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1. 发明授权

US08686299B2 Electronic element unit and reinforcing adhesive agent 有权
标题翻译：电子元件单元和增强粘合剂
公开(公告)号：US08686299B2
公开(公告)日：2014-04-01
申请号：US13382368
申请日：2010-05-26
申请人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
发明人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
IPC分类号： H05K1/16 , H05K3/34 , H05K3/30
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/98 , H01L2224/0401 , H01L2224/06151 , H01L2224/06155 , H01L2224/131 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17135 , H01L2224/17179 , H01L2224/17505 , H01L2224/17517 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32052 , H01L2224/32225 , H01L2224/33179 , H01L2224/73203 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/81194 , H01L2224/8121 , H01L2224/8159 , H01L2224/81599 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81616 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81815 , H01L2224/81855 , H01L2224/81905 , H01L2224/83104 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/8321 , H01L2224/8359 , H01L2224/83599 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83616 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83855 , H01L2224/92125 , H01L2224/9221 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01048 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/225 , H05K3/3436 , H05K2203/0425 , H05K2203/176 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2224/73204 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： An electronic element unit (1) includes an electronic element (2) having a plurality of connecting terminals (12) on a lower surface thereof, a circuit board (3) having a plurality of electrodes (22) corresponding to the connecting terminals (12) on an upper surface thereof. The connecting terminals (12) and the electrodes (22) are connected by solder bumps (23), and the electronic element (2) and the circuit board (3) are partly bond by a resin bond part (24) made of a thermosetting material of a thermosetting resin, and a metal powder (25) is included in the resin bond parts (24) in a dispersed state. The metal powder (25) has a melting point lower than a temperature at which the resin bond parts (24) are heated when a work (a repairing work) is carried out for removing the electronic element (2) from the circuit board (3).
摘要翻译：电子元件单元（1）包括在其下表面上具有多个连接端子（12）的电子元件（2），具有对应于连接端子（12）的多个电极（22）的电路板（3））在其上表面。连接端子（12）和电极（22）通过焊锡凸块（23）连接，电子元件（2）和电路板（3）通过由热固性树脂制成的树脂粘接部分（24）热固性树脂的材料和金属粉末（25）以分散状态包含在树脂粘合部分（24）中。当进行从电路板（3）移除电子元件（2）的工件（修理作业）时，金属粉末（25）的熔点低于加热树脂接合部分（24）的温度）。

