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1. 发明申请

US20060063401A1 Fixing member 有权
公开(公告)号：US20060063401A1
公开(公告)日：2006-03-23
申请号：US10946131
申请日：2004-09-22
申请人： Kohji Ariga , Yutaka Iguchi , Hisayasu Mase
发明人： Kohji Ariga , Yutaka Iguchi , Hisayasu Mase
IPC分类号： H05K1/00
CPC分类号： H05K5/0039 , H01R12/7023 , H01R12/724
摘要： A fixing member includes a case member provided with at least a substrate supporting member adjusted to support a substrate and integrally provided with a connector, a cap member adjusted to be fixed to the case member, at least an external force transmitting portion extending at the substrate supporting member between the substrate supporting member and the cap member and adjusted to transmit an external force subjected to the connector to the cap member while the case member has been fixed at the cap member.

2. 发明授权

US07144258B2 Fixing member 有权
标题翻译：固定件
公开(公告)号：US07144258B2
公开(公告)日：2006-12-05
申请号：US10946131
申请日：2004-09-22
申请人： Kohji Ariga , Yutaka Iguchi , Hisayasu Mase
发明人： Kohji Ariga , Yutaka Iguchi , Hisayasu Mase
IPC分类号： H01R12/00
CPC分类号： H05K5/0039 , H01R12/7023 , H01R12/724
摘要： A fixing member includes a case member provided with at least a substrate supporting member adjusted to support a substrate and integrally provided with a connector, a cap member adjusted to be fixed to the case member, at least an external force transmitting portion extending at the substrate supporting member between the substrate supporting member and the cap member and adjusted to transmit an external force subjected to the connector to the cap member while the case member has been fixed at the cap member.
摘要翻译：固定构件包括至少设置有用于支撑基板并且一体地设置有连接器的基板支撑构件的壳体构件，被调整为固定到壳体构件的盖构件，至少在基板处延伸的外力传递部支撑构件在基板支撑构件和盖构件之间，并且在外壳构件已经固定在盖构件上时被调节以将经过连接器的外力传递到盖构件。

3. 发明授权

US07377032B2 Process for producing a printed wiring board for mounting electronic components 失效
标题翻译：用于制造用于安装电子部件的印刷线路板的工艺
公开(公告)号：US07377032B2
公开(公告)日：2008-05-27
申请号：US10991921
申请日：2004-11-18
申请人： Shinichi Sumi , Yutaka Iguchi
发明人： Shinichi Sumi , Yutaka Iguchi
IPC分类号： H05K3/02
CPC分类号： H05K3/4069 , H05K1/113 , H05K3/246 , H05K2201/0347 , H05K2201/0394 , H05K2201/09909 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/53548
摘要： A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion is overlaid with a covering layer 9 obtained by applying a conductive paste to cover at least the boundary between the filled via 4 and the insulating layer 2; alternatively, a plating resist 7 is formed at the other end portion to cover at least the boundary between the filled via 4 and the insulating layer 2, and is removed after an end portion of the filled via 4 enclosed within the plating resist 7 is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via 4 and the insulating layer 2.
摘要翻译：一种用于安装电子部件的印刷线路板包括绝缘层和形成在绝缘层的一个表面上的布线图案，其中填充的通孔4的一个端部与布线图案连接，另一个端部覆盖有覆盖层通过施加导电浆料至少覆盖填充的通孔4和绝缘层2之间的边界获得的层9; 可选地，在另一端部形成电镀抗蚀剂7，以至少覆盖填充的通孔4和绝缘层2之间的边界，并且在封装在电镀抗蚀剂7中的填充通孔4的端部被电镀之后被去除以制造端子层，从而防止诸如镀锡溶液之类的湿处理液体在填充的通孔4和绝缘层2之间泄漏。

