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1. 发明授权

US5773168A Nonaqueous electrolyte secondary battery and method for manufacturing the same 失效
标题翻译：非水电解质二次电池及其制造方法
公开(公告)号：US5773168A
公开(公告)日：1998-06-30
申请号：US701717
申请日：1996-08-22
申请人： Koichi Kubo , Shuji Yamada , Masashi Fujiwara , Shinji Arai , Motoya Kanda
发明人： Koichi Kubo , Shuji Yamada , Masashi Fujiwara , Shinji Arai , Motoya Kanda
IPC分类号： H01M4/52 , H01M4/58 , H01M6/16
CPC分类号： H01M4/525 , H01M10/0525 , H01M4/58 , H01M6/164 , Y10T29/49115
摘要： This invention provides a nonaqueous electrolyte secondary battery comprising a positive electrode, a negative electrode and a nonaqueous electrolyte, wherein the positive electrode comprises a lithium-containing nickel oxide having a composition represented by Li.sub.1+x Ni.sub.1-x O.sub.u-y F.sub.y where the ranges of x, y and u meet the following equations (1) to (3): (y+0.05)/2.ltoreq.x.ltoreq.(y+1)/3 (1) y>0 (2) 1.9.ltoreq.u.ltoreq.2.1 (3).
摘要翻译：本发明提供一种非水电解质二次电池，其包含正极，负极和非水电解质，其中所述正极包含由Li1 + xNi1-xOu-yFy表示的组成的含锂的氧化镍，其中x， y和u满足以下等式（1）至（3）：（y + 0.05）/ 2 0（2）1.9 <

2. 发明授权

US07326261B2 Surface-mount capacitor and method of producing the same 有权
标题翻译：表面贴装电容器及其制造方法
公开(公告)号：US07326261B2
公开(公告)日：2008-02-05
申请号：US11681112
申请日：2007-03-01
申请人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01G9/00
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
摘要翻译：表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层压板状电容器元件而形成，所述电容器元件的相对端具有阳极引线部分，并且在中心部分具有阴极部分，阳极端子经由条状板连接到每个阳极引线部分以及连接到阴极部分的阴极端子。阳极和阴极端子并且具有平坦形状并且形成在公共平面上作为基板安装表面。模具树脂壳体具有填充阳极和阴极端子之间的间隙的底部部分，并且将阳极和阴极端子和基本上垂直于衬底安装表面的侧壁机械连接。阳极和阴极端子具有暴露在模制树脂壳体的内底表面上的上表面，以连接到阳极引线部分和阴极部分。

3. 发明授权

US07206193B2 Surface-mount capacitor and method of producing the same 有权
标题翻译：表面贴装电容器及其制造方法
公开(公告)号：US07206193B2
公开(公告)日：2007-04-17
申请号：US11260831
申请日：2005-10-27
申请人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa Nagasawa , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01G2/10 , H01G9/08
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions 11 at opposite ends thereof and a cathode portion 12 at the center, an anode terminal 18 connected to each anode lead portion 11 via a strip-like plate 14, and a cathode terminal 19 connected to the cathode portion 12. The anode and the cathode terminals 18 and 19 have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case 20 has a bottom portion filling a gap between the anode and the cathode terminals 18 and 19 and mechanically connecting the anode and the cathode terminals 18 and 19, and side walls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals 18 and 19 have upper surfaces exposed on an inner bottom surface of the mold resin case 20 to be connected to the anode lead portions 11 and the cathode portion 12.
摘要翻译：表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层叠板状电容器元件而形成，所述电容器元件的相对端部具有阳极引线部分11和位于其中心的阴极部分12，阳极端子18经由一个阳极引线部分11经由条状板14和连接到阴极部分12的阴极端子19。阳极和阴极端子18和19具有扁平形状并且形成在公共平面上作为基板安装表面。模具树脂壳体20具有填充阳极和阴极端子18和19之间的间隙的底部，并且机构地连接阳极和阴极端子18和19以及基本垂直于基板安装表面的侧壁。阳极和阴极端子18和19具有暴露在模制树脂壳体20的内底表面上的上表面，以连接到阳极引线部分11和阴极部分12。