2. 发明申请

US20120111617A1 ELECTRONIC ELEMENT UNIT AND REINFORCING ADHESIVE AGENT 有权
标题翻译：电子元件和增强胶粘剂
公开(公告)号：US20120111617A1
公开(公告)日：2012-05-10
申请号：US13382368
申请日：2010-05-26
申请人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
发明人： Koji Motomura , Seiichi Yoshinaga , Tadahiko Sakai
IPC分类号： H05K1/09
CPC分类号： H05K3/305 , H01L21/563 , H01L23/295 , H01L24/13 , H01L24/16 , H01L24/17 , H01L24/29 , H01L24/30 , H01L24/32 , H01L24/33 , H01L24/73 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/98 , H01L2224/0401 , H01L2224/06151 , H01L2224/06155 , H01L2224/131 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17051 , H01L2224/17135 , H01L2224/17179 , H01L2224/17505 , H01L2224/17517 , H01L2224/29 , H01L2224/29101 , H01L2224/2919 , H01L2224/29298 , H01L2224/32052 , H01L2224/32225 , H01L2224/33179 , H01L2224/73203 , H01L2224/8114 , H01L2224/81191 , H01L2224/81193 , H01L2224/81194 , H01L2224/8121 , H01L2224/8159 , H01L2224/81599 , H01L2224/81609 , H01L2224/81611 , H01L2224/81613 , H01L2224/81616 , H01L2224/81639 , H01L2224/81644 , H01L2224/81647 , H01L2224/81815 , H01L2224/81855 , H01L2224/81905 , H01L2224/83104 , H01L2224/83136 , H01L2224/83192 , H01L2224/83194 , H01L2224/8321 , H01L2224/8359 , H01L2224/83599 , H01L2224/83609 , H01L2224/83611 , H01L2224/83613 , H01L2224/83616 , H01L2224/83639 , H01L2224/83644 , H01L2224/83647 , H01L2224/83855 , H01L2224/92125 , H01L2224/9221 , H01L2924/00013 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01047 , H01L2924/01048 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01075 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H05K3/225 , H05K3/3436 , H05K2203/0425 , H05K2203/176 , Y02P70/613 , Y10T29/49144 , Y10T29/49146 , H01L2924/00014 , H01L2924/01014 , H01L2924/00 , H01L2224/73204 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299 , H01L2224/2929
摘要： It is an object of the present invention to provide an electronic element unit and a reinforcing adhesive agent in which a bonding strength can be improved between an electronic element and a circuit board and a repairing work can be carried out without giving a thermal damage to the electronic element or the circuit board. In an electronic element unit (1) including an electronic element (2) having a plurality of connecting terminals (12) on a lower surface thereof, a circuit board (3) having a plurality of electrodes (22) corresponding to the connecting terminals (12) on an upper surface thereof. The connecting terminals (12) and the electrodes (22) are connected by solder bumps (23), and the electronic element (2) and the circuit board (3) are partly bond by a resin bond part (24) made of a thermosetting material of a thermosetting resin, and a metal powder (25) is included in the resin bond parts (24) in a dispersed state. The metal powder (25) has a melting point lower than a temperature at which the resin bond parts (24) are heated when a work (a repairing work) is carried out for removing the electronic element (2) from the circuit board (3).
摘要翻译：本发明的目的是提供一种电子元件单元和增强粘合剂，其中可以在电子元件和电路板之间提高接合强度，并且可以进行修复作业而不会对其造成热损伤电子元件或电路板。在包括在其下表面上具有多个连接端子（12）的电子元件（2）的电子元件单元（1）中，具有与连接端子对应的多个电极（22）的电路板（3） 12）。连接端子（12）和电极（22）通过焊锡凸块（23）连接，电子元件（2）和电路板（3）通过由热固性树脂制成的树脂粘合部分（24）热固性树脂的材料和金属粉末（25）以分散状态包含在树脂粘合部分（24）中。当进行从电路板（3）移除电子元件（2）的工件（修理作业）时，金属粉末（25）的熔点低于加热树脂接合部分（24）的温度）。

3. 发明申请

US20100000773A1 ELECTRONIC COMPONENT MOUNTING STRUCTURE 有权
标题翻译：电子元件安装结构
公开(公告)号：US20100000773A1
公开(公告)日：2010-01-07
申请号：US12159837
申请日：2007-09-21
申请人： Seiichi Yoshinaga , Yoshiyuki Wada , Tadahiko Sakai
发明人： Seiichi Yoshinaga , Yoshiyuki Wada , Tadahiko Sakai
IPC分类号： H05K1/16
CPC分类号： H01L21/563 , H01L23/293 , H01L2224/73203 , H01L2924/15311 , H01L2924/3511 , H05K3/305 , H05K3/3436 , H05K2201/0133 , H05K2201/10734 , H05K2203/0545 , Y02P70/613 , Y10T428/23971 , Y10T428/31525
摘要： The invention intends to provide an electronic component mounting structure where the repairability and the impact resistance are combined. In an electronic component mounting structure, a plurality of solder balls disposed in plane between an electronic component and a substrate is melted to bond the electronic component and the substrate and a resin of which tensile elongation after the curing is in the range of 5 to 40% is filled in portions that are gaps between the electronic component and the substrate and correspond to at least four comers of the electronic component to reinforce. Since the reinforcement area is small, the repairability such as the easy removability of the resin and the reusability of the substrate are excellent, the resin itself is allowed to expand to the impact at the drop to play a role of reinforcing the bonding without breaking, and the impact resistance is excellent as well.
摘要翻译：本发明旨在提供组合可修复性和耐冲击性的电子部件安装结构。在电子部件安装结构中，将电子部件与基板的平面内配置的多个焊锡球融化，使电子部件和基板接合，固化后的拉伸伸长率为5〜40的树脂％填充在电子部件和基板之间的间隙的部分中，并且对应于电子部件的至少四个角以加强。由于加强面积小，树脂的易去除性和基材的可再利用性等的可修复性优异，因此树脂本身能够在液滴下膨胀到冲击，起到加强粘合而不破裂的作用，耐冲击性也优异。

