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1. 发明授权

US08177598B2 Display manufacturing method 失效
标题翻译：显示制造方法
公开(公告)号：US08177598B2
公开(公告)日：2012-05-15
申请号：US13021672
申请日：2011-02-04
申请人： Fumio Hata , Toshimitsu Tanaka , Kentaro Yamamoto
发明人： Fumio Hata , Toshimitsu Tanaka , Kentaro Yamamoto
IPC分类号： H01J9/24
CPC分类号： G02F1/1341 , H01J9/241
摘要： In a display manufacturing method including bonding of a light-transmissive substrate onto a display surface of a display body, the bonding includes bending the light-transmissive substrate into an arch-like shape with a bonding surface thereof having a convex shape. An adhesive sandwiched is put between a bonding surface of the display body and a top of a bonding surface of the bent light-transmissive substrate. The bend of the light-transmissive substrate is released while moving two rollers from a center of the light-transmissive substrate in a direction of the bend of the light-transmissive substrate towards both terminal edges of the light-transmissive substrate in mutually reverse directions. The two rollers press a non-bonding surface of the light-transmissive substrate against the display body.
摘要翻译：在包括将透光性基板键合到显示体的显示面上的显示制造方法中，所述接合包括将所述透光性基板弯曲成具有凸形状的接合面的拱形。在显示体的接合面和弯曲的透光性基板的接合面的顶部之间夹着夹着粘接剂。在透光性基板的中心沿着透光性基板的弯曲方向朝向相反方向的透光性基板的两端缘移动两辊的同时，释放透光性基板的弯曲。两个辊将透光基板的非接合表面压在显示体上。

2. 发明申请

US20110195631A1 DISPLAY MANUFACTURING METHOD 失效
标题翻译：显示制造方法
公开(公告)号：US20110195631A1
公开(公告)日：2011-08-11
申请号：US13021672
申请日：2011-02-04
申请人： Fumio Hata , Toshimitsu Tanaka , Kentaro Yamamoto
发明人： Fumio Hata , Toshimitsu Tanaka , Kentaro Yamamoto
IPC分类号： H01J9/20
CPC分类号： G02F1/1341 , H01J9/241
摘要： In a display manufacturing method including bonding of a light-transmissive substrate onto a display surface of a display body, the bonding includes bending the light-transmissive substrate into an arch-like shape with a bonding surface thereof having a convex shape. An adhesive sandwiched is put between a bonding surface of the display body and a top of a bonding surface of the bent light-transmissive substrate. The bend of the light-transmissive substrate is released while moving two rollers from a center of the light-transmissive substrate in a direction of the bend of the light-transmissive substrate towards both terminal edges of the light-transmissive substrate in mutually reverse directions. The two rollers press a non-bonding surface of the light-transmissive substrate against the display body.
摘要翻译：在包括将透光性基板键合到显示体的显示面上的显示制造方法中，所述接合包括将所述透光性基板弯曲成具有凸形状的接合面的拱形。在显示体的接合面和弯曲的透光性基板的接合面的顶部之间夹着夹着粘接剂。在透光性基板的中心沿着透光性基板的弯曲方向朝向相反方向的透光性基板的两端缘移动两辊的同时，释放透光性基板的弯曲。两个辊将透光基板的非接合表面压在显示体上。

3. 发明授权

US06967333B2 Two dimensional image pick-up apparatus 失效
标题翻译：二维图像拾取装置
公开(公告)号：US06967333B2
公开(公告)日：2005-11-22
申请号：US10852196
申请日：2004-05-25
申请人： Fumio Hata
发明人： Fumio Hata
IPC分类号： H04N5/32 , A61B6/04 , G01T1/164 , G01T1/20 , G01T1/29 , H01L27/14 , H04N5/335 , H04N5/369 , H05G1/00 , G01T1/24
CPC分类号： G01T1/2928 , G01T1/1648 , G01T1/2018
摘要： An image pickup apparatus for X-ray photography is structurally adapted to absorb external impacts and possible resultant deformations such as deflections of the cabinet so that the interior is protected against damage and remains intact if the cabinet is deformed by the external load. The two-dimensional image pickup apparatus comprises a substrate, two-dimensional photoelectric converters formed on the substrate and an apparatus cabinet containing the substrate and the photoelectric converters in the inside, at least part of the apparatus cabinet being deformable and capable of restore the original profile or a plurality of containers such as air bags being inserted into the gap between said substrate and said apparatus cabinet to prevent the inner wall surface of said apparatus cabinet and said substrate from contacting each other.
摘要翻译：用于X射线摄影的图像拾取装置在结构上适用于吸收外部冲击和可能产生的变形，例如机柜的偏转，使得内部被保护免受损坏并且如果机壳由外部负载变形则保持完整。二维图像拾取装置包括基板，形成在基板上的二维光电转换器和在内部容纳基板和光电转换器的装置机柜，装置机柜的至少一部分可变形并能够恢复原稿轮廓或多个容器，例如气囊被插入到所述基片和所述装置机柜之间的间隙中，以防止所述装置机柜和所述基片的内壁表面彼此接触。