4. 发明授权

US06457632B1 Solder alloy and bonding method of substrate and electric or electronic parts with solder alloy 有权
标题翻译：焊料合金及焊接方法与电焊或焊接合金电子部件
公开(公告)号：US06457632B1
公开(公告)日：2002-10-01
申请号：US09619445
申请日：2000-07-19
申请人： Kouichi Teshima , Emiko Higashinakagawa , Shinji Arai
发明人： Kouichi Teshima , Emiko Higashinakagawa , Shinji Arai
IPC分类号： B23K3514
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225 , H01L2924/12044 , H05K1/111 , H05K3/3421 , H05K2201/098 , H05K2201/10689 , Y02P70/611 , Y10T428/1266 , Y10T428/12708 , Y10T428/12715 , Y10T428/12792 , H01L2924/00
摘要： Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.
摘要翻译：公开了用于粘接电子或电子部件的焊料合金，其包含：3至12重量％的锌组分; 和锡组分。焊料合金的氧含量降低到100ppm以下。使用焊料合金，在基板上形成接合部，并且将电子部件安装在其上，以获得用于安装电子部件的基板和安装有电子部件的基板。由上述焊料合金制成的接合部可以防止迁移。

5. 发明授权

US5579534A Heat-resistant member 失效
标题翻译：耐热构件
公开(公告)号：US5579534A
公开(公告)日：1996-11-26
申请号：US445069
申请日：1995-05-19
申请人： Masayuki Itoh , Kazuhiro Yasuda , Kunihiko Wada , Seiichi Suenaga , Shinji Arai
发明人： Masayuki Itoh , Kazuhiro Yasuda , Kunihiko Wada , Seiichi Suenaga , Shinji Arai
IPC分类号： C23C4/02 , C23C28/00 , B22F7/04
CPC分类号： C23C28/32 , C23C28/325 , C23C28/3455 , C23C4/02 , Y10T428/12021 , Y10T428/12028 , Y10T428/12049 , Y10T428/12056 , Y10T428/12063 , Y10T428/1209
摘要： A heat-resistant member is constructed by having a ceramic coating layer deposited on the surface of a metallic substrate through the medium of a metallic bonding layer. The metallic bonding layer is composed of at least two layers, i.e. a layer of an aggregate of minute particles disposed on the metallic substrate side and a layer of an aggregate of coarse particles disposed on the ceramic coating layer side. Otherwise, the metallic bonding layer is composed of at least three layers, i.e. two layers of an aggregate of coarse particles disposed one each on the metallic substrate side and the ceramic coating layer side and one layer of an aggregate of minute particles interposed between these two layers of an aggregate of coarse particles. These layers are obtained by the low pressure ambient plasma thermal spraying using a fine powder or a coarse powder of an alloy resistant to corrosion and oxidation. The metallic bonding layer constructed as described above is excellent in the ability to resist high temperature oxidation and high temperature corrosion and stable to tolerate thermal fatigue and thermal impacts. Thus, it is capable of preventing the thermal barrier coating layer from sustaining cracks or inducing film separation.
摘要翻译：通过在金属基材的表面上通过金属粘合层的介质沉积陶瓷涂层而构成耐热构件。金属接合层由至少两层构成，即设置在金属基板一侧的微小颗粒聚集体层和设置在陶瓷涂层侧的粗粒子集合体层。另外，金属接合层由至少三层构成，即，在金属基板一侧和陶瓷涂层侧分别设置两层的粗粒子的集合体和一层在这两者之间插入的微粒子集合体一层粗粒子的聚集体。这些层通过低压环境等离子体热喷涂获得，其使用耐腐蚀和氧化的合金的细粉末或粗粉末。如上所述构成的金属接合层，耐高温氧化和高温腐蚀的能力优良，耐热疲劳和热冲击性能稳定。因此，能够防止热障涂层维持裂纹或引起膜分离。

