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1. 发明授权

US06822997B2 Semiconductor laser module and optical transmission system 失效
标题翻译：半导体激光模块和光传输系统
公开(公告)号：US06822997B2
公开(公告)日：2004-11-23
申请号：US10185174
申请日：2002-06-28
申请人： Kiyoshi Fujihara , Jun Ohya
发明人： Kiyoshi Fujihara , Jun Ohya
IPC分类号： H01S300
CPC分类号： G02B6/4208 , H01S5/0064 , H01S5/0222 , H01S5/02248 , H01S5/02284 , H01S5/02438 , Y10S372/703
摘要： The invention provides a semiconductor laser module and an optical transmission system, with which noise caused by light reflected back from a transmission path can be suppressed. The semiconductor laser module, includes a package having a window, a semiconductor laser chip outputting light, a lens that is optically designed such that it couples the light that is output by the semiconductor laser chip into an optical transmission path, an optical isolator that is disposed between the lens and the window, a temperature control mechanism for keeping temperature of these components constant, and a tubular ferrule that is holds and covers the optical transmission path. The semiconductor laser chip, the lens, the optical isolator, and the temperature control mechanism are arranged inside the package. A polarizer is arranged at an end face of the ferrule on the side of the package, such that the polarizer matches a polarization plane of the light that is emitted through the window of the package.
摘要翻译：本发明提供一种半导体激光器模块和光传输系统，可以抑制从传输路径反射的光引起的噪声。半导体激光器模块包括具有窗口的封装，输出光的半导体激光器芯片，光学设计的透镜，使得将由半导体激光器芯片输出的光耦合到光传输路径中，光隔离器是设置在透镜和窗口之间，用于保持这些部件的温度恒定的温度控制机构和保持并覆盖光传输路径的管状套圈。半导体激光芯片，透镜，光隔离器和温度控制机构布置在封装内。偏振器布置在套圈一侧的端面处，使得偏振器与通过封装的窗口发射的光的偏振平面匹配。

2. 发明授权

US08669571B2 Light distribution controller, light-emitting device using the same, and method for fabricating light distribution controller 失效
标题翻译：配光控制器，使用其的发光装置以及配光控制器的制造方法
公开(公告)号：US08669571B2
公开(公告)日：2014-03-11
申请号：US13701998
申请日：2011-07-04
申请人： Akihiko Murai , Masahiro Kume , Akiko Nakamura , Tooru Aoyagi , Kiyoshi Fujihara
发明人： Akihiko Murai , Masahiro Kume , Akiko Nakamura , Tooru Aoyagi , Kiyoshi Fujihara
IPC分类号： H01L33/00
CPC分类号： G09F13/04 , G02B19/0028 , G02B19/0066 , G02B19/0071 , H01L33/005 , H01L33/50 , H01L33/58
摘要： A light distribution controller of a light-emitting device includes a first optical member formed of ZnO disposed over an LED interposing a transparent adhesive, and a second optical member which covers the first optical member. The first optical member includes a first concave portion having an opening in a regular hexagon shape whose area gradually increases. In the first concave portion, inner wall surfaces having inclined surfaces, each of whose bases is formed by one side of the hexagon of the opening shape, are formed. Outside of the first optical member, outer wall surfaces each having a trapezoidal shape are formed. The second optical member includes a second concave portion arranged so that light at an annular peak in the light distribution characteristic of the light traveled through the first optical member is totally reflected.
摘要翻译：发光装置的配光控制器包括由设置在插入透明粘合剂的LED上的ZnO形成的第一光学部件和覆盖第一光学部件的第二光学部件。第一光学构件包括具有正六边形形状的开口的第一凹部，其面积逐渐增加。在第一凹部中，形成具有倾斜面的内壁面，其各自的底部由开口形状的六边形的一侧形成。在第一光学构件的外侧，形成各自具有梯形形状的外壁面。第二光学构件包括第二凹部，其布置成使得通过第一光学构件行进的光的光分布特性中的环形峰值处的光被全反射。

