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1. 发明授权

US5593526A Process for preparing a multi-layer wiring board 失效
标题翻译：制备多层布线板的工艺
公开(公告)号：US5593526A
公开(公告)日：1997-01-14
申请号：US316376
申请日：1994-09-30
申请人： Kishio Yokouchi , Hiroshi Kamezaki , Masato Wakamura , Nobuo Kamehara , Koichi Niwa
发明人： Kishio Yokouchi , Hiroshi Kamezaki , Masato Wakamura , Nobuo Kamehara , Koichi Niwa
IPC分类号： C04B38/08 , C04B35/16 , H01L23/15 , H05K1/03 , H05K3/46 , C04B37/00
CPC分类号： H01L23/15 , H05K1/0306 , H01L2924/0002 , H01L2924/09701 , H05K2201/0209 , H05K3/4629 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , Y10T428/25 , Y10T428/2996
摘要： A process for producing a multi-layer wiring board having alternate layers of a glass ceramic material and conductor patterns. The glass ceramic layers are made up of a glass ceramic material including a glass matrix and ceramic particles dispersed in the matrix. The glass ceramic layers are caused to contain hollow or porous silica glass spheres dispersed in the glass ceramic material. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing alumina as a constituent element. Such a structure prevents crystallization of the silica spheres and avoids the resultant rapid increase in the the thermal expansion coefficient of the glass ceramic layers. The structure provided by the process of the invention also precudes the formation of pores in the surfaces of the glass ceramic layers.
摘要翻译：一种制造具有玻璃陶瓷材料和导体图案的交替层的多层布线板的方法。玻璃陶瓷层由玻璃基体和分散在基质中的陶瓷粒子组成的玻璃陶瓷材料构成。使玻璃陶瓷层含有分散在玻璃陶瓷材料中的中空或多孔石英玻璃球。中空或多孔二氧化硅玻璃球被包含氧化铝作为构成元素的陶瓷涂层覆盖。这种结构防止了二氧化硅球的结晶，避免了玻璃陶瓷层的热膨胀系数的迅速增加。本发明方法提供的结构还预示了在玻璃陶瓷层的表面中形成孔隙。

2. 发明授权

US5275889A Multi-layer wiring board 失效
标题翻译：多层接线板
公开(公告)号：US5275889A
公开(公告)日：1994-01-04
申请号：US763248
申请日：1991-09-20
申请人： Kishio Yokouchi , Hiroshi Kamezaki , Masato Wakamura , Nobuo Kamehara , Koichi Niwa
发明人： Kishio Yokouchi , Hiroshi Kamezaki , Masato Wakamura , Nobuo Kamehara , Koichi Niwa
IPC分类号： C04B38/08 , C04B35/16 , H01L23/15 , H05K1/03 , H05K3/46 , B32B9/00
CPC分类号： H01L23/15 , H05K1/0306 , H01L2924/0002 , H01L2924/09701 , H05K2201/0209 , H05K3/4629 , Y10S428/901 , Y10T428/24917 , Y10T428/24926 , Y10T428/25 , Y10T428/2996
摘要： A laminated multi-layer wiring board comprising alternate layers of a glass ceramic material and conductor pattern. The glass ceramic layers are made of a glass ceramic comprising glass and dispersed ceramic particles. The glass ceramic layers further contain hollow or porous silica glass spheres dispersed in the glass ceramic. The hollow or porous silica glass spheres are covered with a ceramic coating layer containing aluminum as a constituent element. Such a structure prevents crystallization of the silica spheres and the resultant rapid increase in the thermal expansion coefficient of the glass ceramic layer. The structure also procludes the formation of pores in the surfaces of the spheres.
摘要翻译：一种叠层多层布线板，包括玻璃陶瓷材料和导体图案的交替层。玻璃陶瓷层由包含玻璃和分散的陶瓷颗粒的玻璃陶瓷制成。玻璃陶瓷层还包含分散在玻璃陶瓷中的中空或多孔石英玻璃球。中空或多孔二氧化硅玻璃球被包含铝作为构成元素的陶瓷涂层覆盖。这种结构防止了二氧化硅球的结晶，并且导致玻璃陶瓷层的热膨胀系数的快速增加。该结构还促使在球体表面形成孔隙。