4. 发明申请

US20050111205A1 Printed wiring board for mounting electronic components, and production process thereof and semiconductor device 失效
标题翻译：用于安装电子部件的印刷线路板及其制造方法以及半导体装置
公开(公告)号：US20050111205A1
公开(公告)日：2005-05-26
申请号：US10991921
申请日：2004-11-18
申请人： Shinichi Sumi , Yutaka Iguchi
发明人： Shinichi Sumi , Yutaka Iguchi
IPC分类号： H05K1/11 , H05K3/24 , H05K3/40
CPC分类号： H05K3/4069 , H05K1/113 , H05K3/246 , H05K2201/0347 , H05K2201/0394 , H05K2201/09909 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49165 , Y10T29/53548
摘要： A printed wiring board for mounting electronic components includes an insulating layer and a wiring pattern formed on one surface of the insulating layer, wherein one end portion of a filled via 4 is connected with the wiring pattern and the other end portion is overlaid with a covering layer 9 obtained by applying a conductive paste to cover at least the boundary between the filled via 4 and the insulating layer 2; alternatively, a plating resist 7 is formed at the other end portion to cover at least the boundary between the filled via 4 and the insulating layer 2, and is removed after an end portion of the filled via 4 enclosed within the plating resist 7 is plated to produce a terminal layer, thereby preventing a wet processing liquid such as a tin plating solution from leaking in between the filled via 4 and the insulating layer 2.
摘要翻译：一种用于安装电子部件的印刷线路板包括绝缘层和形成在绝缘层的一个表面上的布线图案，其中填充的通孔4的一个端部与布线图案连接，另一个端部覆盖有覆盖层通过施加导电浆料至少覆盖填充的通孔4和绝缘层2之间的边界获得的层9; 可选地，在另一端部形成电镀抗蚀剂7，以至少覆盖填充的通孔4和绝缘层2之间的边界，并且在封装在电镀抗蚀剂7中的填充通孔4的端部被电镀之后被去除以制造端子层，从而防止诸如镀锡溶液之类的湿处理液体在填充的通孔4和绝缘层2之间泄漏。

5. 发明申请

US20070264813A1 Process for producing a film carrier tape for mounting an electronic part 审中-公开
标题翻译：用于制造用于安装电子部件的胶片载带的方法
公开(公告)号：US20070264813A1
公开(公告)日：2007-11-15
申请号：US11880764
申请日：2007-07-24
申请人： Nobuaki Fujii , Yutaka Iguchi
发明人： Nobuaki Fujii , Yutaka Iguchi
IPC分类号： H01L21/60
CPC分类号： H05K3/3452 , H01L21/4846 , H01L23/49572 , H01L23/4985 , H01L2924/0002 , H05K1/0393 , H05K3/1225 , H05K2203/0594 , H01L2924/00
摘要： A film carrier tape for mounting an electronic part, comprising an insulating film, a wiring pattern formed on a surface of the insulating film and a solder resist layer formed on the wiring pattern except connecting lead portions of the wiring pattern, wherein the solder resist coating thickness at the edge portion of the solder resist layer is continuously decreased toward the tip of the edge portion. The film carrier tape for mounting an electronic part can be produced by applying a solder resist coating solution onto the wiring pattern using a screen in which opening sizes at the edge portion of a coating solution passing zone are reduced stepwise or continuously or by applying a solder resist coating solution onto the wiring pattern while pressing a film carrier against the screen so as to decrease a coating weight of the solder resist coating solution continuously or stepwise toward the tip of the edge portion of the resulting solder resist layer. A screen for solder resist coating, comprising a gauze having an area in which opening sizes are changed stepwise or continuously.
摘要翻译：一种用于安装电子部件的胶片载带，包括绝缘膜，形成在绝缘膜的表面上的布线图案和除了布线图案的连接引线部分之外形成在布线图案上的阻焊层，其中阻焊涂层阻焊层的边缘部分的厚度朝着边缘部分的尖端连续减小。用于安装电子部件的胶片载带可以通过使用屏幕涂布阻焊涂层溶液来制造，其中涂布溶液通过区域的边缘部分的开口尺寸逐步或连续地减少或通过施加焊料在将薄膜载体压靠在屏幕上的同时将涂布溶液涂覆到布线图案上，以便使阻焊涂层溶液的连续或逐步朝向所得阻焊层的边缘部分的末端减小涂层重量。一种用于阻焊涂层的屏幕，包括具有开口尺寸逐步或连续地改变的区域的纱布。