3. 发明申请

US20120305973A1 LIGHT-EMITTING DEVICE AND SURFACE LIGHT SOURCE DEVICE USING THE SAME 审中-公开
标题翻译：发光装置和使用其的表面光源装置
公开(公告)号：US20120305973A1
公开(公告)日：2012-12-06
申请号：US13522913
申请日：2011-01-25
申请人： Yoshihiko Chosa , Takashi Kuwaharada , Kiyoshi Fujihara , Kenichi Koya
发明人： Yoshihiko Chosa , Takashi Kuwaharada , Kiyoshi Fujihara , Kenichi Koya
IPC分类号： H01L33/60
CPC分类号： H01L33/50 , H01L25/0753 , H01L33/44 , H01L2224/48091 , H01L2224/48247 , H01L2933/0091 , H01L2924/00 , H01L2924/00014
摘要： To provide a light emitting device which emits high-luminance, uniform white light with reduced variations in luminance, a light emitting element 101 is mounted on a substrate 105 and covered with a wavelength conversion layer 106 of uniform thickness, and then a light scattering layer 107 made of a translucent resin containing a light reflecting material is formed. As the light scattering layer 107, a high density region 109 in which a density of the light reflecting material is high is formed immediately above a central part of a light emitting surface of the light emitting element 101, and a low density region 110 in which the density of the light reflecting material is low is formed around a region immediately above the central part of the light emitting surface of the light emitting element. A translucent resin layer 108 is formed on the light scattering layer 107.
摘要翻译：为了提供一种随着亮度变化而发出高亮度，均匀的白光的发光装置，将发光元件101安装在基板105上并被均匀厚度的波长转换层106覆盖，然后将光散射层形成由含有光反射材料的半透明树脂制成的薄膜107。作为光散射层107，在发光元件101的发光面的中央部的正上方形成有其中光反射材料的密度高的高密度区域109和低密度区域110，其中在发光元件的发光面的中心部正上方的区域附近形成光反射材料的密度。在光散射层107上形成半透明树脂层108。

4. 发明申请

US20130075776A1 LIGHT DISTRIBUTION CONTROLLER, LIGHT-EMITTING DEVICE USING THE SAME, AND METHOD FOR FABRICATING LIGHT DISTRIBUTION CONTROLLER 失效
标题翻译：光分配控制器，使用其的发光装置和制造光分配控制器的方法
公开(公告)号：US20130075776A1
公开(公告)日：2013-03-28
申请号：US13701998
申请日：2011-07-04
申请人： Akihiko Murai , Masahiro Kume , Akiko Nakamura , Tooru Aoyagi , Kiyoshi Fujihara
发明人： Akihiko Murai , Masahiro Kume , Akiko Nakamura , Tooru Aoyagi , Kiyoshi Fujihara
IPC分类号： G09F13/04 , H01L33/00 , H01L33/50
CPC分类号： G09F13/04 , G02B19/0028 , G02B19/0066 , G02B19/0071 , H01L33/005 , H01L33/50 , H01L33/58
摘要： A light distribution controller of a light-emitting device includes a first optical member formed of ZnO disposed over an LED interposing a transparent adhesive, and a second optical member which covers the first optical member. The first optical member includes a first concave portion having an opening in a regular hexagon shape whose area gradually increases. In the first concave portion, inner wall surfaces having inclined surfaces, each of whose bases is formed by one side of the hexagon of the opening shape, are formed. Outside of the first optical member, outer wall surfaces each having a trapezoidal shape are formed. The second optical member includes a second concave portion arranged so that light at an annular peak in the light distribution characteristic of the light traveled through the first optical member is totally reflected.
摘要翻译：发光装置的配光控制器包括由设置在插入透明粘合剂的LED上的ZnO形成的第一光学部件和覆盖第一光学部件的第二光学部件。第一光学构件包括具有正六边形形状的开口的第一凹部，其面积逐渐增加。在第一凹部中，形成具有倾斜面的内壁面，其各自的底部由开口形状的六边形的一侧形成。在第一光学构件的外侧，形成各自具有梯形形状的外壁面。第二光学构件包括第二凹部，其布置成使得通过第一光学构件行进的光的光分布特性中的环形峰值处的光被全反射。