3. 发明授权

US4761325A Multilayer ceramic circuit board 失效
标题翻译：多层陶瓷电路板
公开(公告)号：US4761325A
公开(公告)日：1988-08-02
申请号：US762310
申请日：1985-08-02
申请人： Kazuaki Kurihara , Nobuo Kamehara , Hiromitsu Yokoyama , Hiromi Ogawa , Kishio Yokouchi , Yoshihiko Imanaka , Koichi Niwa
发明人： Kazuaki Kurihara , Nobuo Kamehara , Hiromitsu Yokoyama , Hiromi Ogawa , Kishio Yokouchi , Yoshihiko Imanaka , Koichi Niwa
IPC分类号： C03C10/00 , C04B35/14 , C04B35/16 , C04B35/18 , C04B35/632 , H01L21/48 , H01L23/15 , H05K1/03 , H05K1/09 , H05K3/46 , B32B3/00
CPC分类号： H05K3/4667 , C03C10/0009 , H01L21/4857 , H01L21/4867 , H01L23/15 , H05K1/0306 , H05K3/46 , H05K3/4629 , C03C2214/04 , C03C2214/20 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/092 , H05K2203/086 , H05K2203/088 , H05K2203/1126 , H05K3/1291 , H05K3/4611 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926 , Y10T428/252
摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.

4. 发明授权

US4346516A Method of forming a ceramic circuit substrate 失效
标题翻译：形成陶瓷电路基板的方法
公开(公告)号：US4346516A
公开(公告)日：1982-08-31
申请号：US252214
申请日：1981-04-08
申请人： Kishio Yokouchi , Hiromi Ogawa , Hiromitsu Yokoyama , Nobuo Kamehara , Koichi Niwa , Kyohei Murakawa
发明人： Kishio Yokouchi , Hiromi Ogawa , Hiromitsu Yokoyama , Nobuo Kamehara , Koichi Niwa , Kyohei Murakawa
IPC分类号： H05K3/46 , H01L21/48 , H01L23/15 , H01L23/538 , H05K1/03 , H05K1/09 , H05K3/40 , H05K3/00 , H05K3/36
CPC分类号： H05K3/4046 , H01L21/486 , H01L21/4867 , H01L23/15 , H01L23/5384 , H01L2224/11003 , H01L2224/11005 , H01L2224/1132 , H01L2224/11334 , H05K1/0306 , H05K1/092 , H05K2201/0382 , H05K2201/10234 , H05K2203/0195 , H05K3/4611 , H05K3/4629 , Y10T29/49153 , Y10T29/49694
摘要： A method of forming a ceramic circuit substrate allowing mounting of high integration density semiconductor elements. The method provides a multilayered ceramic circuit substrate having via holes formed with high accuracy and high integration density wiring patterns by forming metallic conductive balls to connect the conductive wiring patterns of upper and lower layers; a ball arranging plate having many holes placing on a green sheet uniformly in close contact; filling the holes of the plate with the embedding the conductive balls by pressure into the green sheet; and thereafter baking the green sheet individually or in a stacked layered arrangement.
摘要翻译：一种形成陶瓷电路基板的方法，允许安装高集成度密度的半导体元件。该方法通过形成金属导电球以连接上层和下层的导电布线图案，提供具有形成有高精度和高集成度的布线图案的通孔的多层陶瓷电路基板; 具有多个孔的球排列板，其均匀地放置在生片上; 通过压力将导电球嵌入生片中来填充板的孔; 然后单独地或以堆叠的层叠布置烘烤生片。

5. 发明授权

US5349499A Immersion cooling coolant and electronic device using this coolant 失效
标题翻译：浸入式冷却液和使用这种冷却剂的电子设备
公开(公告)号：US5349499A
公开(公告)日：1994-09-20
申请号：US53452
申请日：1993-04-28
申请人： Mitsutaka Yamada , Kishio Yokouchi , Nobuo Kamehara , Koichi Niwa
发明人： Mitsutaka Yamada , Kishio Yokouchi , Nobuo Kamehara , Koichi Niwa
IPC分类号： H01L23/427 , H05K7/20
CPC分类号： H01L23/427 , H01L2924/0002
摘要： A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30.degree. C. to 100.degree. C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100.degree. C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.
摘要翻译：公开了一种用于通过直接浸入，冷却来冷却半导体元件的冷却剂，其具有改进的冷却能力。冷却剂包括沸点为30℃至100℃的低沸点碳氟化合物和沸点高于低沸点碳氟化合物的沸点至少为100℃的高沸点碳氟化合物; 基于低沸点碳氟化合物的体积，高沸点碳氟化合物的量小于20体积％。

