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    • 9. 发明申请
    • Release-treated substrate and method of producing the same
    • 脱模处理底物及其制备方法
    • US20070036992A1
    • 2007-02-15
    • US11498099
    • 2006-08-03
    • Kazumasa TanakaMasatomi Harada
    • Kazumasa TanakaMasatomi Harada
    • B32B25/20B05D3/02
    • C09D183/06C09J7/401C09J2205/31C09J2483/005Y10T428/31663
    • A release-treated substrate is a release-treated substrate having a release treating agent layer by a cationically polymerizable ultraviolet curing silicone treating agent at least partially on at least one side of the substrate, and is characterized in that the cationically polymerizable ultraviolet curing silicone treating agent is at least partially applied to at least one side of the substrate, and heat treatment is then conducted before conducting ultraviolet irradiation treatment. As the cationically polymerizable ultraviolet curing silicone treating agent, a cationically polymerizable ultraviolet curing silicone treating agent in which a modified silicone polymer component having at least two epoxy groups in the molecule is an effective component is suitable. It is preferable that temperature in the heat treatment is from 35 to 120° C.
    • 经脱模处理的基材是至少部分地在基材的至少一侧上通过可阳离子聚合的紫外线固化性硅氧烷处理剂具有脱模处理剂层的剥离处理基材,其特征在于,所述阳离子聚合性紫外线固化型硅氧烷处理 试剂至少部分地施加到基材的至少一侧,然后在进行紫外线照射处理之前进行热处理。 作为阳离子聚合性紫外线固化型硅氧烷处理剂,分子中具有至少2个环氧基的改性有机硅聚合物成分为有效成分的阳离子聚合性紫外线固化型硅氧烷处理剂是适合的。 热处理中的温度优选为35〜120℃