专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20120063102A1 Electronic Device, Circuit Board Assembly, and Semiconductor Device 审中-公开
标题翻译：电子设备，电路板组件和半导体器件
公开(公告)号：US20120063102A1
公开(公告)日：2012-03-15
申请号：US13082217
申请日：2011-04-07
申请人： Yasunari Ukita , Kiyokazu Ishizaki
发明人： Yasunari Ukita , Kiyokazu Ishizaki
IPC分类号： H05K7/00
CPC分类号： H01L23/49816 , H01L23/3107 , H01L24/48 , H01L2224/32245 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/15311 , H01L2924/181 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： According to one embodiment, an electronic device includes a housing, a circuit board, and a component. The circuit board is provided in the housing, and includes a first pad and a second pad exposed on the surface. The component includes a first electrode and a second electrode. The first electrode is exposed on the circuit board-facing surface of the component fading the surface of the circuit board and bonded to the first pad via a bonding agent. The second electrode is exposed on the circuit board-facing surface and bonded to the second pad via a bonding agent. The second electrode is wider than the first electrode and projects more than the first electrode does.
摘要翻译：根据一个实施例，电子设备包括壳体，电路板和部件。电路板设置在壳体中，并且包括暴露在表面上的第一焊盘和第二焊盘。该部件包括第一电极和第二电极。第一电极暴露在部件的面向电路板的表面上，该电路板面向电路板的表面，并通过粘接剂与第一焊盘接合。第二电极暴露在面向电路板的表面上，并通过粘合剂与第二焊盘接合。第二电极比第一电极宽，并且比第一电极突出多。

2. 发明授权

US08605446B2 Electronic apparatus 有权
标题翻译：电子仪器
公开(公告)号：US08605446B2
公开(公告)日：2013-12-10
申请号：US13275910
申请日：2011-10-18
申请人： Kiyokazu Ishizaki , Yasunari Ukita
发明人： Kiyokazu Ishizaki , Yasunari Ukita
IPC分类号： H05K7/00
CPC分类号： H05K1/111 , H05K1/0295 , H05K3/3436 , H05K2201/09381 , H05K2201/09663 , H05K2201/10166 , H05K2201/10969 , Y02P70/611 , Y02P70/613
摘要： According to one embodiment, an electronic apparatus includes a housing, a board in the housing, a pad on the board, and a component. The pad includes a first portion and a second portion. The second portion includes a protrusion toward the first portion. The component includes a first electrode connected to the first portion and a second electrode connected to the second portion.
摘要翻译：根据一个实施例，电子设备包括壳体，壳体中的板，板上的焊盘和部件。垫包括第一部分和第二部分。第二部分包括朝向第一部分的突起。该部件包括连接到第一部分的第一电极和连接到第二部分的第二电极。

3. 发明申请

US20120250274A1 Wiring Substrate and Electronic Device 审中-公开
标题翻译：接线基板和电子设备
公开(公告)号：US20120250274A1
公开(公告)日：2012-10-04
申请号：US13274990
申请日：2011-10-17
申请人： Yasunari Ukita , Kiyokazu Ishizaki , Naonori Watanabe , Tomonori Kawata , Terunari Kanou
发明人： Yasunari Ukita , Kiyokazu Ishizaki , Naonori Watanabe , Tomonori Kawata , Terunari Kanou
IPC分类号： H05K5/00 , H05K1/16 , H05K1/11
CPC分类号： H05K1/0206 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H05K1/113 , H05K2201/094 , H05K2201/10969 , H05K2203/043 , H01L2924/00014 , H01L2924/00
摘要： In one embodiment, there is provided a wiring substrate. The wiring substrate includes: a substrate body comprising a first surface and a second surface opposite to the first surface, wherein the substrate body has a plurality of first through holes; a plurality of first pads on the first surface of the substrate body; a plurality of second pads on the first surface of the substrate body, wherein the second pads are surrounded by the first pads. Each of the second pads has at least one second through hole, and the second pads are disposed on the first surface of the substrate body such that each of the second through holes is communicated with a corresponding one of the first through holes.
摘要翻译：在一个实施例中，提供了布线基板。布线基板包括：基板主体，包括第一表面和与第一表面相对的第二表面，其中基板主体具有多个第一通孔; 在所述基板主体的所述第一表面上的多个第一焊盘; 在所述基板主体的第一表面上的多个第二焊盘，其中所述第二焊盘被所述第一焊盘包围。每个第二焊盘具有至少一个第二通孔，并且第二焊盘设置在基板主体的第一表面上，使得每个第二通孔与相应的一个第一通孔连通。