6. 发明授权

US4642148A Method for producing a multilayer ceramic circuit board 失效
标题翻译：多层陶瓷电路板的制造方法
公开(公告)号：US4642148A
公开(公告)日：1987-02-10
申请号：US738658
申请日：1985-05-28
申请人： Kazuaki Kurihara , Nobuo Kamehara , Hiromitsu Yokoyama , Hiromi Ogawa , Kishio Yokouchi , Yoshihiko Imanaka , Koichi Niwa
发明人： Kazuaki Kurihara , Nobuo Kamehara , Hiromitsu Yokoyama , Hiromi Ogawa , Kishio Yokouchi , Yoshihiko Imanaka , Koichi Niwa
IPC分类号： C03C10/00 , C04B35/14 , C04B35/16 , C04B35/18 , C04B35/632 , H01L21/48 , H01L23/15 , H05K1/03 , H05K1/09 , H05K3/46 , B32B31/06
CPC分类号： H05K3/4667 , C03C10/0009 , H01L21/4857 , H01L21/4867 , H01L23/15 , H05K1/0306 , H05K3/46 , H05K3/4629 , C03C2214/04 , C03C2214/20 , H01L2924/0002 , H01L2924/09701 , H01L2924/3011 , H05K1/092 , H05K2203/086 , H05K2203/088 , H05K2203/1126 , H05K3/1291 , H05K3/4611 , Y10S428/901 , Y10T428/24322 , Y10T428/24917 , Y10T428/24926 , Y10T428/252
摘要： A method for producing a multilayer ceramic circuit board including the steps of forming a multilayer structure consisting of patterns of copper-based paste and glass-ceramic layers, the glass-ceramic layers consisting of a mixture of 10 percent to 75 percent by weight of .alpha.-alumina, 20 percent to 60 percent by weight of crystallizable or noncrystallizable glass which can be sintered at a temperature lower than the melting point of copper, and 5 percent to 70 percent by weight of quartz glass, based on the total weight of the glass-ceramic, blended with a binder containing a thermally depolymerizable resin; prefiring the multilayer structure in an inert atmosphere containing water vapor, the partial pressure of which is 0.005 to 0.3 atmosphere, at a temperature where the thermally depolymerizable resin is eliminated; and firing the multilayer structure in an inert atmosphere containing no water vapor at a temperature below the melting point of copper so as to sinter the glass-ceramic.
摘要翻译：一种制造多层陶瓷电路板的方法，包括以下步骤：形成由铜基糊料和玻璃 - 陶瓷层的图案组成的多层结构，所述玻璃陶瓷层由10％至75％重量的α - 氧化铝，20％至60％重量的可结晶或不可结晶的玻璃，其可以在低于铜的熔点的温度下烧结，以及5％至70％重量的石英玻璃，基于玻璃的总重量 - 陶瓷，与含有可热解聚树脂的粘合剂共混; 在除去热可解聚树脂的温度下，在分压为0.005〜0.3个大气压的含有水蒸气的惰性气氛中预热多层结构体; 在低于铜熔点的温度下，在不含水蒸气的惰性气氛中烧成多层结构，烧结玻璃陶瓷。

7. 发明授权

US06193905B1 Immersion cooling coolant 失效
标题翻译：浸入式冷却液
公开(公告)号：US06193905B1
公开(公告)日：2001-02-27
申请号：US08380312
申请日：1995-01-30
申请人： Mitsutaka Yamada , Kishio Yokouchi , Nobuo Kamehara , Koichi Niwa
发明人： Mitsutaka Yamada , Kishio Yokouchi , Nobuo Kamehara , Koichi Niwa
IPC分类号： C09K504
CPC分类号： H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A coolant for cooling a semiconductor element by direct immersion, cooling, which has an improved cooling capability, is disclosed. The coolant comprises a low boiling point fluorocarbon having a boiling point of 30° C. to 100° C. and a high boiling point fluorocarbon having a boiling point higher than that of the low boiling point fluorocarbon by at least 100° C.; an amount of the high boiling point fluorocarbon being less than 20% by volume, based on the volume of the low boiling point fluorocarbon.
摘要翻译：公开了一种用于通过直接浸入，冷却来冷却半导体元件的冷却剂，其具有改进的冷却能力。冷却剂包括沸点为30℃至100℃的低沸点碳氟化合物和沸点高于低沸点碳氟化合物的沸点至少为100℃的高沸点碳氟化合物; 基于低沸点碳氟化合物的体积，高沸点碳氟化合物的量小于20体积％。