5. 发明申请

US20120025361A1 SEMICONDUCTOR DEVICE, LEAD FRAME ASSEMBLY, AND METHOD FOR FABRICATING THE SAME 失效
标题翻译：半导体器件，引线框架组件及其制造方法
公开(公告)号：US20120025361A1
公开(公告)日：2012-02-02
申请号：US13192167
申请日：2011-07-27
申请人： Kenichi ITO , Shigehisa Oonakahara , Yoshikazu Tamura , Kiyoshi Fujihara
发明人： Kenichi ITO , Shigehisa Oonakahara , Yoshikazu Tamura , Kiyoshi Fujihara
IPC分类号： H01L23/495 , H01L21/66
CPC分类号： H01L23/49861 , H01L23/047 , H01L23/24 , H01L23/49541 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L33/486 , H01L2224/32245 , H01L2224/45015 , H01L2224/45144 , H01L2224/48247 , H01L2224/48257 , H01L2224/73265 , H01L2224/92247 , H01L2224/97 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/12041 , H01L2924/181 , H01L2924/3025 , H01L2224/85 , H01L2224/83 , H01L2924/00012 , H01L2924/00014 , H01L2924/20752 , H01L2924/00
摘要： A semiconductor device includes a lead frame, a semiconductor element mounted on the lead frame, and a frame-like member formed on the lead frame, surrounding the semiconductor element, and covering a side surface of the lead frame and exposing a lower surface of the lead frame. The frame-like member has at least one concave portion in a side surface thereof. The concave portion has a ceiling portion located at the same height as or lower than an upper surface of the lead frame, and a bottom portion located higher than the lower surface of the lead frame.
摘要翻译：半导体器件包括引线框架，安装在引线框架上的半导体元件和形成在引线框架上的框架构件，围绕半导体元件，并且覆盖引线框架的侧表面并暴露引线框架的下表面引线框架框状构件在其侧面具有至少一个凹部。凹部具有位于与引线框架的上表面相同的高度的顶部和位于引线框架的下表面之上的底部。

6. 发明授权

US07440386B2 Optical device and method of manufacturing the same 有权
标题翻译：光学装置及其制造方法
公开(公告)号：US07440386B2
公开(公告)日：2008-10-21
申请号：US11253602
申请日：2005-10-20
申请人： Masaya Tateyanagi , Masanori Minamio , Shigeki Okamoto , Kiyoshi Fujihara
发明人： Masaya Tateyanagi , Masanori Minamio , Shigeki Okamoto , Kiyoshi Fujihara
IPC分类号： G11B7/00
CPC分类号： H01L31/0203 , H01L2224/48091 , H01L2924/3025 , H05K1/147 , H05K1/189 , H01L2924/00014 , H01L2924/00
摘要： A copper frame plate (2) has a central frame plate (2a) and a pair of side frame plates (2c) bent from both ends of the central frame plate. A flexible substrate (3) has a central substrate (3a) covering the central frame plate and bent substrates (3b) bent from the central substrate so as to cover the side frame plates. An optical element (4) is mounted on the central frame plate. A plurality of internal wiring terminals (9) connected to the optical element are disposed on the central substrate and arranged in the width direction (W) along which the pair of side frame plates are opposed to each other. A plurality of external wiring terminals (11) used for connection to external equipment are disposed on the bent substrates and arranged in the length direction (L) orthogonal to the width direction.
摘要翻译：铜框架板（2）具有中央框架板（2a）和从中央框架板的两端弯曲的一对侧框架板（2c）。柔性基板（3）具有覆盖中心框架板的中心基板（3a）和从中心基板弯曲的弯曲基板（3b），以覆盖侧框架板。光学元件（4）安装在中央框架板上。连接到光学元件的多个内部布线端子（9）设置在中心基板上并且沿着一对侧框板彼此相对的宽度方向（W）布置。用于与外部设备连接的多个外部接线端子（11）设置在弯曲的基板上并且沿与宽度方向正交的长度方向（L）布置。