4. 发明申请

US20120236516A1 Electronic Apparatus 有权
标题翻译：电子仪器
公开(公告)号：US20120236516A1
公开(公告)日：2012-09-20
申请号：US13275910
申请日：2011-10-18
申请人： Kiyokazu Ishizaki , Yasunari Ukita
发明人： Kiyokazu Ishizaki , Yasunari Ukita
IPC分类号： H05K5/00
CPC分类号： H05K1/111 , H05K1/0295 , H05K3/3436 , H05K2201/09381 , H05K2201/09663 , H05K2201/10166 , H05K2201/10969 , Y02P70/611 , Y02P70/613
摘要： According to one embodiment, an electronic apparatus includes a housing, a board in the housing, a pad on the board, and a component. The pad includes a first portion and a second portion. The second portion includes a protrusion toward the first portion. The component includes a first electrode connected to the first portion and a second electrode connected to the second portion.
摘要翻译：根据一个实施例，电子设备包括壳体，壳体中的板，板上的焊盘和部件。垫包括第一部分和第二部分。第二部分包括朝向第一部分的突起。该部件包括连接到第一部分的第一电极和连接到第二部分的第二电极。

5. 发明申请

US20090224279A1 OPTICAL SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING OPTICAL SEMICONDUCTOR DEVICE 有权
标题翻译：光学半导体器件及制造光学半导体器件的方法
公开(公告)号：US20090224279A1
公开(公告)日：2009-09-10
申请号：US11873997
申请日：2007-10-17
申请人： Kazuo Shimokawa , Yasunari Ukita
发明人： Kazuo Shimokawa , Yasunari Ukita
IPC分类号： H01L33/00 , H01L21/60
CPC分类号： H01L33/62 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/27013 , H01L2224/29111 , H01L2224/32014 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/83439 , H01L2224/83455 , H01L2224/83801 , H01L2224/92 , H01L2224/92247 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/12041 , H01L2924/15153 , H01L2924/15165 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/01014 , H01L2924/00012 , H01L2924/00
摘要： An optical semiconductor device includes: an optical semiconductor element including a light-emitting layer formed on a first principal surface, a first electrode formed on the light-emitting layer and having a smaller size than the first principal surface, and a second electrode formed on a second principal surface different from the first principal surface; a first lead portion including a bonding region to which the first electrode is bonded and which has a smaller size than the first principal surface, and a first groove portion formed on an outer peripheral region adjacent to the bonding region, the first lead portion being electrically connected to the first electrode bonded to the bonding region by use of a bonding member; and a second lead portion electrically connected to the second electrode by use of a connecting member.
摘要翻译：一种光半导体装置，包括：光半导体元件，包括形成在第一主表面上的发光层，形成在发光层上并具有比第一主表面小的第一电极的第一电极和形成在第一主表面上的第二电极与第一主表面不同的第二主表面; 第一引线部分，包括接合第一电极的接合区域并且具有比第一主表面更小的接合区域;以及第一沟槽部分，形成在与接合区域相邻的外周区域上，第一引线部分是电通过使用接合部件连接到与接合区域接合的第一电极; 以及通过使用连接构件与第二电极电连接的第二引线部分。

6. 发明申请

US20080073794A1 SEMICONDUCTOR APPARATUS AND FABRICATION METHOD THEREOF 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20080073794A1
公开(公告)日：2008-03-27
申请号：US11854187
申请日：2007-09-12
申请人： Susumu Obata , Izuru Komatsu , Tomohiro Iguchi , Tomoyuki Kitani , Masako Hirahara , Yasunari Ukita , Kazuhito Higuchi
发明人： Susumu Obata , Izuru Komatsu , Tomohiro Iguchi , Tomoyuki Kitani , Masako Hirahara , Yasunari Ukita , Kazuhito Higuchi
IPC分类号： H01L23/48 , H01L21/4763
CPC分类号： H01L23/49562 , H01L23/3135 , H01L23/49524 , H01L24/24 , H01L24/40 , H01L24/82 , H01L24/84 , H01L2224/24246 , H01L2224/32245 , H01L2224/73267 , H01L2224/82039 , H01L2224/8485 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/1306 , H01L2924/181 , H01L2924/19043 , H01L2924/3512 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device (3) is provided with a first electrode (A), a lead (4) has a second electrode (B), and a metallic film (6) electrically interconnects the first electrode (A) and the second electrode (B), allowing for a more reduced internal resistance, high reliability, and facilitated fabrication.
摘要翻译：半导体器件（3）具有第一电极（A），引线（4）具有第二电极（B），金属膜（6）将第一电极（A）和第二电极（B）），允许更低的内阻，高可靠性和便于制造。

