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1. 发明授权

US08148268B2 Plasma treatment apparatus and plasma treatment method 有权
标题翻译：等离子体处理装置和等离子体处理方法
公开(公告)号：US08148268B2
公开(公告)日：2012-04-03
申请号：US12040011
申请日：2008-02-29
申请人： Kohei Sato , Hideaki Kondo , Susumu Tauchi , Akitaka Makino
发明人： Kohei Sato , Hideaki Kondo , Susumu Tauchi , Akitaka Makino
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： H01J37/3244 , H01J37/32449 , H01J37/32834
摘要： The invention provides a plasma treatment apparatus or a plasma treatment method having a high productivity while maintaining a stable treatment performance. In a plasma treatment apparatus feeding a plurality of gases fed into the treatment chamber and treating a sample arranged within the treatment chamber by a plasma formed by using the plurality of gases, the plasma treatment apparatus has a plurality of feeding gas lines in which the plurality of gases respectively pass, a plurality of gas flow rate regulators respectively arranged on the feeding gas lines and respectively regulating flow rates of the plurality of gases, and a testing gas flow path coupled to the gas line so as to be arranged outside the treatment chamber and arranging a tester testing a flow rate of a gas from a gas flow rate controller therein, and the plasma treatment apparatus tests the gas flow rate regulator on a gas line corresponding to the gas which is not used for the treatment in the plurality of gases in parallel with the treatment.
摘要翻译：本发明提供一种具有高生产率的等离子体处理装置或等离子体处理方法，同时保持稳定的处理性能。在等离子体处理装置中，供给进入处理室的多个气体并且通过使用多个气体形成的等离子体处理在处理室内布置的样品，等离子体处理装置具有多个供给气体管线，其中多个气体分别通过多个气体流量调节器，分别布置在供给气体管线上并分别调节多个气体的流量，以及连接到气体管线的测试气体流动路径，以布置在处理室外部以及对从气体流量控制器的气体流量进行测试的试验机进行排列，等离子体处理装置对气体流量调节器进行气体流量调节，所述气体管线对应于多个气体中不用于处理的气体与治疗同时进行。

2. 发明申请

US20090152242A1 PLASMA TREATMENT APPARATUS AND PLASMA TREATMENT METHOD 有权
标题翻译：等离子体处理装置和等离子体处理方法
公开(公告)号：US20090152242A1
公开(公告)日：2009-06-18
申请号：US12040011
申请日：2008-02-29
申请人： Kohei Sato , Hideaki Kondo , Susumu Tauchi , Akitaka Makino
发明人： Kohei Sato , Hideaki Kondo , Susumu Tauchi , Akitaka Makino
IPC分类号： C23F1/00
CPC分类号： H01J37/3244 , H01J37/32449 , H01J37/32834
摘要： The invention provides a plasma treatment apparatus or a plasma treatment method having a high productivity while maintaining a stable treatment performance. In a plasma treatment apparatus feeding a plurality of gases fed into the treatment chamber and treating a sample arranged within the treatment chamber by a plasma formed by using the plurality of gases, the plasma treatment apparatus has a plurality of feeding gas lines in which the plurality of gases respectively pass, a plurality of gas flow rate regulators respectively arranged on the feeding gas lines and respectively regulating flow rates of the plurality of gases, and a testing gas flow path coupled to the gas line so as to be arranged outside the treatment chamber and arranging a tester testing a flow rate of a gas from a gas flow rate controller therein, and the plasma treatment apparatus tests the gas flow rate regulator on a gas line corresponding to the gas which is not used for the treatment in the plurality of gases in parallel with the treatment.
摘要翻译：本发明提供一种具有高生产率的等离子体处理装置或等离子体处理方法，同时保持稳定的处理性能。在等离子体处理装置中，供给进入处理室的多个气体并且通过使用多个气体形成的等离子体处理在处理室内布置的样品，等离子体处理装置具有多个供给气体管线，其中多个气体分别通过多个气体流量调节器，分别布置在供给气体管线上并分别调节多个气体的流量，以及连接到气体管线的测试气体流动路径，以布置在处理室外部以及对从气体流量控制器的气体流量进行测试的试验机进行排列，等离子体处理装置对气体流量调节器进行气体流量调节，所述气体管线对应于多个气体中不用于处理的气体与治疗同时进行。