6. 发明申请

US20070148900A1 SURFACE-MOUNT CAPACITOR AND METHOD OF PRODUCING THE SAME 有权
标题翻译：表面安装电容器及其制造方法
公开(公告)号：US20070148900A1
公开(公告)日：2007-06-28
申请号：US11681112
申请日：2007-03-01
申请人： Toshihisa NAGASAWA , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
发明人： Toshihisa NAGASAWA , Kenji Araki , Hitoshi Takata , Akihiro Kawai , Shinji Arai
IPC分类号： H01L21/20
CPC分类号： H01G9/008 , H01G9/08 , Y10T29/417
摘要： A surface-mount capacitor includes a multilayer capacitor structure formed by laminating plate-like capacitor elements each having anode lead portions at opposite ends thereof and a cathode portion at the center, an anode terminal connected to each anode lead portion via a strip-like plate, and a cathode terminal connected to the cathode portion. The anode and the cathode terminals and have a flat shape and are formed on a common plane as a substrate-mounted surface. A mold resin case has a bottom portion filling a gap between the anode and the cathode terminals and mechanically connecting the anode and the cathode terminals and sidewalls substantially perpendicular to the substrate-mounted surface. The anode and the cathode terminals have upper surfaces exposed on an inner bottom surface of the mold resin case to be connected to the anode lead portions and the cathode portion.
摘要翻译：表面贴装电容器包括层叠电容器结构，该层叠电容器结构通过层压板状电容器元件而形成，所述电容器元件的相对端具有阳极引线部分，并且在中心部分具有阴极部分，阳极端子经由条状板连接到每个阳极引线部分以及连接到阴极部分的阴极端子。阳极和阴极端子并且具有平坦形状并且形成在公共平面上作为基板安装表面。模具树脂壳体具有填充阳极和阴极端子之间的间隙的底部部分，并且将阳极和阴极端子和基本上垂直于衬底安装表面的侧壁机械连接。阳极和阴极端子具有暴露在模制树脂壳体的内底表面上的上表面，以连接到阳极引线部分和阴极部分。

7. 发明授权

US06651870B2 Solder alloy, substrate with solder alloy for mounting electronic part, member to be bonded of electronic part, and electronic-part-mounted substrate 有权
公开(公告)号：US06651870B2
公开(公告)日：2003-11-25
申请号：US10214187
申请日：2002-08-08
申请人： Kouichi Teshima , Emiko Higashinakagawa , Shinji Arai
发明人： Kouichi Teshima , Emiko Higashinakagawa , Shinji Arai
IPC分类号： B23K3514
CPC分类号： H05K3/3463 , B23K35/262 , H01L23/488 , H01L2224/16225 , H01L2924/12044 , H05K1/111 , H05K3/3421 , H05K2201/098 , H05K2201/10689 , Y02P70/611 , Y10T428/1266 , Y10T428/12708 , Y10T428/12715 , Y10T428/12792 , H01L2924/00
摘要： Disclosed is a solder alloy in use for bonding electric or electronic parts, containing: 3 to 12% by weight of a zin component; and a tin component. The oxygen content of the solder alloy is reduced to 100 ppm or less. Using the solder alloy, a bonding portion is formed on the substrate and the electronic part is mounted thereon to obtain a substrate for mounting the electronic part and a substrate on which the electronic part is mounted. The bonding portion made of the above solder alloy can prevent migration.

8. 发明授权

US6022618A Paper cord for recycling used paper 失效
标题翻译：用于回收废纸的纸绳
公开(公告)号：US6022618A
公开(公告)日：2000-02-08
申请号：US170119
申请日：1998-10-13
申请人： Shinji Arai
发明人： Shinji Arai
IPC分类号： B65D63/10 , D02G3/08 , D21F7/00 , D02G3/00
CPC分类号： D02G3/08 , Y10T428/29
摘要： Disclosed is a paper cord which is used for binding old newspaper or old magazines for recycling and which can be charged into a material dissolving apparatus together with the old newspaper or the old magazines.The paper cord is prepared by twisting a base paper which is a recycled paper characterized by a content of recycled pulp from old newspaper of 33% or more and a total content of recycled pulp including recycled pulp from other sources of 50% or more as well as by whiteness and strength equivalent to or better than those of newsprint paper and degree of sizing equivalent to that of newsprint paper for offset printing.
摘要翻译：公开了一种纸绳，用于捆绑旧报纸或旧杂志用于回收，并可与旧报纸或旧杂志一起装入材料溶解设备中。纸绳是通过扭转原纸，其是以来自旧报纸的再循环纸浆的含量为33％以上的再生纸，以及来自其他50％以上的来源的再循环纸浆的总含量由于白度和强度等于或优于新闻纸和相当于胶版印刷纸尺寸等级的白度和强度。

