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    • 1. 发明授权
    • Light-emitting device and method for manufacturing the same
    • 发光装置及其制造方法
    • US07179672B2
    • 2007-02-20
    • US10976987
    • 2004-11-01
    • Koji AsakawaAkira FujimotoHitoshi SugiyamaKenichi OhashiKenji SuzukiJunichi Tonotani
    • Koji AsakawaAkira FujimotoHitoshi SugiyamaKenichi OhashiKenji SuzukiJunichi Tonotani
    • H01L21/00
    • H01L33/22H01L21/0271
    • A nanometer size roughened structure is formed on a surface of a light-emitting element, and luminous efficiency is improved.The roughened structure on the surface of the light-emitting element of the invention is formed into the following shape such that the refractive index smoothly changes: (1) the mean diameter of projections on the roughened surface is smaller than the light wavelength; (2) a pitch of the roughened surface is irregular; and (3) positions of the top and bottom of the roughened surface are distributed from their mean values within the light wavelength in order to give a smooth gradient of the refractive index. The surface of such light-emitting element is obtained by forming a thin film on the surface of the light-emitting element using a resin composition which contains a block copolymer or graft copolymer and forms a micophase-separated structure in a self-organization manner; selectively removing at least one phase of the microphase-separated structure of the thin film formed on the surface; and etching the surface of the light-emitting element using the remaining phase as an etching mask.
    • 在发光元件的表面上形成纳米尺寸的粗糙结构,并提高发光效率。 本发明的发光元件表面上的粗糙结构形成为以下形状,使得折射率平滑地变化:(1)粗糙面上的突起的平均直径小于光波长; (2)粗糙表面的间距不规则; 和(3)粗糙表面的顶部和底部的位置从其在光波长内的平均值分布,以便给出折射率的平滑梯度。 这种发光元件的表面通过使用含有嵌段共聚物或接枝共聚物的树脂组合物在发光元件的表面上形成薄膜而以自组织形式形成微晶相分离结构而获得; 选择性地除去形成在表面上的薄膜的微相分离结构的至少一个相; 并使用剩余的相作为蚀刻掩模蚀刻发光元件的表面。
    • 2. 发明申请
    • Light-emitting device and method for manufacturing the same
    • 发光装置及其制造方法
    • US20050112886A1
    • 2005-05-26
    • US10976987
    • 2004-11-01
    • Koji AsakawaAkira FujimotoHitoshi SugiyamaKenichi OhashiKenji SuzukiJunichi Tonotani
    • Koji AsakawaAkira FujimotoHitoshi SugiyamaKenichi OhashiKenji SuzukiJunichi Tonotani
    • H01L33/22B32B1/00H01L21/302H01L21/461
    • H01L33/22H01L21/0271
    • A nanometer size roughened structure is formed on a surface of a light-emitting element, and luminous efficiency is improved. The roughened structure on the surface of the light-emitting element of the invention is formed into the following shape such that the refractive index smoothly changes: (1) the mean diameter of projections on the roughened surface is smaller than the light wavelength; (2) a pitch of the roughened surface is irregular; and (3) positions of the top and bottom of the roughened surface are distributed from their mean values within the light wavelength in order to give a smooth gradient of the refractive index. The surface of such light-emitting element is obtained by forming a thin film on the surface of the light-emitting element using a resin composition which contains a block copolymer or graft copolymer and forms a micophase-separated structure in a self-organization manner; selectively removing at least one phase of the microphase-separated structure of the thin film formed on the surface; and etching the surface of the light-emitting element using the remaining phase as an etching mask.
    • 在发光元件的表面上形成纳米尺寸的粗糙结构,并提高发光效率。 本发明的发光元件表面上的粗糙结构形成为以下形状,使得折射率平滑地变化:(1)粗糙面上的突起的平均直径小于光波长; (2)粗糙表面的间距不规则; 和(3)粗糙表面的顶部和底部的位置从其在光波长内的平均值分布,以便给出折射率的平滑梯度。 这种发光元件的表面通过使用含有嵌段共聚物或接枝共聚物的树脂组合物在发光元件的表面上形成薄膜而以自组织形式形成微晶相分离结构而获得; 选择性地除去形成在表面上的薄膜的微相分离结构的至少一个相; 并使用剩余的相作为蚀刻掩模蚀刻发光元件的表面。
    • 3. 发明授权
    • Light-emitting device and method for manufacturing the same
    • 发光装置及其制造方法
    • US06825056B2
    • 2004-11-30
    • US10330086
    • 2002-12-30
    • Koji AsakawaAkira FujimotoHitoshi SugiyamaKenichi OhashiKenji SuzukiJunichi Tonotani
    • Koji AsakawaAkira FujimotoHitoshi SugiyamaKenichi OhashiKenji SuzukiJunichi Tonotani
    • H01L2100
    • H01L33/22H01L21/0271
    • A nanometer size roughened structure is formed on a surface of a light-emitting element, and luminous efficiency is improved. The roughened structure is formed into the following shape to change refractive index smoothly: (1) the mean diameter of projections on the roughened surface is smaller than the light wavelength; (2) a pitch of the roughened surface is irregular; and (3) positions of the top and bottom of the roughened surface are distributed from their mean values within the light wavelength. The surface of such light-emitting element is obtained by forming a thin film on the surface of the light-emitting element using a block or graft copolymer comprising resin composition and forms a self-assembled microphase-separated structure; selectively removing at least one phase of the microphase-separated structure; and etching the surface of the light-emitting element using the remaining phase as an etching mask.