6. 发明申请

US20060068164A1 Film carrier tape for mounting electronic devices thereon and flexible substrate 审中-公开
标题翻译：用于在其上安装电子装置的薄膜载带和柔性基板
公开(公告)号：US20060068164A1
公开(公告)日：2006-03-30
申请号：US11235139
申请日：2005-09-27
申请人： Yutaka Iguchi
发明人： Yutaka Iguchi
IPC分类号： B32B3/10
CPC分类号： H01L23/4985 , H01L2924/0002 , H05K1/0259 , H05K1/0393 , H05K1/167 , H05K3/0097 , H05K2201/09063 , H05K2201/09781 , H05K2203/1545 , Y10T428/24273 , Y10T428/24917 , H01L2924/00
摘要： The invention provides a film carrier tape for mounting electronic devices thereon and a flexible substrate, which prevent generation of static electricity, thereby enhancing reliability and productivity of a semiconductor chip mounting line. The film carrier tape for mounting electronic devices thereon including a continuous insulating layer; a wiring pattern formed through patterning of a conductor layer and provided on at least a top surface of the insulating layer; a row of sprocket holes provided along each longitudinal edge of the wiring pattern; an electricity-conducting layer provided on the top surface of the insulating layer continuously in the longitudinal direction of the insulating layer; and an antistatic layer formed of an antistatic agent which is provided at least on each longitudinal edge or in an area in the vicinity of each edge of a bottom surface of the insulating layer in the longitudinal direction of the insulating layer, wherein the electricity-conducting layer or the conductor layer electrically connected with the electricity-conducting layer is electrically connected with the antistatic layer through a longitudinal side surface of the tape or through inner peripheral surfaces of the sprocket holes.
摘要翻译：本发明提供了一种用于在其上安装电子器件的胶片载带和一种防止产生静电的柔性基板，从而提高半导体芯片安装线的可靠性和生产率。用于在其上安装其上的电子器件的胶片载带，包括连续的绝缘层; 通过图案化导体层形成并设置在绝缘层的至少顶表面上的布线图案; 沿着布线图案的每个纵向边缘设置的一排链轮孔; 在所述绝缘层的长度方向上连续设置在所述绝缘层的上表面的导电层; 以及由绝缘层的纵向至少设置在绝缘层的下表面的每个边缘的每个边缘的每个纵向边缘或每个边缘附近的区域中的抗静电剂形成的抗静电层，其中导电与导电层电连接的导体层通过带的纵向侧表面或通过链轮孔的内周表面与抗静电层电连接。

7. 发明授权

US5078421A Pressure control system for suspension 失效
标题翻译：压力控制系统
公开(公告)号：US5078421A
公开(公告)日：1992-01-07
申请号：US573706
申请日：1990-08-28
申请人： Kouichi Kokubo , Yutaka Iguchi , Toshio Aburaya , Masaki Kawanishi , Kunihito Sato , Takashi Yonekawa , Shuuichi Buma
发明人： Kouichi Kokubo , Yutaka Iguchi , Toshio Aburaya , Masaki Kawanishi , Kunihito Sato , Takashi Yonekawa , Shuuichi Buma
IPC分类号： B60G17/015 , B60G17/00 , B60G17/0185 , G01M17/04
CPC分类号： B60G17/0185 , B60G2202/24 , B60G2400/104 , B60G2400/106 , B60G2400/204 , B60G2400/25 , B60G2400/252 , B60G2400/30 , B60G2400/33 , B60G2400/41 , B60G2400/5182 , B60G2500/30 , B60G2600/04 , B60G2600/08 , B60G2600/12 , B60G2600/14 , B60G2600/16 , B60G2600/20 , B60G2600/604 , B60G2600/70 , B60G2600/76 , B60G2600/82 , B60G2800/012 , B60G2800/014
摘要： A suspension pressure control system on a vehicle applies a pressure which is proportional to a current level supplied to a solenoid of a pressure control valve to a shock absorber associated with respective one of suspensions from the valve. An electronic controller controls the current level to maintain an attitude of a vehicle substantially constant in spite of any change of longitudinal and lateral acceleration, which are detected by acceleration sensors. If a driver on the vehicle closes test indication switches TSW1 and TSW2, indicates "high" by a height indication switch HSW and rotates a steering wheel on the vehicle by B toward right, the vehicle laterally inclines such that a height of the left side of the vehicle rises up and a right side falls down responding to the rotation of the steering wheel. The inclination increases as the rotation of the steering wheel increases. The inclination decreases when the steering wheel rotates inverse direction toward the neutral position. When the steering wheel rotates beyond the neutral position toward left, the vehicle laterally inclines such that the height of the left side of the vehicle calls down and the right side rises up responding to the rotation of the steering wheel.

