluid drain at a lower pressure, and at least one bearing surface over which fluid flows from the source to the drain. The polishing pad is supported by the fluid over the bearing surface for low-friction movement with respect to the support. Similar fluid bearings can be used in the wafer holder. An array of generally parallel grooves is provided on a belt support surface to reduce hydroplaning of a polishing belt. A turbine drive system rotates a wafer chuck in a wafer holder.
摘要翻译：具有抛光垫组件和晶片保持器的半导体晶片抛光机包括邻近抛光垫组件定位的支撑件。该支撑件具有至少一个可在较高压力下连接到流体源的流体入口，至少一个可在较低压力下连接到流体排放口的流体出口以及至少一个支承表面，流体从该流体从源流向排水管。抛光垫由轴承表面上的流体支撑，用于相对于支撑件的低摩擦运动。类似的流体轴承可用于晶片保持器。大致平行的凹槽的阵列设置在带支撑表面上以减少抛光带的滑动。涡轮驱动系统将晶片卡盘旋转在晶片保持器中。

8. 发明授权

US4447019A Magnetic tape cartridge with resilient belt driving means and separate tape and belt idlers 失效
标题翻译：带有弹性带驱动装置和单独的带和带惰轮的磁带盒
公开(公告)号：US4447019A
公开(公告)日：1984-05-08
申请号：US307147
申请日：1981-09-30
申请人： Boguslaw A. Nagorski
发明人： Boguslaw A. Nagorski
IPC分类号： G11B15/26 , G11B23/087 , G11B23/04
CPC分类号： G11B15/26 , G11B23/08778
摘要： A tape cartridge has a roller driven continuous resilient belt which supports a wide thin tape when transported in the vincinity of video recording machine heads. The belt turns a tape take-up reel at a peripheral speed greater than the belt turns a tape supply reel thereby applying tension to the tape as it is transported past the heads. Since the belt both supports and supplies tension to the tape, tape bounce is minimized in the vicinity of the machine heads. Separate idlers guide the belt and tape from the supply reel to the machine heads, and separate idlers guide the belt and the tape from the heads to the take-up reel allowing a smooth take-up reel to be built as the tape is transported.
摘要翻译：带盒具有滚筒驱动的连续弹性带，当在视频记录机头部的垂直方向上传送时，其支撑宽的薄带。带子以大于皮带转动磁带供应卷轴的圆周速度转动磁带卷绕卷轴，从而当磁带运送通过磁头时对磁带施加张力。由于皮带两者都支撑并向胶带提供张力，所以在机头附近使胶带反弹最小化。单独的惰轮将皮带和胶带从供带盘引导到机头，分离的惰轮将皮带和胶带从头部引导到卷取卷轴，允许在胶带运输时构建光滑的卷取卷轴。

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