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1. 发明申请

US20080236872A1 Printed Wiring Board, Process For Producing the Same and Semiconductor Device 审中-公开
标题翻译：印刷电路板，生产工艺及半导体器件
公开(公告)号：US20080236872A1
公开(公告)日：2008-10-02
申请号：US11632793
申请日：2005-06-03
申请人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi , Hiroaki Kurihara , Naoya Yasui
发明人： Tatsuo Kataoka , Yoshikazu Akashi , Yutaka Iguchi , Hiroaki Kurihara , Naoya Yasui
IPC分类号： H05K1/00 , H05K3/00
CPC分类号： H05K3/26 , H05K3/06 , H05K3/067 , H05K3/244 , H05K3/388 , H05K2201/0761 , H05K2203/1157 , H05K2203/1476 , Y10T29/49124
摘要： The printed wiring board of the present invention is a printed wiring board produced by selectively etching a base film having a base metal layer and a conductive metal layer, which are formed on an insulating film, through plural etching steps comprising a conductive metal etching step and a base metal etching step to form a wiring pattern and then bringing the base film having the thus formed wiring pattern into contact with a reducing aqueous solution containing a reducing substance, wherein the amount of a residual metal derived from the etching solution on the printed wiring board is not more than 0.05 μg/cm2. According to the present invention, the metal derived from the etching solution is removed by the use of a reducing substance-containing solution. Therefore, the water rinsing step in the production process can be shortened, occurrence of migration attributable to the residual metal can be prevented, and a printed wiring board having high reliability can be efficiently produced.
摘要翻译：本发明的印刷电路板是通过多个蚀刻步骤选择性地蚀刻形成在绝缘膜上的具有基底金属层和导电金属层的基膜而制造的印刷线路板，其中包括导电金属蚀刻步骤和贱金属蚀刻步骤，以形成布线图形，然后将具有如此形成的布线图案的基底膜与含有还原物质的还原水溶液接触，其中源自印刷布线上的蚀刻溶液的残余金属的量板不超过0.05毫升/厘米2。根据本发明，通过使用还原性物质的溶液除去来自蚀刻溶液的金属。因此，可以缩短生产过程中的水洗步骤，可以防止由于残留金属引起的迁移的发生，并且可以有效地生产具有高可靠性的印刷线路板。

2. 发明申请

US20080006441A1 Wiring board and semiconductor device excellent in folding endurance 审中-公开
标题翻译：接线板和半导体器件耐折性优异
公开(公告)号：US20080006441A1
公开(公告)日：2008-01-10
申请号：US11825039
申请日：2007-07-03
申请人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
发明人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
IPC分类号： H05K1/16
CPC分类号： H05K3/28 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/09701 , H05K1/032 , H05K1/09 , H05K2201/0154 , H05K2201/0191 , H05K2201/0355 , H05K2201/10674 , H01L2224/0401
摘要： A wiring board with folding endurance includes an insulating film and a copper-containing wiring pattern on a surface of the insulating film, and includes an insulating resin coating layer formed on the wiring pattern such that terminals are exposed. The wiring board has any of the constitutions (A), (B), (C) and (D) below. (A) The wiring pattern includes copper particles having a mean crystal particle diameter in the range of from 0.65 to 0.85 μm as determined by EBSP; not more than 1% of the volume of the wiring pattern is accounted for by copper crystal particles having a particle diameter of less than 1.0 μm as determined by EBSP; and copper crystal particles that are [100] oriented in the longitudinal direction of a lead of the wiring pattern account for from 10 to 20% of the volume of the wiring pattern as determined by EBSP. (B) The insulating film is formed of a polyimide film having a tensile strength within the range of from 450 to 600 MPa and a Young's modulus within the range of from 8500 to 9500 MPa. (C) The insulating film is formed of a polyimide film having a thickness of from 10 to 30 μm. (D) The insulating resin coating layer has a thickness of from 50 to 150% relative to the thickness of the insulating film.
摘要翻译：具有耐折性的布线板在绝缘膜的表面上包括绝缘膜和含铜布线图案，并且包括形成在布线图案上以使端子露出的绝缘树脂涂层。布线板具有下述（A），（B），（C）和（D）中的任何一个。（A）布线图案包括通过EBSP测定的平均结晶粒径在0.65至0.85μm范围内的铜颗粒; 通过EBSP测定，不超过1％的布线图案的体积由具有小于1.0μm的粒径的铜结晶粒子占据; 并且沿着布线图案的引线的纵向取向的铜结晶粒子占由EBSP确定的布线图案的体积的10至20％。（B）绝缘膜由拉伸强度为450〜600MPa，杨氏模量为8500〜9500MPa的聚酰亚胺膜形成。（C）绝缘膜由厚度为10〜30μm的聚酰亚胺膜形成。（D）绝缘树脂被覆层的厚度相对于绝缘膜的厚度为50〜150％。