9. 发明授权

US4060467A Electrolytic machining system 失效
标题翻译：电解加工系统
公开(公告)号：US4060467A
公开(公告)日：1977-11-29
申请号：US549438
申请日：1975-02-12
申请人： Sachio Maeda , Nagoa Saito , Shinji Arai , Yuichiro Haishi
发明人： Sachio Maeda , Nagoa Saito , Shinji Arai , Yuichiro Haishi
IPC分类号： B23H3/02 , B23H3/08 , C25F3/08 , C25F3/02
CPC分类号： B23H3/02 , B23H3/08 , C25F3/08 , B23H2300/12
摘要： A workpiece consisting essentially of sintered tungsten carbide alloy having added thereto titanium carbide and/or tantalum carbide is electrolytically machined using an aqueous electrolyte solution consisting essentially of 5% to saturated value by weight of an alkali metal chloride selected from the group consisting of sodium chloride and potassium chloride, and an alkali metal compound selected from the group consisting of 3.6%-5.3% by weight of sodium hydroxide, up to 7.5% by weight of potassium hydroxide, up to 7.1% by weight of sodium carbonate, up to 9.2% by weight of potassium carbonate, up to 11.2% by weight of sodium bicarbonate, and up to 13.3% by weight of potassium bicarbonate. The workpiece is positioned opposite a machining electrode with a small machining gap therebetween and an alternating electric current is passed serially through the electrolyte solution in the machining gap, through the workpiece and through the machining electrode to render the workpiece anodic during part of the alternating current cycle so as to form oxides including water-insoluble tungsten oxide and titanium oxide and/or tantalum oxide on the workpiece surface and to render the workpiece cathodic during the reverse part of the alternating current cycle so as to cause the water-insoluble oxides to react with alkali metal ions in the electrolyte solution to form reaction products which are soluble in water to thereby dissolve the oxides and prevent oxide accumulation on the workpiece surface.
摘要翻译：基本上由添加有碳化钛和/或碳化钽的烧结碳化钨合金组成的工件使用基本上由5重量％至饱和重量的碱金属氯化物组成的水性电解质溶液进行电解加工，所述碱金属氯化物选自氯化钠和氯化钾，以及选自3.6％-5.3％重量的氢氧化钠，至多7.5％重量的氢氧化钾，至多7.1％重量的碳酸钠，至多9.2％的碱金属化合物。的碳酸钾，至多11.2重量％的碳酸氢钠，以及高达13.3重量％的碳酸氢钾。工件与加工电极相对设置，其间具有小的加工间隙，并且交替电流在加工间隙中通过工件和通过加工电极串联地通过电解质溶液，以在部分交流电中使工件阳极化循环，以在工件表面上形成包含水不溶性氧化钨和氧化钛和/或氧化钽的氧化物，并在交替循环的相反部分期间使工件呈阴极化，以使水不溶性氧化物反应在电解液中用碱金属离子形成可溶于水的反应产物，从而溶解氧化物并防止工件表面上的氧化物堆积。

10. 发明授权

US07312978B2 Electrically conductive polymer composition and solid electrolytic capacitor using the same 有权
公开(公告)号：US07312978B2
公开(公告)日：2007-12-25
申请号：US11356676
申请日：2006-02-17
申请人： Sadamu Toida , Shinji Arai , Kenji Araki , Katsuhiro Yoshida , Tadamasa Asami , Takeshi Saitou , Yuuichi Maruko
发明人： Sadamu Toida , Shinji Arai , Kenji Araki , Katsuhiro Yoshida , Tadamasa Asami , Takeshi Saitou , Yuuichi Maruko
IPC分类号： H01G9/00
摘要： An electrically conductive polymer composition contains an electrically conductive polymer obtained by using a polymer in the form of cations composed of repeating structural units of 3,4-ethylene dioxythiophene and polystyrene sulfonic acid as anions and further contains naphthalene sulfonic acid as an additive. A solid electrolytic capacitor 101 or a surface-mount transmission line element 102 has a polypyrrole conductive polymer layer 3 as a first solid electrolyte and a poly(3,4-ethylene dioxythiophene) conductive polymer layer 4 as a second solid electrolyte.

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