8. 发明授权

US5038571A Production and use of coolant in cryogenic devices 失效
标题翻译：在低温设备中生产和使用冷却液
公开(公告)号：US5038571A
公开(公告)日：1991-08-13
申请号：US437710
申请日：1989-11-17
申请人： Kishio Yokouchi , Mitsutaka Yamada , Nobuo Kamehara , Koichi Niwa
发明人： Kishio Yokouchi , Mitsutaka Yamada , Nobuo Kamehara , Koichi Niwa
IPC分类号： C09K5/04 , F25D3/10 , H01L23/44
CPC分类号： C09K5/045 , C09K5/04 , H01L23/445 , C09K2205/128 , F25D3/10 , H01L2924/0002
摘要： A coolant for use in cryogenic devices of closed cycle system which comprises a mixture of a liquid nitrogen and a fluorocarbon of the formula: C.sub.n F.sub.2n+2, wherein n is an integer of 2 to 4. The coolant, when used to cool heat generating semiconductor devices and other devices to a cryogenic temperature, exhibits an increased heat flux and thus an increased cooling capability, in addition to a simple and small structure of the cooling system, and a prevention of environmental pollution.

9. 发明授权

US4704658A Evaporation cooling module for semiconductor devices 失效
标题翻译：用于半导体器件的蒸发冷却模块
公开(公告)号：US4704658A
公开(公告)日：1987-11-03
申请号：US857303
申请日：1986-04-30
申请人： Kishio Yokouchi , Yuichi Suzuki , Koichi Niwa
发明人： Kishio Yokouchi , Yuichi Suzuki , Koichi Niwa
IPC分类号： H01L23/34 , H05K7/20 , H02B1/00
CPC分类号： H05K7/203 , H01L2924/0002
摘要： An evaporation cooling module for cooling plural semiconductor chips bonded on circuit boards immersed in a coolant within the module employs immersed heat exchangers associated with bubble traps which trap gaseous bubbles of evaporated coolant and maintain same in contact with the heat exchanger for improved reliquification efficiency. Bubble guides, which may be mounted to the circuit boards intermediate vertically spaced rows of semiconductor chips, guide gaseous bubbles of the evaporated coolant to the bubble trap, producing local convection coolant currents affording increased reliquification efficiency by released gases and improved temperature uniformity of the plural semiconductor chips. Use of immersed heat exchangers avoids decrease in reliquification efficiency since isolated therefrom. Bubble traps of predetermined porosity permit preferential separation of gaseous bubbles of the evaporated coolant and the undesired released gases.
摘要翻译：用于冷却多个半导体芯片的蒸发冷却模块，该半导体芯片与浸在模块内的冷却剂中的电路板上相连，采用与气泡捕集器相关联的浸入式热交换器，该热交换器捕获蒸发冷却剂的气泡，并保持与热交换器接触的气泡，从而提高了再次化效率。气泡引导件可以垂直间隔排列的半导体芯片安装到电路板上，将蒸发的冷却剂的气泡引导到气泡阱，产生局部对流冷却剂流，从而提供释放气体提高的再次化效率，并提高复数的温度均匀性半导体芯片。浸入式热交换器的使用避免了从其中分离出来的降低再结合效率。具有预定孔隙率的气泡捕集器可优先分离蒸发的冷却剂和不需要的释放气体的气泡。

10. 发明授权

US5629269A Process for forming oxide superconducting films with a plurality of metal buffer layers 失效
标题翻译：用多个金属缓冲层形成氧化物超导膜的方法
公开(公告)号：US5629269A
公开(公告)日：1997-05-13
申请号：US332479
申请日：1994-10-31
申请人： Kazunori Yamanaka , Takuya Uzumaki , Nobuo Kamehara , Koichi Niwa
发明人： Kazunori Yamanaka , Takuya Uzumaki , Nobuo Kamehara , Koichi Niwa
IPC分类号： H01L39/24 , B05D5/12 , B05D1/32
CPC分类号： H01L39/2461 , Y10S505/741
摘要： Disclosed is a process for forming a super-conducting film, which a multi-layer metal film (buffer film) is formed at a specific temperature on a ceramic substrate and a superconducting film is formed at a specific temperature on the multi-layer metal film. According to this process, a superconducting film having a high critical temperature can be formed over the ceramic substrate while controlling or suppressing the occurrence of a chemical reaction between the substrate and the superconducting film, and required superconducting performances can be manifested or exhibited.
摘要翻译：公开了一种用于形成超导膜的方法，其中在特定温度下在陶瓷基板上形成多层金属膜（缓冲膜），并且在特定温度下在多层金属膜上形成超导膜。根据该方法，可以在陶瓷基板上形成具有高临界温度的超导膜，同时控制或抑制基板与超导膜之间的化学反应的发生，并且可以显示或显示所需的超导性能。

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