4. 发明授权

US08434665B2 Electronic component mounting system and electronic component mounting method 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US08434665B2
公开(公告)日：2013-05-07
申请号：US13255986
申请日：2010-03-24
申请人： Koji Motomura , Hideki Eifuku , Tadahiko Sakai
发明人： Koji Motomura , Hideki Eifuku , Tadahiko Sakai
IPC分类号： B23K31/00 , B23K31/02
CPC分类号： H05K3/363 , H05K3/305 , H05K3/341 , H05K3/3484 , H05K2201/10977
摘要： Disclosed are an electronic component mounting system and an electronic component mounting method capable of reducing the space occupied by equipment and equipment cost and ensuring high connection reliability. An electronic component mounting system (1) includes a solder printing device (M1), a coating/inspection device (M2), a component mounting device (M3), a bonding material supply/substrate mounting device (M4), and a reflow device (M5). The electronic component mounting system (1) mounts an electronic component on a main substrate (4) and connects a module substrate (5) to the main substrate (4). A cream solder is printed on the main substrate (4) to mount an electronic component, a bonding material in which solder particles are contained in thermosetting resin is supplied to a first connection portion of the main substrate (4), and a second connection portion of the module substrate (5) is landed on the first connection portion through the bonding material. Thereafter, the main substrate (4) is carried in the reflow device (M5) and heated in the same reflow step to solder-bond the electronic component onto the main substrate (4) and to bond the second connection portion of the module substrate (5) and the first connection portion of the main substrate (4) together by the bonding material.
摘要翻译：公开了一种电子部件安装系统和电子部件安装方法，其能够减少设备占用的空间和设备成本，并确保高连接可靠性。电子部件安装系统（1）包括焊料印刷装置（M1），涂布/检查装置（M2），部件安装装置（M3），接合材料供应/基板安装装置（M4）和回流装置（M5）。电子部件安装系统（1）将电子部件安装在主基板（4）上，并将模块基板（5）与主基板（4）连接。在主基板（4）上印刷奶油焊料以安装电子部件，将在热固性树脂中包含焊料颗粒的接合材料供应到主基板（4）的第一连接部分，第二连接部分通过所述接合材料将所述模块基板（5）落在所述第一连接部上。此后，将主基板（4）载入回流装置（M5），并在相同的回流步骤中加热，将电子部件焊接到主基板（4）上，并将模块基板的第二连接部 5）和主基板（4）的第一连接部分通过接合材料在一起。