3. 发明授权

US08460467B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US08460467B2
公开(公告)日：2013-06-11
申请号：US13177076
申请日：2011-07-06
申请人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
发明人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
IPC分类号： C23F1/00 , C23C16/00 , H01L21/677
CPC分类号： H01L21/6719 , H01L21/67017 , Y10S414/135 , Y10S414/139
摘要： A vacuum processing apparatus includes a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas, and a mass flow controller unit interposed between two of the processing chambers for supplying gas to the chambers.
摘要翻译：一种真空处理装置，包括设置在其中心的转印单元，多个处理室，每个处理室具有用于支撑待处理物体的处理台，并使用气体进行处理;以及质量流量控制单元，用于向腔室供应气体的处理室。

4. 发明授权

US08286822B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US08286822B2
公开(公告)日：2012-10-16
申请号：US12651701
申请日：2010-01-04
申请人： Susumu Tauchi , Akitaka Makino
发明人： Susumu Tauchi , Akitaka Makino
IPC分类号： B65D6/40 , B65D53/02 , B65D43/04
CPC分类号： H01L21/67126 , H01L21/6719 , H01L21/67196 , H01L21/67201
摘要： The invention provides a highly reliable plasma processing apparatus having stable sealing performance. The vacuum processing apparatus comprises a vacuum vessel having its inside decompressed; an opening disposed in a wall of the vacuum vessel for communicating the inside with the outside thereof and through which a sample to be processed is taken in and out; a valve body 701 disposed outside the wall for airtightly sealing or opening the opening; and a drive unit for driving the valve body to carry out the sealing or opening operation, the drive unit comprising a first member 705 coupled to an actuator 702 that moves along a substantially linear first direction as a result of operation of the actuator, a second member 706 coupled to the first member 705 that moves along a substantially linear second direction that intersects with the first direction, and the valve body 701 coupled to the second member that seals the opening as a result of the movement of the second member.
摘要翻译：本发明提供了具有稳定的密封性能的高度可靠的等离子体处理装置。真空处理装置包括其内部减压的真空容器; 设置在真空容器的壁中的开口，用于将内部与其外部连通，并且待处理样品通过该开口被取出; 阀体701，其设置在所述壁的外侧，用于气密地密封或打开所述开口; 驱动单元，用于驱动阀体进行密封或打开操作，驱动单元包括第一构件705，第一构件705联接到作为致动器的操作的结果沿基本线性的第一方向移动的致动器702;第二构件构件706，其联接到第一构件705，其沿着与第一方向相交的基本上线性的第二方向移动;以及阀体701，其联接到由于第二构件的移动而密封开口的第二构件。

5. 发明申请

US20050194093A1 Plasma processing apparatus 有权
标题翻译：等离子体处理装置
公开(公告)号：US20050194093A1
公开(公告)日：2005-09-08
申请号：US10928259
申请日：2004-08-30
申请人： Akitaka Makino , Hideki Kihara , Susumu Tauchi
发明人： Akitaka Makino , Hideki Kihara , Susumu Tauchi
IPC分类号： H01L21/3065 , C23F1/00
CPC分类号： H01L21/6719 , H01J37/32522 , H01L21/67126 , Y10S156/916
摘要： The present invention provides a vacuum processing apparatus which is small-sized and requires a small installation area. The vacuum processing apparatus includes a vacuum container which has a processing chamber inside thereof, wherein the pressure inside the processing chamber is reduced and plasma used for processing a sample is formed inside the processing chamber, a bed portion which is arranged below the vacuum container and stores a device for supplying electricity and electric signals used for processing inside the vacuum container, and a transport chamber which is connected with the vacuum container and includes a transport device for transporting the sample inside thereof. The vacuum processing apparatus further includes a connector portion which is mounted on the bed portion in a state that the connector portion faces a lower portion of the transport chamber, wherein the bed portion is configured to be detachably mounted on the vacuum processing apparatus in a state that the bed portion performs the connection and the disconnection at the connector portion.
摘要翻译：本发明提供一种小型化并且需要小的安装面积的真空处理装置。真空处理装置包括在其内部具有处理室的真空容器，其中处理室内部的压力减小，处理室内部形成用于处理样品的等离子体，布置在真空容器下方的床部，存储用于供电的设备和用于在真空容器内部进行处理的电信号;以及运送室，其与该真空容器连接并且包括用于在其内部运送样品的运送装置。真空处理装置还包括连接器部分，其在连接器部分面向传送室的下部的状态下安装在床部分上，其中，床部分被构造成在状态下可拆卸地安装在真空处理设备上床部分在连接器部分处执行连接和断开。