3. 发明申请

US20070090086A1 Two-layer flexible printed wiring board and method for manufacturing the two-layer flexible printed wiring board 审中-公开
标题翻译：双层柔性印刷线路板及制造双层柔性印刷线路板的方法
公开(公告)号：US20070090086A1
公开(公告)日：2007-04-26
申请号：US11585679
申请日：2006-10-24
申请人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
发明人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
IPC分类号： H01B13/00 , B32B3/00 , B32B7/00
CPC分类号： H05K1/028 , B32B15/08 , B32B15/20 , H05K1/09 , H05K3/06 , H05K2201/0355 , H05K2203/0353 , H05K2203/0369 , Y10T428/24917
摘要： An object of the present invention is to provide a flexible printed wiring board, excellent in folding ability, obtained from a flexible copper-clad laminate using an electro-deposited copper foil. In order to achieve the object, there is provided a two-layer flexible printed wiring board having a wiring, formed by etching an electro-deposited copper foil, on a surface of a resin film layer, the wiring including only a steady-deposition crystal layer 2 formed by removing an initial-deposition crystal layer 1 formed at the time of the electro-deposited copper foil preparation. When the two-layer flexible printed wiring board has a cover film layer, preferably the deviation between the neutral line of the sectional thickness of the two-layer flexible printed wiring board and the central line of the wiring thickness of the two-layer flexible printed wiring board falls within 5% of the total thickness of the two-layer flexible printed wiring board.
摘要翻译：本发明的目的是提供一种使用电沉积铜箔的柔性覆铜层压板获得的折叠能力优异的柔性印刷线路板。为了实现该目的，提供了一种双层柔性印刷布线板，其具有在树脂膜层的表面上蚀刻电解铜箔而形成的布线，该布线仅包括稳定沉积晶体通过去除在电沉积铜箔制备时形成的初始沉积晶体层1形成的层2。当双层柔性印刷电路板具有覆盖膜层时，优选地，两层柔性印刷电路板的截面厚度的中性线与两层柔性印刷电路板的布线厚度的中心线之间的偏差接线板落在两层柔性印刷电路板总厚度的5％以内。

4. 发明申请

US20080063838A1 Film Carrier Tape for Mounting Electronic Components and Method of Manufacturing the Film Carrier Tape 审中-公开
标题翻译：用于安装电子元件的胶片载带和制造胶片载带的方法
公开(公告)号：US20080063838A1
公开(公告)日：2008-03-13
申请号：US11850361
申请日：2007-09-05
申请人： Hiroaki Kurihara , Naoya Yasui
发明人： Hiroaki Kurihara , Naoya Yasui
IPC分类号： D06N7/04 , B44C1/17
CPC分类号： H05K3/383 , H01L23/4985 , H01L2924/0002 , H01L2924/3011 , H05K1/0393 , H05K3/022 , H05K2203/0353 , Y10T428/24355 , H01L2924/00
摘要： A film carrier tape for mounting electronic components has a wiring with a wire pitch of 35 μm or less. A method for manufacturing such film carrier tape is also disclosed. The film carrier tape for mounting electronic components is manufactured using a specific flexible conductor foil clad laminate as a wiring forming material. The flexible conductor foil clad laminate includes a base film and a conductor foil having a surface roughness (Rzjis) of a bonded surface of 2.5 μm or less and a surface roughness (Rzjis) of a resist-side surface of 1.0 μm or less. The flexible conductor foil clad laminate may be a flexible copper clad laminate in which a glossy-surface-processed electrolytic copper foil has a surface roughness (Rzjis) of a bonded surface of 2.5 μm or less and a surface roughness (Rzjis) of a resist-side surface of 1.5 μm or less and in which the copper foil is half etched as required to not less than half an original thickness.
摘要翻译：用于安装电子部件的胶片载带具有35μm或更小的导线间距的布线。还公开了制造这种薄膜载带的方法。用于安装电子部件的胶片载带使用特定的柔性导体箔覆层压板作为布线形成材料制造。柔性导体箔覆层压板包括基底膜和具有2.5μm或更小的接合表面的表面粗糙度（Rz / is is is）和表面粗糙度（Rz < SUB>）为1.0μm以下的抗蚀剂侧表面。挠性导体箔覆层压板可以是柔性覆铜层压板，其中光泽表面处理的电解铜箔具有2.5μm或更小的接合表面的表面粗糙度（Rz / is is），和抗蚀剂侧表面的表面粗糙度（Rz is is is）为1.5μm以下，根据需要将铜箔半蚀刻到不少于原始厚度的一半。