5. 发明申请

US20100327044A1 METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE 审中-公开
标题翻译：制造电子元件模块的方法
公开(公告)号：US20100327044A1
公开(公告)日：2010-12-30
申请号：US12866911
申请日：2009-02-18
申请人： Tadahiko Sakai , Koji Motomura , Hideki Eifuku
发明人： Tadahiko Sakai , Koji Motomura , Hideki Eifuku
IPC分类号： B23K31/02
CPC分类号： H05K3/3484 , H01L24/81 , H01L24/83 , H01L2224/16225 , H01L2224/2929 , H01L2224/293 , H01L2224/73204 , H01L2224/83192 , H01L2224/83851 , H01L2924/19105 , H01L2924/3511 , H05K1/186 , H05K3/323 , H05K3/341 , H05K2201/10636 , H05K2201/10674 , H05K2201/10977 , H05K2203/0278 , Y02P70/611 , Y02P70/613
摘要： After disposing bonding material including thermosetting resin containing solder particles in a region that covers at least land part on an upper surface of base wiring layer and holding electronic component by base wiring layer by positioning terminal part with respect to land part and adhesively bonding at least terminal part to bonding material that covers at least land part, bonding material is semi-cured by heating. Therefore, warp deformation of the base wiring layer can be suppressed and bonding reliability can be secured.
摘要翻译：在包括焊料颗粒的热固性树脂的粘合材料在基底布线层的上表面上至少覆盖陆地部分的区域中设置并且通过基板布线层将基板布线层保持电子部件，并且将至少端子至少覆盖陆地部分的接合材料的一部分，通过加热将粘结材料半固化。因此，可以抑制基底布线层的翘曲变形，并且可以确保接合可靠性。

6. 发明申请

US20110315321A1 RESIN APPLICATION APPARATUS AND DATA CREATION APPARATUS FOR RESIN APPLICATION 审中-公开
标题翻译：树脂应用设备和数据创建设备
公开(公告)号：US20110315321A1
公开(公告)日：2011-12-29
申请号：US13201015
申请日：2010-01-25
申请人： Seiichi Yoshinaga , Tadahiko Sakai
发明人： Seiichi Yoshinaga , Tadahiko Sakai
IPC分类号： B05C5/00
CPC分类号： H01L21/561 , H01L2224/16225 , H05K3/0091 , H05K3/305 , H05K2203/0126 , H05K2203/0545 , Y02P70/613
摘要： An object of the invention is to provide a resin application apparatus capable of efficiently doing resin application work for resin reinforcement for which a corner part of an electronic component is targeted, and a data creation apparatus for resin application.In the resin application apparatus for linearly applying a resin for reinforcement along an outer edge of the electronic component in an electronic component mounting body in which the electronic component is mounted on a substrate, component position information indicating a position of the electronic component in the electronic component mounting body, component information including a side size of the electronic component and a basic pattern with an application shape for forming a corner reinforced part disposed in the corner part are stored in a storage part (31) and dimension data indicating a concrete dimension in the basic pattern is inputted through an input part (35) and thereby, application locus data for applying the resin for reinforcement is computed by a locus computation part (32). Consequently, the resin application work for resin reinforcement for which the corner part of the electronic component is targeted can be done efficiently.
摘要翻译：本发明的目的是提供一种能够有效地进行电子部件的角部的树脂加强用树脂施加工作的树脂施加装置和树脂施加用数据生成装置。在将电子部件安装在基板上的电子部件安装体中沿着电子部件的外缘直线加强用树脂的树脂施加装置中，表示电子部件在电子部件中的位置的部件位置信息部件安装体，包括电子部件的侧面尺寸的部件信息和具有用于形成设置在拐角部分中的角部加强部件的应用形状的基本图案被存储在存储部件（31）中，并且将表示具体尺寸的尺寸数据通过输入部（35）输入基本图案，由轨迹计算部（32）计算用于施加加强用树脂的施加轨迹数据。因此，能够有效地进行电子部件的角部的树脂强化用树脂加工。