8. 发明授权

US07523548B2 Method for producing a printed circuit board 有权
标题翻译：印刷电路板的制造方法
公开(公告)号：US07523548B2
公开(公告)日：2009-04-28
申请号：US10580948
申请日：2004-12-02
申请人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi
发明人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi
IPC分类号： H05K3/02 , B05D5/12
CPC分类号： H05K3/06 , H05K3/381 , H05K3/388 , H05K2201/0338 , H05K2201/098 , Y10T29/49124 , Y10T29/49155 , Y10T29/5164
摘要： A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.
摘要翻译：一种制造印刷电路板的方法包括以下步骤：在绝缘膜的至少一个表面上沉积贱金属以形成贱金属层，并进一步沉积铜或铜合金以形成导电金属层，然后除去表面通过蚀刻形成布线图案，然后用能够溶解和/或钝化形成基底金属层的金属的处理液对基底金属层进行处理。所提供的印刷电路板包括绝缘膜和形成在绝缘膜的至少一个表面上的布线图案，布线图案包括沉积在绝缘膜表面上的基底金属层和导电金属层，所述基底金属层用于形成布线图案比形成布线图案的导电金属层的宽度方向突出。

9. 发明申请

US20080236872A1 Printed Wiring Board, Process For Producing the Same and Semiconductor Device 审中-公开
标题翻译：印刷电路板，生产工艺及半导体器件
公开(公告)号：US20080236872A1
公开(公告)日：2008-10-02
申请号：US11632793
申请日：2005-06-03
申请人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi , Hiroaki Kurihara , Naoya Yasui
发明人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi , Hiroaki Kurihara , Naoya Yasui
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K3/26 , H05K3/06 , H05K3/067 , H05K3/244 , H05K3/388 , H05K2201/0761 , H05K2203/1157 , H05K2203/1476 , Y10T29/49124
摘要： The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 μg/cm2. According to the present invention, the metal derived from the etching solution is removed by the use of a reducing substance-containing solution. Therefore, the water rinsing step in the production process can be shortened, occurrence of migration attributable to the residual metal can be prevented, and a printed wiring board having high reliability can be efficiently produced.
摘要翻译：本发明的印刷电路板是通过多个蚀刻步骤选择性地蚀刻形成在绝缘膜上的具有基底金属层和导电金属层的基膜而制造的印刷线路板，其中包括导电金属蚀刻步骤和贱金属蚀刻步骤，以形成布线图形，然后将具有如此形成的布线图案的基底膜与含有还原物质的还原水溶液接触，其中源自印刷布线上的蚀刻溶液的残余金属的量板不超过0.05毫升/厘米2。根据本发明，通过使用还原性物质的溶液除去来自蚀刻溶液的金属。因此，可以缩短生产过程中的水洗步骤，可以防止由于残留金属引起的迁移的发生，并且可以有效地生产具有高可靠性的印刷线路板。

10. 发明申请

US20070145584A1 Printed wiring board, method for manufacturing same, and circuit device 审中-公开
标题翻译：印刷电路板，其制造方法和电路装置
公开(公告)号：US20070145584A1
公开(公告)日：2007-06-28
申请号：US10583846
申请日：2004-12-10
申请人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi
发明人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi
IPC分类号： H01L23/48
CPC分类号： C25D5/02 , C25D7/00 , H01L2924/0002 , H05K3/06 , H05K3/067 , H05K3/22 , H05K3/388 , H05K2201/0338 , H05K2201/098 , H05K2203/0346 , H05K2203/1476 , H01L2924/00
摘要： The printed wiring board comprises, on at least one surface of an insulating film, a base metal layer and a conductive metal layer formed on the base metal layer, and is characterized in that in a section of the wiring board the bottom width of the conductive metal layer is smaller than the top width of the base metal layer. The circuit device comprises the printed wiring board and an electronic part mounted thereon. The process for producing a printed wiring board comprises bringing a base metal layer and a conductive metal layer into contact with an etching solution capable of dissolving the conductive metal to form a wiring pattern and then sequentially bringing the resultant into contact with a first treating solution capable of dissolving the metal for forming the base metal layer, a microetching solution capable of selectively dissolving the conductive metal and a second treating solution having a different chemical composition from the first treating solution in this order.
摘要翻译：印刷布线板在绝缘膜的至少一个表面上包括形成在基底金属层上的基底金属层和导电金属层，其特征在于，在布线板的一部分中，导电的底部宽度金属层比基体金属层的顶部宽度小。电路装置包括印刷线路板和安装在其上的电子部件。制造印刷电路板的方法包括使基底金属层和导电金属层与能够溶解导电金属的蚀刻溶液接触以形成布线图案，然后顺序地使得到的第一处理溶液与第一处理溶液接触溶解用于形成基底金属层的金属，能够依次从第一处理溶液中选择性地溶解导电金属的微蚀刻溶液和具有不同化学组成的第二处理溶液。

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