5. 发明申请

US20070098910A1 Flexible copper clad laminate, flexible printed wiring board obtained by using flexible copper clad laminate thereof, film carrier tape obtained by using flexible copper clad laminate thereof, semiconductor device obtained by using flexible copper clad laminate thereof, method of manufacturing flexible copper clad laminate and method of manufacturing film carrier tape 审中-公开
标题翻译：柔性覆铜层压板，通过使用柔性覆铜层压板获得的柔性印刷布线板，使用柔性覆铜层压板获得的薄膜载带，使用柔性覆铜层压板获得的半导体器件，柔性覆铜层压板的制造方法制造薄膜载带
公开(公告)号：US20070098910A1
公开(公告)日：2007-05-03
申请号：US11580683
申请日：2006-10-13
申请人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
发明人： Makoto Yamagata , Hiroaki Kurihara , Naoya Yasui , Noriaki Iwata
IPC分类号： B05D7/00 , B05D1/36 , B32B3/00 , B32B7/00 , B32B15/00
CPC分类号： H05K1/09 , C25D1/04 , H05K1/0393 , H05K3/384 , H05K2201/0355 , H05K2201/10477 , H05K2203/0307 , Y10T428/24917
摘要： An object of the invention is to provide a flexible copper clad laminate and the like in use of electro-deposited copper foil having lower profile and higher mechanical strength compared with conventional low profile electro-deposited copper foil having been supplied in the market. For attaining the object, a flexible copper clad laminate manufactured by laminating the electro-deposited copper foil to resin film, which is characterized in that a deposition surface of the electro-deposited copper foil comprises a low profile glossy surface having surface roughness (Rzjis) of not more than 1.5 μm and brightness (Gs (60°)) of not less than 400 and the deposition surface and the resin film are bonded together is adopted. And, using the flexible copper clad laminate, it may ease manufacture of a flexible printed wiring board as a film carrier tape, such as a COF tape and the like, wherein the formed wiring has a fine pitch wiring with pitch being not more than 35 μm.
摘要翻译：本发明的目的是提供一种使用电镀铜箔的柔性覆铜层压板等，其具有比市面上提供的常规小型电沉积铜箔更低的轮廓和更高的机械强度。为了实现该目的，通过将电解铜箔层压到树脂膜上制造的柔性覆铜层压板，其特征在于，电沉积铜箔的沉积表面包括具有表面粗糙度（Rzjis）的低轮廓光泽表面，采用不大于1.5μm，亮度（Gs（60°））不小于400，沉积表面和树脂膜粘合在一起。并且，使用柔性覆铜层叠体，可以容易地制造作为COF带等的薄膜载带的柔性印刷布线板，其中所形成的布线具有间距不大于35的细间距布线妈妈

