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1. 发明授权

US06894371B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06894371B2
公开(公告)日：2005-05-17
申请号：US10359251
申请日：2003-02-06
申请人： Koichi Hirata , Osamu Isaki , Tsutomu Aono , Toshikazu Hirai , Tetsuro Asano
发明人： Koichi Hirata , Osamu Isaki , Tsutomu Aono , Toshikazu Hirai , Tetsuro Asano
IPC分类号： H01L27/04 , H01L21/822 , H01L23/495 , H01L23/50 , H01L23/66
CPC分类号： H01L23/49503 , H01L23/66 , H01L24/48 , H01L24/49 , H01L2224/48091 , H01L2224/48247 , H01L2224/48257 , H01L2224/49171 , H01L2224/73265 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01014 , H01L2924/01031 , H01L2924/01039 , H01L2924/01047 , H01L2924/07802 , H01L2924/10329 , H01L2924/1306 , H01L2924/14 , H01L2924/1423 , H01L2924/1532 , H01L2924/181 , H01L2924/19041 , H01L2924/19043 , H01L2924/30105 , H01L2924/3025 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： In a case of a semiconductor chip having an electrode pad to be wire-bonded to a header, securing of a fixing region is difficult since the spread of an Ag paste cannot be controlled, therefore, there has existed a problem such that stable manufacturing could not be carried out. Also, there existed a problem such that realization of stable manufacturing resulted in an excessively large external package form. A projection part is provided in a header, and a fixing region of a bonding wire is secured by arranging a chip at a position shifted in a direction to become distant from the projection part. An electrode pad to be connected to the header is arranged closer to the chip center than the other electrode pads of the identical chip side, and a wire is extended therefrom to the projection part or in the vicinity thereof so as to cross the chip and is fixed. Thereby, downsizing of the package and stable manufacturing are realized.
摘要翻译：在具有将导线接合到集管上的电极焊盘的半导体芯片的情况下，难以固定固定区域，因为不能控制Ag浆料的扩散，因此存在这样的问题，使得稳定的制造可能没有进行此外，存在这样的问题，使得稳定制造的实现导致过大的外部封装形式。突起部设置在集管中，并且通过将芯片布置在远离突出部的方向偏移的位置来固定接合线的固定区域。连接到集管的电极焊盘被布置成比相同芯片侧的其他电极焊盘更靠近芯片中心，并且电线从其延伸到突出部分或其附近以便穿过芯片，并且是固定。从而实现了封装的小型化和稳定的制造。

2. 发明授权

US06822338B2 Wiring structure of semiconductor device 有权
标题翻译：半导体器件的接线结构
公开(公告)号：US06822338B2
公开(公告)日：2004-11-23
申请号：US10374727
申请日：2003-02-27
申请人： Tsutomu Aono , Kikuo Okada
发明人： Tsutomu Aono , Kikuo Okada
IPC分类号： H01L2348
CPC分类号： H01L24/06 , H01L23/49844 , H01L23/50 , H01L24/05 , H01L24/45 , H01L24/48 , H01L24/49 , H01L2224/02166 , H01L2224/04042 , H01L2224/05552 , H01L2224/05553 , H01L2224/05556 , H01L2224/056 , H01L2224/05639 , H01L2224/05644 , H01L2224/05664 , H01L2224/0603 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/48472 , H01L2224/48491 , H01L2224/48639 , H01L2224/48644 , H01L2224/48664 , H01L2224/48739 , H01L2224/48764 , H01L2224/48839 , H01L2224/48844 , H01L2224/48864 , H01L2224/49107 , H01L2224/49111 , H01L2224/49175 , H01L2224/854 , H01L2224/85439 , H01L2224/85444 , H01L2224/85464 , H01L2924/00011 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01028 , H01L2924/01029 , H01L2924/01039 , H01L2924/01042 , H01L2924/01047 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/10161 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15747 , H01L2924/15787 , H01L2924/00 , H01L2224/48744 , H01L2924/00012 , H01L2924/01033
摘要： A semiconductor device includes a power supply semiconductor chip that has a current passing electrode. A conductive plate is disposed on the current electrode, and a conductive wire that is used for an external connection of the device is fixed on the conductive plate, but not directly on the current passing electrode. The conductive plate may serve as a shock absorber during wire bonding procedure, and may contact more than one current passing electrodes so that the number of wire bonding procedures is reduced in manufacturing the device.
摘要翻译：半导体器件包括具有电流通过电极的电源半导体芯片。导电板设置在电流电极上，并且用于器件的外部连接的导线固定在导电板上，而不是直接放置在通过电极上。在引线接合过程中，导电板可以用作减震器，并且可以接触多于一个电流通过的电极，使得在制造器件时减少引线接合程序的数量。