7. 发明申请

US20060038304A1 Conductive adhesive agent and process for manufacturing article using the conductive adhesive agent 有权
标题翻译：导电粘合剂及使用导电粘合剂制造制品的方法
公开(公告)号：US20060038304A1
公开(公告)日：2006-02-23
申请号：US11206223
申请日：2005-08-18
申请人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
发明人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
IPC分类号： H01L23/29
CPC分类号： H01L24/29 , H01L23/3107 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29313 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29384 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/838 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H05K3/321 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.
摘要翻译：本发明提供一种能够用溶剂稀释以提供良好的涂布加工性的导电粘合剂，并且通过抑制粘合剂树脂在附着后热固化时产生的气体，可以形成导热性和导电性两者优异的导电接头的一部分。根据本发明的导电粘合剂是导电粘合剂，其中基于100重量份的平均粒径为微米的银粉，其用于导电介质，例如，作为主要成分，使用1〜10重量份平均粒径为纳米的银微粒，并配合5〜15重量份作为粘结剂树脂成分的热固性树脂，10重量份以下的作为主要成分配合调节流体粘度的溶剂，通过选择这样的配合比例，在热固性树脂的加热固化期间产生气体成分以防止形成空隙，同时制造实现了导热性和导电性优异的导电接头。

8. 发明授权

US07262511B2 Conductive adhesive agent with ultrafine particles 有权
标题翻译：具有超细颗粒的导电粘合剂
公开(公告)号：US07262511B2
公开(公告)日：2007-08-28
申请号：US11206223
申请日：2005-08-18
申请人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
发明人： Katsuhisa Osako , Naoto Shioi , Daisuke Itoh , Hideyuki Gotoh , Yorishige Matsuba , Kazuki Tateyama , Yasunari Ukita , Masao Segawa , Takuo Kikuchi
IPC分类号： H01L23/48 , H01L21/00 , H01B1/02
CPC分类号： H01L24/29 , H01L23/3107 , H01L24/73 , H01L24/83 , H01L2224/29 , H01L2224/29101 , H01L2224/29111 , H01L2224/2919 , H01L2224/2929 , H01L2224/29313 , H01L2224/29318 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29369 , H01L2224/29384 , H01L2224/32245 , H01L2224/45144 , H01L2224/48095 , H01L2224/48247 , H01L2224/73265 , H01L2224/83192 , H01L2224/83439 , H01L2224/838 , H01L2224/92247 , H01L2924/00013 , H01L2924/01005 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01016 , H01L2924/01018 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/10253 , H01L2924/12044 , H01L2924/15747 , H01L2924/181 , H05K3/321 , H01L2924/00014 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2224/29099 , H01L2224/29199 , H01L2224/29299
摘要： The present invention provides a conductive adhesive agent capable of being diluted with a solvent to give good coating workability and allowing formation of a conductive joint excellent in both thermal conductivity and electrical conductivity by inhibiting a gas generated when a binder resin is heat-cured after attachment of a part. The conductive adhesive agent according to the present invention is a conductive adhesive agent wherein, based on 100 parts by weight of silver powder having an average particle diameter of micrometers, which is used for a conductive medium, e.g. as a main component, 1 to 10 parts by weight of silver fine particles having an average particle diameter of nanometers is used in combination therewith and 5 to 15 parts by weight of thermosetting resin as a binder resin component and 10 parts or less by weight of solvent for adjustment of a fluid viscosity are blended therein as essential components, and by selection of such a blending ratio, generation of a gas component during heating and curing of the thermosetting resin to prevent formation of voids, and at the same time, fabrication of a conductive joint excellent in thermal conductivity and electrical conductivity is achieved.
摘要翻译：本发明提供一种能够用溶剂稀释以提供良好的涂布加工性的导电粘合剂，并且通过抑制粘合剂树脂在附着后热固化时产生的气体，可以形成导热性和导电性两者优异的导电接头的一部分。根据本发明的导电粘合剂是导电粘合剂，其中基于100重量份的平均粒径为微米的银粉，其用于导电介质，例如，作为主要成分，使用1〜10重量份平均粒径为纳米的银微粒，并配合5〜15重量份作为粘结剂树脂成分的热固性树脂，10重量份以下的作为主要成分配合调节流体粘度的溶剂，通过选择这样的配合比例，在热固性树脂的加热固化期间产生气体成分以防止形成空隙，同时制造实现了导热性和导电性优异的导电接头。