6. 发明授权

US07830667B2 Flexible wiring substrate and method for producing the same 失效
标题翻译：柔性布线基板及其制造方法
公开(公告)号：US07830667B2
公开(公告)日：2010-11-09
申请号：US12039073
申请日：2008-02-28
申请人： Hiroaki Kurihara
发明人： Hiroaki Kurihara
IPC分类号： H05K1/00
CPC分类号： H05K3/244 , H01L23/49572 , H01L23/49582 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13144 , H01L2224/16 , H01L2924/00014 , H01L2924/01019 , H01L2924/01078 , H01L2924/01079 , H01L2924/01322 , H05K3/28 , H05K3/384 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： Disclosed is a flexible wiring substrate which does not form anomalous deposition of tin-bismuth alloy plating, through prevention of exfoliation, during the process of plating with tin-bismuth alloy, of a solder resist layer. A method for producing the flexible wiring substrate is also disclosed.
摘要翻译：公开了一种柔性布线基板，其通过防止在锡 - 铋合金的电镀过程中防止剥离而形成锡 - 铋合金电镀的异常沉积。还公开了一种柔性布线基板的制造方法。

7. 发明授权

US06322904B1 Copper foil for printed circuit boards 失效
标题翻译：铜箔印刷电路板
公开(公告)号：US06322904B1
公开(公告)日：2001-11-27
申请号：US08822276
申请日：1997-03-20
申请人： Makoto Dobashi , Hiroaki Kurihara , Toshiko Yokota , Hiroshi Hata , Naotomi Takahashi , Tatsuya Sudo
发明人： Makoto Dobashi , Hiroaki Kurihara , Toshiko Yokota , Hiroshi Hata , Naotomi Takahashi , Tatsuya Sudo
IPC分类号： B21D3900
CPC分类号： H05K3/244 , C23C28/00 , C23C28/3225 , C23C28/345 , C23C28/347 , H05K3/282 , H05K2201/0355 , H05K2203/124 , Y10S428/901 , Y10T428/12556 , Y10T428/12611 , Y10T428/12792 , Y10T428/12903 , Y10T428/273
摘要： A copper foil having improved resistance to abrasion damage during the manufacture of printed circuit boards has a uniform deposit of benzotriazole (BTA) or BTA derivative, optionally a mixture thereof, of at least about 5 mg/m2.
摘要翻译：在制造印刷电路板期间具有改善的抗磨损损伤的铜箔具有至少约5mg / m 2的苯并三唑（BTA）或BTA衍生物（任选其混合物）的均匀沉积。

8. 发明申请

US20120234179A1 DUST COLLECTING SYSTEM 有权
标题翻译：垃圾收集系统
公开(公告)号：US20120234179A1
公开(公告)日：2012-09-20
申请号：US13508863
申请日：2010-11-08
申请人： Tadashi Miki , Masami Fukumoto , Osamu Eguchi , Yasuhiro Umekage , Kazuhiro Kuroyama , Hiroaki Kurihara
发明人： Tadashi Miki , Masami Fukumoto , Osamu Eguchi , Yasuhiro Umekage , Kazuhiro Kuroyama , Hiroaki Kurihara
IPC分类号： F24F3/16
CPC分类号： F24F1/0007 , F24F3/16 , F24F11/30 , F24F11/79 , F24F2120/10 , F24F2120/14
摘要： An indoor dust collecting system includes an air conditioner having an indoor unit that generates an air current, a dust collector, and a controller for controlling the air current from the indoor unit. A moving body detector is provided to detect a moving body such as, for example, a person, a pet, a cleaning robot, and the like. The air current from the indoor unit is controlled by the controller based on the position of the indoor unit, the position of a spot of occurrence of dust detected by the moving body detector, and the position of the dust collector such that the air current from the indoor unit reaches the dust collector via the spot of occurrence of dust in order for the dust collector to effectively suck the dust.
摘要翻译：室内集尘系统包括具有产生气流的室内单元的空气调节器，集尘器以及用于控制来自室内机的气流的控制器。提供移动体检测器来检测例如人，宠物，清洁机器人等的移动体。来自室内机的气流由控制器基于室内机的位置，由移动体检测器检测到的灰尘的出现位置以及集尘器的位置来控制，使得气流从室内机通过灰尘发生的地方到达集尘器，以使集尘器有效地吸入灰尘。