7. 发明授权

US08851138B2 Substrate backing device and substrate thermocompression-bonding device 有权
标题翻译：基板背衬装置和基板热压接装置
公开(公告)号：US08851138B2
公开(公告)日：2014-10-07
申请号：US13504591
申请日：2011-07-05
申请人： Hiroki Maruo , Koji Motomura , Hideki Eifuku , Tadahiko Sakai
发明人： Hiroki Maruo , Koji Motomura , Hideki Eifuku , Tadahiko Sakai
IPC分类号： B29C65/20 , B32B37/10 , B32B38/18 , B32B39/00 , B32B43/00 , B30B5/02 , B32B5/04 , B30B15/28 , B25B11/00
CPC分类号： B25B11/005 , Y10T156/17 , Y10T156/1744 , Y10T156/1756
摘要： A substrate backing device places and holds a rigid substrate thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate thereto. The substrate backing device includes a plate-shaped backing plate provided with a backing support surface adapted to come into contact with the lower surface of the rigid substrate for supporting it. The backing support surface is provided with an opening portion having a planar opening shape encompassing the area of the rigid substrate to be compressively bonded to the flexible substrate. The backing support surface is provided, within the opening portion, a receiving member which, during the thermocompression bonding operations, come into contact with the lower surface of the rigid substrate and with an already-mounted component having been preliminarily mounted on this lower surface in the compression-bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force.
摘要翻译：衬底背衬装置将刚性衬底放置并保持在其上，并在其下方接收用于将柔性衬底热压粘合的操作期间的按压力。基板背衬装置包括板状背板，该板状背板设置有适于与刚性基板的下表面接触以支撑背衬支撑表面的背衬支撑表面。背衬支撑表面设置有开口部分，该开口部分具有围绕刚性基板的区域的平面开口形状，以压缩地结合到柔性基板。背衬支撑表面在开口部分内设置有接收构件，该接收构件在热压接合操作期间与刚性基板的下表面接触并且已经安装的部件已预先安装在该下表面上压接区域，并且还施加与按压力对应的向上支撑反作用力。

8. 发明授权

US08817487B2 Electronic component mounting system and electronic component mounting method 有权
标题翻译：电子元件安装系统和电子元件安装方法
公开(公告)号：US08817487B2
公开(公告)日：2014-08-26
申请号：US13255945
申请日：2010-03-24
申请人： Koji Motomura , Hideki Eifuku , Tadahiko Sakai
发明人： Koji Motomura , Hideki Eifuku , Tadahiko Sakai
IPC分类号： H05K7/02
CPC分类号： H05K3/363 , B23K3/0638 , H05K3/305 , H05K3/341 , H05K3/3484 , H05K13/0465 , H05K13/0469 , H05K2201/10977
摘要： Disclosed are an electronic component mounting system and an electronic component mounting method capable of ensuring high connection reliability. An electronic component mounting system (1) includes a component mounting section which includes a solder printing device (M1), a coating/inspection device (M2), a component mounting device (M3), and a reflow device (M4), and mounts an electronic component on a main substrate (4), and a substrate connection section which includes a bonding material supply/substrate mounting device (M5) and a thermal compression device (M6), and connects the main substrate (4) with the component mounted thereon and a module substrate (5) to each other. A configuration is used in which a substrate conveying mechanism (3) of the reflow device (M4) on the lowermost stream side of the component mounting section and a substrate conveying mechanism (3) of the bonding material supply/substrate mounting device (M5) of the substrate connection section are connected directly to each other or are linked to each other by a conveying path through another conveying means. Thus, the main substrate (4) after reflow can be transferred immediately to a substrate connection step, and the generation of a void in the connection portion due to moisture being evaporated in the substrate connection step can be excluded.
摘要翻译：公开了一种能够确保高连接可靠性的电子部件安装系统和电子部件安装方法。一种电子部件安装系统（1），包括：包括焊料印刷装置（M1），涂布/检查装置（M2），部件安装装置（M3）和回流装置（M4）的部件安装部，主基板（4）上的电子部件和包括接合材料供给/基板安装装置（M5）和热压缩装置（M6）的基板连接部，并且将主基板（4）与安装的部件和模块基板（5）。使用其中组件安装部分的最下游侧的回流装置（M4）的基板输送机构（3）和接合材料供给/基板安装装置（M5）的基板输送机构（3）基板连接部分彼此直接连接或通过另一输送装置的输送路径相互连接。因此，回流后的主基板（4）可以立即转移到基板连接步骤，并且可以排除在基板连接步骤中由于水分被蒸发而在连接部分中产生的空隙。