9. 发明授权

US08895833B2 Thermoelectric device and thermoelectric module 有权
标题翻译：热电装置和热电模块
公开(公告)号：US08895833B2
公开(公告)日：2014-11-25
申请号：US12964152
申请日：2010-12-09
申请人： Yasunari Ukita , Jun Karasawa , Naruhito Kondo , Osamu Tsuneoka
发明人： Yasunari Ukita , Jun Karasawa , Naruhito Kondo , Osamu Tsuneoka
IPC分类号： H01L35/30 , H01L35/06 , H01L35/32
CPC分类号： H01L35/06 , H01L35/32
摘要： According to one embodiment, a thermoelectric device is provided with thermoelectric elements and formed of a material capable of exhibiting the thermoelectric effect and a first electrode located at end portions of the thermoelectric elements. The first electrode includes an electrode member, a soaking member having electrical conductivity, located between the electrode member and the thermoelectric elements, and including facing portions facing the thermoelectric elements and folded portions folded back at peripheral edges of the facing portions so as to lie on the opposite side to the thermoelectric elements, and an elastic member located on the opposite side of the facing portions to the thermoelectric elements, at least a part of the peripheral edge of the elastic member being held between the folded portions and the facing portions of the soaking member.
摘要翻译：根据一个实施例，热电装置设有热电元件并由能够表现出热电效应的材料形成，并且第一电极位于热电元件的端部。第一电极包括电极构件，具有导电性的均热构件，位于电极构件和热电元件之间，并且包括面向热电元件的面对部分和折叠部分，折叠部分折叠在面对部分的周边边缘处，以便位于与所述热电元件相反的一侧，以及弹性构件，所述弹性构件位于与所述热电元件相对的相对侧的相对侧上，所述弹性构件的周缘的至少一部分保持在所述折叠部分与所述热电元件的相对部分之间浸泡成员

10. 发明授权

US07999281B2 Optical semiconductor device and method of manufacturing optical semiconductor device 有权
标题翻译：光半导体器件及其制造方法
公开(公告)号：US07999281B2
公开(公告)日：2011-08-16
申请号：US11873997
申请日：2007-10-17
申请人： Kazuo Shimokawa , Yasunari Ukita
发明人： Kazuo Shimokawa , Yasunari Ukita
IPC分类号： H01L33/00 , H01L23/495 , H01L29/06 , H01L23/04 , H01L21/00
CPC分类号： H01L33/62 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/83 , H01L2224/27013 , H01L2224/29111 , H01L2224/32014 , H01L2224/32245 , H01L2224/32257 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83051 , H01L2224/83192 , H01L2224/83385 , H01L2224/83439 , H01L2224/83455 , H01L2224/83801 , H01L2224/92 , H01L2224/92247 , H01L2924/01006 , H01L2924/01015 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01063 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/01322 , H01L2924/12041 , H01L2924/15153 , H01L2924/15165 , H01L2924/15747 , H01L2924/181 , H01L2924/00014 , H01L2924/01014 , H01L2924/00012 , H01L2924/00
摘要： An optical semiconductor device includes: an optical semiconductor element including a light-emitting layer formed on a first principal surface, a first electrode formed on the light-emitting layer and having a smaller size than the first principal surface, and a second electrode formed on a second principal surface different from the first principal surface; a first lead portion including a bonding region to which the first electrode is bonded and which has a smaller size than the first principal surface, and a first groove portion formed on an outer peripheral region adjacent to the bonding region, the first lead portion being electrically connected to the first electrode bonded to the bonding region by use of a bonding member; and a second lead portion electrically connected to the second electrode by use of a connecting member.
摘要翻译：一种光半导体装置，包括：光半导体元件，包括形成在第一主表面上的发光层，形成在发光层上并具有比第一主表面小的第一电极的第一电极和形成在第一主表面上的第二电极与第一主表面不同的第二主表面; 第一引线部分，包括接合第一电极的接合区域并且具有比第一主表面更小的接合区域;以及第一沟槽部分，形成在与接合区域相邻的外周区域上，第一引线部分是电通过使用接合部件连接到与接合区域接合的第一电极; 以及通过使用连接构件与第二电极电连接的第二引线部分。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式