6. 发明授权

US07976632B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US07976632B2
公开(公告)日：2011-07-12
申请号：US12034837
申请日：2008-02-21
申请人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
发明人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
IPC分类号： C23F1/00 , C23C16/00 , H01L21/677
CPC分类号： H01L21/6719 , H01L21/67017 , Y10S414/135 , Y10S414/139
摘要： A vacuum processing apparatus includes a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas, and a mass flow controller unit interposed between two of the processing chambers for supplying gas to the chambers.
摘要翻译：一种真空处理装置，包括设置在其中心的转印单元，多个处理室，每个处理室具有用于支撑待处理物体的处理台，并使用气体进行处理;以及质量流量控制单元，用于向腔室供应气体的处理室。

7. 发明授权

US07335277B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US07335277B2
公开(公告)日：2008-02-26
申请号：US10656334
申请日：2003-09-08
申请人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
发明人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
IPC分类号： C23F1/00 , H01L21/306 , C23C16/00
CPC分类号： H01L21/6719 , H01L21/67017 , Y10S414/135 , Y10S414/139
摘要： A vacuum processing apparatus comprising a transfer unit disposed at a center thereof, plural processing chambers, each processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas; and a mass flow controller unit interposed between two processing chambers for supplying gas to the chambers.
摘要翻译：一种真空处理装置，包括设置在其中心的转印单元，多个处理室，每个处理室具有用于支撑待处理物体的处理台，并使用气体进行处理; 以及插入在用于向所述室供应气体的两个处理室之间的质量流量控制器单元。

8. 外观设计

USD557425S1 Cover ring for a plasma processing apparatus 有权
标题翻译：等离子体处理装置的盖环
公开(公告)号：USD557425S1
公开(公告)日：2007-12-11
申请号：US29236933
申请日：2005-08-25
申请人： Tsutomu Nakamura , Susumu Tauchi , Akitaka Makino
设计人： Tsutomu Nakamura , Susumu Tauchi , Akitaka Makino

9. 发明授权

US07247207B2 Vacuum processing apparatus 有权
标题翻译：真空加工设备
公开(公告)号：US07247207B2
公开(公告)日：2007-07-24
申请号：US10812087
申请日：2004-03-30
申请人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
发明人： Akitaka Makino , Youji Takahashi , Minoru Soraoka , Hideki Kihara , Susumu Tauchi
IPC分类号： C23C16/00 , H01L21/00 , C23F1/00
CPC分类号： H01L21/6719 , H01L21/67017 , Y10S414/135 , Y10S414/139
摘要： A vacuum processing apparatus includes a vacuum processing chamber having a processing table for supporting an object to be processed and carrying out processing using a gas. The vacuum processing chamber has an axisymmetric structure, including a double wall structure, and a gate valve for sealing an opening through which the object enters the processing chamber.
摘要翻译：真空处理装置包括具有用于支撑待处理物体的处理台和使用气体进行处理的真空处理室。真空处理室具有轴对称结构，包括双壁结构，以及用于密封物体进入处理室的开口的闸阀。

10. 发明申请

US20060057008A1 Vacuum processing apparatus 失效
标题翻译：真空加工设备
公开(公告)号：US20060057008A1
公开(公告)日：2006-03-16
申请号：US11068990
申请日：2005-03-02
申请人： Susumu Tauchi , Akitaka Makino
发明人： Susumu Tauchi , Akitaka Makino
IPC分类号： A61M1/00
CPC分类号： H01L21/67126 , H01L21/6719 , H01L21/67196 , H01L21/67201
摘要： The invention provides a highly reliable plasma processing apparatus having stable sealing performance. The vacuum processing apparatus comprises a vacuum vessel having its inside decompressed; an opening disposed in a wall of the vacuum vessel for communicating the inside with the outside thereof and through which a sample to be processed is taken in and out; a valve body 701 disposed outside the wall for airtightly sealing or opening the opening; and a drive unit for driving the valve body to carry out the sealing or opening operation, the drive unit comprising a first member 705 coupled to an actuator 702 that moves along a substantially linear first direction as a result of operation of the actuator, a second member 706 coupled to the first member 705 that moves along a substantially linear second direction that intersects with the first direction, and the valve body 701 coupled to the second member that seals the opening as a result of the movement of the second member.
摘要翻译：本发明提供了具有稳定的密封性能的高度可靠的等离子体处理装置。真空处理装置包括其内部减压的真空容器; 设置在真空容器的壁中的开口，用于将内部与其外部连通，并且待处理样品通过该开口被取出; 阀体701，其设置在所述壁的外侧，用于气密地密封或打开所述开口; 驱动单元，用于驱动阀体进行密封或打开操作，驱动单元包括第一构件705，第一构件705联接到作为致动器的操作的结果沿基本线性的第一方向移动的致动器702;第二构件构件706，其联接到沿着与第一方向相交的基本线性的第二方向移动的第一构件705，以及联接到由于第二构件的移动而密封开口的第二构件的阀体701。

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