4. 发明授权

US06383835B1 IC package having a conductive material at least partially filling a recess 失效
标题翻译： IC封装，其具有至少部分填充凹部的导电材料
公开(公告)号：US06383835B1
公开(公告)日：2002-05-07
申请号：US08707046
申请日：1996-08-30
申请人： Fumio Hata , Tadashi Kosaka , Hisatane Komori
发明人： Fumio Hata , Tadashi Kosaka , Hisatane Komori
IPC分类号： H01L2144
CPC分类号： H01L25/167 , H01L24/97 , H01L31/0203 , H01L33/486 , H01L2224/48091 , H01L2224/48227 , H01L2224/48247 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01027 , H01L2924/01033 , H01L2924/01057 , H01L2924/01078 , H01L2924/01082 , H01L2924/09701 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/15313 , H01L2924/15787 , H01L2924/181 , H01L2224/85 , H01L2924/00014 , H01L2924/00
摘要： An IC package has a substrate having recesses formed on the side wall thereof, an insulating film for covering an opening of each recess on the side of a principal surface of the substrate, and an IC chip mounted on a mount surface side of the film on the substrate, wherein a conductive portion formed on each recess is used as an external connection terminal for the IC chip. A method of assembling an IC package has the steps of forming a substrate having a plurality of through holes each having an insulating film covering one of the openings of each through hole, mounting one or more IC chips on a principal surface of the substrate on the insulating film side, and electrically connecting the IC chip and the through holes, sealing the substrate with the IC chip mounted thereon with insulating resin, and cut the substrate with the IC chip mounted thereon to expose the side wall of each through hole.
摘要翻译： IC封装具有形成在其侧壁上的凹部的基板，用于覆盖基板的主表面侧的每个凹部的开口的绝缘膜和安装在膜的安装表面侧上的IC芯片基板，其中形成在每个凹部上的导电部分用作IC芯片的外部连接端子。一种组装IC封装的方法，具有以下步骤：形成具有多个通孔的基板，每个通孔具有覆盖每个通孔中的一个开口的绝缘膜，将一个或多个IC芯片安装在基板的主表面上绝缘膜侧，并且将IC芯片和通孔电连接，用安装有绝缘树脂的IC芯片密封基板，并且用安装在其上的IC芯片切割基板以暴露每个通孔的侧壁。

5. 发明授权

US4443090A Electromagnetic transmitting apparatus for a camera 失效
标题翻译：照相机电磁发射装置
公开(公告)号：US4443090A
公开(公告)日：1984-04-17
申请号：US293945
申请日：1981-08-18
申请人： Hideaki Miyakawa , Yasuki Takahashi , Fumio Hata
发明人： Hideaki Miyakawa , Yasuki Takahashi , Fumio Hata
IPC分类号： G03B17/02 , G03B17/00
CPC分类号： G03B17/00
摘要： An electromagnetic transmitting apparatus for a camera includes a first device at the main body of the camera to convert electric energy within the camera main body to magnetic energy, and a second device to receive the magnetic energy and convert it into electric energy. The second device is in a unit which can be mounted on the camera body, so that the electric energy at the camera main body is transmitted to the unit including the second device when the unit is mounted on the camera main body.
摘要翻译：一种用于照相机的电磁发射装置，包括在摄像机主体处的第一装置，用于将照相机主体内的电能转换为磁能;以及第二装置，用于接收磁能并将其转换为电能。第二装置是可以安装在照相机主体上的单元，使得当该单元安装在照相机主体上时，相机主体的电能被传送到包括第二装置的单元。

6. 发明授权

US06495836B1 Two-dimensional image pickup apparatus 失效
标题翻译：二维图像拾取装置
公开(公告)号：US06495836B1
公开(公告)日：2002-12-17
申请号：US09237921
申请日：1999-01-27
申请人： Fumio Hata
发明人： Fumio Hata
IPC分类号： G01T129
CPC分类号： G01T1/2018 , H05K1/056 , H05K1/181
摘要： A compact and lightweight two-dimensional image pickup apparatus comprises two-dimensional photoelectric converters arranged on a substrate, a base member for supporting the substrate, electronic parts for processing the electric signals of said photoelectric converters and an apparatus cabinet containing the above components, wherein said base member is formed by a metal-based printed circuit board and said electronic parts are mounted on said base member or, alternatively, said base member and part or all of said apparatus cabinet are formed by a metal-based printed circuit board and said electronic parts are mounted on said printed circuit board.
摘要翻译：紧凑且重量轻的二维图像拾取装置包括布置在基板上的二维光电转换器，用于支撑基板的基座部件，用于处理所述光电转换器的电信号的电子部件和包含上述部件的装置机柜，其中所述基座部件由金属基印刷电路板形成，所述电子部件安装在所述基座部件上，或者所述基座部件和所述装置机架的一部分或全部由金属基印刷电路板形成，电子部件安装在所述印刷电路板上。