9. 发明申请

US20120234496A1 SUBSTRATE RECEIVING DEVICE AND SUBSTRATE THERMOCOMPRESSION-BONDING DEVICE 有权
标题翻译：基板接收装置和基板热电偶连接装置
公开(公告)号：US20120234496A1
公开(公告)日：2012-09-20
申请号：US13504591
申请日：2011-07-05
申请人： Hiroki Maruo , Koji Motomura , Hideki Eifuku , Tadahiko Sakai
发明人： Hiroki Maruo , Koji Motomura , Hideki Eifuku , Tadahiko Sakai
IPC分类号： H05K13/04 , B32B37/10 , B25B11/00 , B32B38/18
CPC分类号： B25B11/005 , Y10T156/17 , Y10T156/1744 , Y10T156/1756
摘要： A substrate backing device 3 places and holds a rigid substrate 6 thereon and receives, from therebelow, a pressing force during operations for thermocompressively bonding a flexible substrate 8 thereto. The substrate backing device 3 includes a plate-shaped backing plate 4 provided with a backing support surface 4a adapted to come into contact with the lower surface of the rigid substrate 6 for supporting it. The backing support surface 4a is provided with an opening portion 4d having a planar opening shape encompassing the area of the rigid substrate 6 to be compressively bonded to the flexible substrate 8. The backing support surface 4a is provided, within the opening portion 4d, a receiving member 5 which, during the thermocompression bonding operations, come into contact with the lower surface of the rigid substrate 6 and with an already-mounted component 6c having been preliminarily mounted on this lower surface in the compression-bonding area and, further, apply an upward supporting counterforce corresponding to the pressing force.
摘要翻译：基板背衬装置3将刚性基板6放置并保持在其上，并在其下方接收用于将柔性基板8热压接合的操作期间的按压力。基板背衬装置3包括板状背板4，板状背板4设置有背衬支撑表面4a，该背衬支撑表面4a适于与刚性基板6的下表面接触以用于支撑它。背衬支撑表面4a设置有开口部分4d，该开口部分4d具有包围刚性基板6的区域的平面开口形状，以被压缩地结合到柔性基板8.背衬支撑表面4a在开口部分4d内设置有接收构件5，其在热压接操作期间与刚性基板6的下表面接触，并且已经安装在压缩接合区域的该下表面上的已安装部件6c，并且还应用对应于按压力的向上支撑反作用力。

10. 发明申请

US20060043597A1 Solder composition, connecting process with soldering, and connection structure with soldering 审中-公开
标题翻译：焊接成分，焊接连接工艺，焊接连接结构
公开(公告)号：US20060043597A1
公开(公告)日：2006-03-02
申请号：US11209620
申请日：2005-08-24
申请人： Yoshiyuki Wada , Tadahiko Sakai , Seiichi Yoshinaga
发明人： Yoshiyuki Wada , Tadahiko Sakai , Seiichi Yoshinaga
IPC分类号： H01L23/48
CPC分类号： B23K35/262 , B23K35/025 , B23K35/264 , B23K35/3613 , C22C12/00 , H05K3/3442 , H05K3/3484 , H05K2201/10636 , H05K2201/10977 , Y02P70/611 , Y02P70/613
摘要： There is provided a solder composition which contains: (1) a metal material comprising solder particles, and (2) a thermosetting flux material comprising a thermosetting resin and a solid resin which transforms to its liquid-like state when heated with a proviso that the thermosetting resin is excluded from the solid resin.
摘要翻译：提供了一种焊料组合物，其包含：（1）包含焊料颗粒的金属材料，和（2）包含热固性树脂和固体树脂的热固性焊剂材料，其在加热时转变成其液体状态，条件是固体树脂不含热固性树脂。

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