7. 发明授权

US07280573B2 Semiconductor laser unit and optical pickup device 失效
公开(公告)号：US07280573B2
公开(公告)日：2007-10-09
申请号：US11480478
申请日：2006-07-05
申请人： Kiyoshi Fujihara , Masaya Tateyanagi , Shigeki Okamoto
发明人： Kiyoshi Fujihara , Masaya Tateyanagi , Shigeki Okamoto
IPC分类号： H01S3/04
CPC分类号： G11B7/127 , H01L2224/48091 , H01S5/02248 , H01L2924/00014
摘要： The semiconductor laser unit includes: a metal plate having a center portion wider than the remaining portions; a flexible substrate having a first opening; a substrate mounted on the center portion; a semiconductor laser placed on the substrate; a frame having a second opening and fixing the flexible substrate in the state of being bent along from the top surface to both side faces of the metal plate; and an optical element covering the second opening. The flexible substrate is fixed so that the first opening extends over the top surface and both side faces of the center portion.

8. 发明申请

US20060078021A1 Semiconductor laser unit and optical pickup device including the semiconductor laser unit 审中-公开
标题翻译：包括半导体激光单元的半导体激光单元和光学拾取装置
公开(公告)号：US20060078021A1
公开(公告)日：2006-04-13
申请号：US11247283
申请日：2005-10-12
申请人： Kiyoshi Fujihara , Masanori Minamio , Masaya Tateyanagi , Shigeki Okamoto
发明人： Kiyoshi Fujihara , Masanori Minamio , Masaya Tateyanagi , Shigeki Okamoto
IPC分类号： H01S5/00
CPC分类号： H01S5/02216 , H01L2224/45144 , H01L2224/48091 , H01L2224/49171 , H01S5/02248 , H01S5/02288 , H01L2924/00014 , H01L2924/00
摘要： The present invention provides a semiconductor laser unit which realizes efficient heat dissipation, reduction in size, high-density integration of optical elements, prevention of a light-receiving element from being polluted with dust, and simple structure for easy assembly. The semiconductor laser unit includes: (a) a metal plate having a first recessed portion in a central part of an upper surface of the metal plate; (b) a flexible printed circuit which has wiring patterns, and a first aperture positioned on the first recessed portion, and is bent at both ends and in contact with the first recessed portion and a pair of side surfaces of the metal plate; (c) a light-emitting/receiving unit which includes a light-emitting element and a light-receiving element, and is placed on the first recessed portion through the first aperture; (d) a frame having: side portions for fixing firmly, on the side surfaces of the metal plate, the flexible printed circuit which is in contact with the side surfaces; and a top portion which has a second aperture and is placed on a protruding portion of the metal plate so that the first recessed portion is covered with the top portion and the second aperture faces toward the first recessed portion; and (e) an optical element which covers the second aperture.
摘要翻译：本发明提供一种实现高效散热，尺寸减小，光学元件的高密度集成，防止受光元件被灰尘污染的半导体激光器单元，以及易于组装的简单结构。半导体激光单元包括：（a）在金属板的上表面的中心部分具有第一凹部的金属板; （b）具有布线图案的柔性印刷电路和位于第一凹部上的第一孔，并且在两端弯曲并与金属板的第一凹部和一对侧面接触; （c）发光/接收单元，其包括发光元件和光接收元件，并通过第一孔放置在第一凹部上; （d）框架，其具有：用于在所述金属板的所述侧表面上牢固固定的侧部，所述柔性印刷电路与所述侧表面接触; 以及顶部，其具有第二孔，并且被放置在所述金属板的突出部分上，使得所述第一凹部被所述顶部覆盖，并且所述第二孔朝向所述第一凹部; 和（e）覆盖第二孔的光学元件。