7. 发明授权

US5254847A Contact-type image sensor assembly having supporting structure for maintaining predetermined distance between the lens and the original and the sensor 失效
标题翻译：接触式图像传感器组件，其具有用于保持透镜与原稿之间的预定距离和传感器的支撑结构
公开(公告)号：US5254847A
公开(公告)日：1993-10-19
申请号：US863762
申请日：1992-04-06
申请人： Fumio Hata , Kenji Nagata
发明人： Fumio Hata , Kenji Nagata
IPC分类号： H04N1/028 , G02B7/02 , H04N1/031 , H01J40/14 , H01J5/02
CPC分类号： H04N1/0312 , H04N1/0315 , H04N1/0318 , H04N2201/02406 , H04N2201/02425 , H04N2201/02452 , H04N2201/03112 , H04N2201/03154
摘要： A contact-type image sensor assembly including: an image sensor; a light source for illuminating an original document which has image information; an optical lens for imaging light reflected by the original document onto the image sensor; and a supporting member for supporting the image sensor, the light source and the optical lens, wherein the supporting member includes: a first supporting member for maintaining the distance from the surface of the original document and the light incidental side of the optical lens at a predetermined distance; a second supporting member disposed individually from the first supporting member and acting to maintain the distance from the light emission side of the optical lens to the light receiving side of the image sensor; and a third supporting member for supporting the first and second supporting members at predetermined positions and the third supporting member supports the first and second supporting members in this way that their positions can be adjusted.

8. 发明授权

US07349561B2 Fingerprint input device and personal authentication system utilizing the same 失效
标题翻译：指纹输入设备和使用其的个人认证系统
公开(公告)号：US07349561B2
公开(公告)日：2008-03-25
申请号：US10853245
申请日：2004-05-26
申请人： Fumio Hata
发明人： Fumio Hata
IPC分类号： G06K9/00
CPC分类号： G06K9/0004
摘要： The invention provides a fingerprint input device with a small area and a compact structure, and being manufactured in a simple process, comprising an LED for emitting into a finger a light, an image pickup unit for receiving the light scattered inside the finger, a peripheral circuit unit connected to the image pickup unit 1a, a silicon chip 1 bearing image pickup elements constituting the image pickup unit and the peripheral circuit unit, and a fiber optics plate fixed on the silicon chip, having a surface on which the finger is placed and constituting light transmission portion for transmitting the light, scattered inside the finger placed on the surface to the image pickup element along a direction inclined by a predetermined angle. At least a part of the peripheral circuit unit is formed on the silicon chip opposed to a non-light-transmitting area of the fiber optics plate.
摘要翻译：本发明提供一种具有小面积和紧凑结构的指纹输入装置，并且以简单的过程制造，包括用于将光发射到手指中的LED，用于接收在手指内散射的光的图像拾取单元，外围连接到图像拾取单元1a的电路单元，构成图像拾取单元和外围电路单元的图像拾取元件的硅芯片1和固定在硅芯片上的光纤板，具有放置手指的表面并且构成用于将沿着倾斜预定角度的方向散射在放置在表面上的手指内的光透射到图像拾取元件的光透射部分。外围电路单元的至少一部分形成在与光纤板的非透光区域相对的硅芯片上。

9. 发明授权

US06897449B1 Two-dimensional image pickup apparatus 有权
标题翻译：二维图像拾取装置
公开(公告)号：US06897449B1
公开(公告)日：2005-05-24
申请号：US09238501
申请日：1999-01-27
申请人： Fumio Hata
发明人： Fumio Hata
IPC分类号： H04N5/32 , A61B6/04 , G01T1/164 , G01T1/20 , G01T1/29 , H01L27/14 , H04N5/335 , H04N5/369 , H05G1/00
CPC分类号： G01T1/2928 , G01T1/1648 , G01T1/2018
摘要： An image pickup apparatus for X-ray photography is structurally adapted to absorb external impacts and possible resultant deformations such as deflections of the cabinet so that the interior is protected against damage and remains intact if the cabinet is deformed by the external load. The two-dimensional image pickup apparatus comprises a substrate, two-dimensional photoelectric converters formed on the substrate and an apparatus cabinet containing the substrate and the photoelectric converters. At least part of the apparatus cabinet is deformable and capable of restoring its original profile. A plurality of containers such as air bags may also be inserted into the gap between the substrate and the apparatus cabinet to prevent the inner wall surface of the apparatus cabinet and the substrate from contacting each other.
摘要翻译：用于X射线摄影的图像拾取装置在结构上适用于吸收外部冲击和可能产生的变形，例如机柜的偏转，使得内部被保护免受损坏并且如果机壳由外部负载变形则保持完整。二维图像拾取装置包括基板，形成在基板上的二维光电转换器和包含基板和光电转换器的装置机壳。装置柜的至少一部分是可变形的并且能够恢复其原始轮廓。多个容器如气囊也可以插入到基片和装置机柜之间的间隙中，以防止装置柜和基片的内壁表面彼此接触。

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