3. 发明授权

US06906410B2 Semiconductor device and method for manufacturing same 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US06906410B2
公开(公告)日：2005-06-14
申请号：US10374521
申请日：2003-02-27
申请人： Tsutomu Aono , Kikuo Okada
发明人： Tsutomu Aono , Kikuo Okada
IPC分类号： H01L23/48 , H01L23/488 , H01L23/52
CPC分类号： H01L23/488 , H01L24/48 , H01L2224/48091 , H01L2924/00014 , H01L2924/01078 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A semiconductor device includes a power supply semiconductor chip that has a plurality of current passing electrodes and a plurality of control electrodes. Conductive plates are disposed on the current electrodes and the control electrodes, and extend to regions for external connections. The conductive plates also includes connecting regions that are suspended between the chip and the external connection regions and suppers vibration propagating to the chip. One conductive plate unit for the current passing electrodes and another conductive plate unit for the control electrodes are separately soldered on the corresponding electrodes. Alternatively, only one unit may be soldered on the semiconductor chip, and portions of the unit may be removed to fabricate the device. Because of the absence of wire-bonding steps, the semiconductor chip does not receive impact of wire-bonding during the manufacturing process.
摘要翻译：半导体器件包括具有多个电流通过电极和多个控制电极的电源半导体芯片。导电板设置在电流电极和控制电极上，并延伸到用于外部连接的区域。导电板还包括悬挂在芯片和外部连接区域之间并连接到芯片传播的振动的连接区域。用于电流通过电极的一个导电板单元和用于控制电极的另一导电板单元分别焊接在相应的电极上。或者，可以在半导体芯片上仅焊接一个单元，并且可以移除单元的部分以制造该器件。由于没有引线键合步骤，所以半导体芯片在制造过程中不会受到引线接合的影响。

4. 发明授权

US5521429A Surface-mount flat package semiconductor device 失效
标题翻译：表面贴装扁平封装半导体器件
公开(公告)号：US5521429A
公开(公告)日：1996-05-28
申请号：US344424
申请日：1994-11-23
申请人： Tsutomu Aono , Takayoshi Nishi
发明人： Tsutomu Aono , Takayoshi Nishi
IPC分类号： H01L23/495 , H01L23/28 , H01L23/36
CPC分类号： H01L23/49562 , H01L23/49548 , H01L2224/48091 , H01L2224/48247 , H01L24/48 , H01L2924/00014 , H01L2924/09701 , H01L2924/14 , H01L2924/181
摘要： A surface mount flat package for a semiconductor device includes a number of leads on a lead frame. At least one of the leads is straight with a thick section and a thin section. Part of the thin section is inside a protective medium and part extends outside. A bottom surface of the part extending outside the protective medium serves as a connection terminal for the semiconductor device. Another lead is an island lead that has a bonding island on an upper surface thereof. The island lead has a thick section and a thin section. The bonding island is on the thin section. The thin section is entirely within the protective medium. A bottom surface of the thick section is exposed outside the protective medium to serve as a connection terminal. The bottom surfaces of the thick sections are coplanar with each other and preferably coplanar with a bottom surface of the package.
摘要翻译：用于半导体器件的表面贴装扁平封装包括引线框架上的多个引线。引线中的至少一个是直的，具有厚的部分和薄的部分。部分薄壁部分在保护介质的内部，部分延伸到外面。延伸到保护介质外部的部分的底表面用作半导体器件的连接端子。另一引线是在其上表面具有接合岛的岛引线。岛上有一个厚实的部分和薄的部分。接合岛在薄的部分。薄部分完全在保护介质内。厚壁的底面暴露在保护介质的外面，作为连接端子。厚部分的底表面彼此共面并且优选地与包装的底表面共面。

5. 发明授权

US06841421B2 Method of manufacturing wiring structure of a power semiconductor device 有权
标题翻译：制造功率半导体器件的布线结构的方法
公开(公告)号：US06841421B2
公开(公告)日：2005-01-11
申请号：US10374728
申请日：2003-02-27
申请人： Tsutomu Aono , Kikuo Okada
发明人： Tsutomu Aono , Kikuo Okada
IPC分类号： H01L23/48 , H01L23/522 , H01L27/10 , H01L21/44
CPC分类号： H01L27/10 , H01L23/5222 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/45565 , H01L2224/45601 , H01L2224/48472 , H01L2924/01046 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/00014 , H01L2924/00 , H01L2224/45644 , H01L2224/45639 , H01L2224/45664
摘要： A semiconductor device includes a power supply semiconductor chip that has a plurality of current passing electrodes. Conductive plates are disposed on the current electrodes, and conductive wires used for an external connection of the device are fixed on the conductive plates, but not directly on the current passing electrode. A large plate is first fixed on the semiconductor chip, and then the back surface of the large plate is removed to form the individual conductive plates. Because the conductive wires are soldered onto the conductive plates, the semiconductor chip does not receive impact of wire bonding. Even when the conductive wires are wire bonded to the conductive plates, the plates may serve as shock absorbers during wire bonding procedure to reduce the impact of the wire bonding.
摘要翻译：半导体器件包括具有多个电流通过电极的电源半导体芯片。导电板设置在电流电极上，用于器件外部连接的导线固定在导电板上，而不是直接穿过电流通过的电极。首先将大的板固定在半导体芯片上，然后去除大板的后表面以形成各个导电板。由于导线被焊接到导电板上，所以半导体芯片不会受到引线接合的冲击。即使当导线被导线接合到导电板上时，板也可以在引线接合过程中用作减震器，以减少引线接合的冲击。

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