    • 在发光元件的表面上形成纳米尺寸的粗糙结构,并提高发光效率。 粗糙结构形成为以下形状以平滑地改变折射率:(1)粗糙表面上的突起的平均直径小于光波长; (2)粗糙表面的间距不规则; 和(3)粗糙表面的顶部和底部的位置从它们在光波长内的平均值分布。 这种发光元件的表面通过使用包含树脂组合物的嵌段或接枝共聚物在发光元件的表面上形成薄膜而获得,并形成自组装的微相分离结构; 选择性地除去微相分离结构的至少一个相; 并使用剩余的相作为蚀刻掩模蚀刻发光元件的表面。
    • 7. 发明申请
    • SEMICONDUCTOR LIGHT EMITTING DEVICE AND SEMICONDUCTOR LIGHT EMITTING APPARATUS
    • 半导体发光器件和半导体发光器件
    • US20070145385A1
    • 2007-06-28
    • US11685375
    • 2007-03-13
    • Kenichi OhashiYasuhiko AkaikeHitoshi SugiyamaYasuharu Sugawara
    • Kenichi OhashiYasuhiko AkaikeHitoshi SugiyamaYasuharu Sugawara
    • H01L33/00
    • H01L33/20H01L33/22
    • A first semiconductor light emitting device comprises: a transparent substrate; a light emitting layer; and a roughened region. The transparent substrate has a first major surface and a second major surface, and is translucent to light in a first wavelength band. The light emitting layer is selectively provided in a first portion on the first major surface of the transparent substrate and configured to emit light in the first wavelength band. The roughened region is provided in a second portion different from the first portion on the first major surface. A second semiconductor light emitting device comprises: a transparent substrate; a light emitting layer; a first electrode; and at least one groove. The groove is provided on the second major surface of the transparent substrate and is extending from a first side face to a second side face opposing the first side face of the transparent substrate.
    • 第一半导体发光器件包括:透明衬底; 发光层; 和一个粗糙的地区。 透明基板具有第一主表面和第二主表面,并且对于在第一波长带中的光是半透明的。 发光层选择性地设置在透明基板的第一主表面上的第一部分中,并且被配置为发射第一波长带中的光。 粗糙区域设置在与第一主表面上的第一部分不同的第二部分中。 第二半导体发光器件包括:透明衬底; 发光层; 第一电极; 和至少一个凹槽。 凹槽设置在透明基板的第二主表面上并且从第一侧面延伸到与透明基板的第一侧面相对的第二侧面。
    • 8. 发明授权
    • Semiconductor light emitting device and semiconductor light emitting apparatus
    • 半导体发光器件和半导体发光器件
    • US07462869B2
    • 2008-12-09
    • US11685375
    • 2007-03-13
    • Kenichi OhashiYasuhiko AkaikeHitoshi SugiyamaYasuharu Sugawara
    • Kenichi OhashiYasuhiko AkaikeHitoshi SugiyamaYasuharu Sugawara
    • H01L33/00
    • H01L33/20H01L33/22
    • A first semiconductor light emitting device includes: a transparent substrate; a light emitting layer; and a roughened region. The transparent substrate has a first major surface and a second major surface, and is translucent to light in a first wavelength band. The light emitting layer is selectively provided in a first portion on the first major surface of the transparent substrate and configured to emit light in the first wavelength band. The roughened region is provided in a second portion different from the first portion on the first major surface. A second semiconductor light emitting device includes: a transparent substrate; a light emitting layer; a first electrode; and at least one groove. The groove is provided on the second major surface of the transparent substrate and extends from a first side face to a second side face opposing the first side face of the transparent substrate.
    • 第一半导体发光器件包括:透明衬底; 发光层; 和一个粗糙的地区。 透明基板具有第一主表面和第二主表面,并且对于在第一波长带中的光是半透明的。 发光层选择性地设置在透明基板的第一主表面上的第一部分中,并且被配置为发射第一波长带中的光。 粗糙区域设置在与第一主表面上的第一部分不同的第二部分中。 第二半导体发光器件包括:透明衬底; 发光层; 第一电极; 和至少一个凹槽。 沟槽设置在透明基板的第二主表面上,并从第一侧面延伸到与透明基板的第一侧面相对的第二侧面。