9. 发明申请

US20050094694A1 Semiconductor laser device and optical pick-up apparatus using semiconductor laser device 审中-公开
标题翻译：半导体激光装置和使用半导体激光装置的光学拾取装置
公开(公告)号：US20050094694A1
公开(公告)日：2005-05-05
申请号：US10979396
申请日：2004-11-03
申请人： Kiyoshi Fujihara , Akira Ueno , Yoshiaki Matsuda , Hideyuki Nakanishi
发明人： Kiyoshi Fujihara , Akira Ueno , Yoshiaki Matsuda , Hideyuki Nakanishi
IPC分类号： G11B7/125 , G11B7/12 , G11B7/123 , G11B7/127 , H01S5/00 , H01S5/02 , H01S5/022 , H01S5/024 , H01S5/026
CPC分类号： G11B7/127 , G11B7/123 , H01L2224/05554 , H01L2224/45144 , H01L2224/49171 , H01S5/02216 , H01S5/02244 , H01S5/02248 , H01S5/02276 , H01S5/02296 , H01L2924/00
摘要： An object of the present invention is to provide a semiconductor laser device that has a simple structure that can easily be constructed, and can dissipate heat easily, and can improve its functionality and realize miniaturizing concurrently. The semiconductor laser device composes a metal plate 100 that is substantially the same as the bigger one of the widths of the silicon substrate 120 and the flexible sheet 130, a semiconductor laser element 110, a silicon substrate 120 into which a light detection circuit and a signal processing circuit are integrated, a flexible sheet 130, a wire 140 and an optical element 150. The flexible sheet 130 is divided into two on the metal plate 100, and the two divided flexible sheet 130 are positioned face to face sandwiching the silicon substrate 120.
摘要翻译：本发明的目的是提供一种具有简单结构的半导体激光器件，其可以容易地构造并且可以容易地散热，并且可以同时提高其功能并实现小型化。半导体激光装置构成与硅基板120和柔性片130的宽度大的金属板100，半导体激光元件110，硅基板120，光检测电路和信号处理电路集成在一起，柔性片130，线140和光学元件150.柔性片130在金属板100上被分成两部分，并且两个分开的柔性片130面对面地夹着硅衬底 120。

10. 发明授权

US07264407B2 Optical device, method for fabricating optical device, cap component, and method for forming cap component 有权
标题翻译：光学元件，光学元件的制造方法，盖部件，以及形成盖部件的方法
公开(公告)号：US07264407B2
公开(公告)日：2007-09-04
申请号：US10980154
申请日：2004-11-04
申请人： Shigeki Okamoto , Masaya Tateyanagi , Masanori Mimamio , Kiyoshi Fujihara , Hiroyuki Ishida , Toshiyuki Fukuda
发明人： Shigeki Okamoto , Masaya Tateyanagi , Masanori Mimamio , Kiyoshi Fujihara , Hiroyuki Ishida , Toshiyuki Fukuda
IPC分类号： G02B6/36 , G02B6/12
CPC分类号： H01L31/022408 , H01L31/02002 , H01L31/0203 , H01L2924/0002 , H01L2924/00
摘要： An optical device includes a copper plate, light receiving elements mounted on the copper plate, a light emitting element mounted on the light receiving elements, a flexible substrate bent to cover portions of upper and side surfaces of the copper plate, and a positioning frame of metal for fixing the flexible substrate and the copper plate to each other. Since the positioning frame secures the flexible substrate and the copper plate against movement, a thin optical device can be attained without employing a resin-molded construction.
摘要翻译：光学装置包括铜板，安装在铜板上的光接收元件，安装在光接收元件上的发光元件，弯曲成覆盖铜板的上表面和侧表面的部分的柔性基板，以及定位框架用于将柔性基板和铜板彼此固定的金属。由于定位框架固定柔性基板和铜板以防止移动，所以可以在不使用树脂模制结构的情况下获得薄的光学装置。

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