9. 发明授权

US07932470B2 Printed wiring board 失效
标题翻译：印刷电路板
公开(公告)号：US07932470B2
公开(公告)日：2011-04-26
申请号：US11850325
申请日：2007-09-05
申请人： Hiroaki Kurihara
发明人： Hiroaki Kurihara
IPC分类号： H05K1/00
CPC分类号： H05K1/147 , H01L23/49572 , H01L23/49833 , H01L23/49838 , H01L23/4985 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H05K1/142 , H05K2201/0784 , H05K2201/098 , H05K2201/10681 , H01L2224/0401
摘要： A printed wiring board group includes a plurality of printed wiring boards wherein a difference (ΔΩ−AB) between an average electric resistance (A-ave.) of wires formed in one printed wiring board (A) and an average electric resistance (B-ave.) of wires formed in a printed wiring board (B) adjacent to the printed wiring board (A) is within a range of ±5% of an average electric resistance (AB-ave.) of the wires of the printed wiring boards (A) and (B); and a difference (ΔΩ−ab) between an electric resistance (a-3) of an outermost wire of the printed wiring board (A) and an electric resistance (b-3) of an outermost wire of the printed wiring board (B) is within a range of ±11.05%, preferably within a range of ±6.12%, and is particularly preferably within a range of ±6.00% of the average electric resistance (AB-ave.) of the printed wiring boards (A) and (B).
摘要翻译：印刷电路板组包括多个印刷电路板，其中形成在一个印刷电路板（A）中的电线的平均电阻（A-ave）与平均电阻之间的差异（＆Dgr;＆Omega; -AB）在与印刷电路板（A）相邻的印刷电路板（B）中形成的电线（B-ave。）的线的平均电阻（AB-ave。）为±5％印刷电路板（A）和（B）; 以及印刷电路板（A）的最外层导线的电阻（a-3）与印刷线路板（A）的最外层导线的电阻（b-3）之间的差异（＆Dgr;＆amp; （B）在±11.05％的范围内，优选在±6.12％的范围内，特别优选在印刷电路板（A）的平均电阻（AB-ave。）的±6.00％的范围内）和（B）。

10. 发明申请

US20080053691A1 Printed Wiring Board 失效
标题翻译：印刷线路板
公开(公告)号：US20080053691A1
公开(公告)日：2008-03-06
申请号：US11850325
申请日：2007-09-05
申请人： Hiroaki Kurihara
发明人： Hiroaki Kurihara
IPC分类号： H05K1/02
CPC分类号： H05K1/147 , H01L23/49572 , H01L23/49833 , H01L23/49838 , H01L23/4985 , H01L2224/16 , H01L2924/00011 , H01L2924/00014 , H01L2924/01067 , H01L2924/01078 , H01L2924/01079 , H05K1/142 , H05K2201/0784 , H05K2201/098 , H05K2201/10681 , H01L2224/0401
摘要： A printed wiring board group includes a plurality of printed wiring boards wherein a difference (ΔΩ−AB) between an average electric resistance (A-ave.) of wires formed in one printed wiring board (A) and an average electric resistance (B-ave.) of wires formed in a printed wiring board (B) adjacent to the printed wiring board (A) is within a range of ±5% of an average electric resistance (AB-ave.) of the wires of the printed wiring boards (A) and (B); and a difference (ΔΩ−ab) between an electric resistance (a-3) of an outermost wire of the printed wiring board (A) and an electric resistance (b-3) of an outermost wire of the printed wiring board (B) is within a range of ±11.05%, preferably within a range of ±6.12%, and is particularly preferably within a range of ±6.00% of the average electric resistance (AB-ave.) of the printed wiring boards (A) and (B).
摘要翻译：印刷电路板组包括多个印刷电路板，其中形成在一个印刷电路板（A）中的电线的平均电阻（A-ave）与平均电阻（B）之间的差值（DeltaOmega-AB）在与印刷电路板（A）相邻的印刷电路板（B）中形成的导线的电导率在印刷电路板（A）的电线的平均电阻（AB-ave。）的±5％的范围内（A）和（B）; 以及印刷电路板（A）的最外面的电线的电阻（a-3）与印刷电路板（B）的最外面的电线的电阻（b-3）之间的差（DeltaOmega-ab）在±11.05％的范围内，优选在±6.12％的范围内，特别优选为印刷电路板（A）和（A）的平均电阻（AB-ave。）的±6.00％ B）。

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