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    • 3. 发明授权
    • Non-volatile memory device and method of fabricating the same
    • 非易失性存储器件及其制造方法
    • US07586137B2
    • 2009-09-08
    • US11200491
    • 2005-08-09
    • Ki-chul KimGeum-jong BaeIn-wook ChoByoung-jin LeeSang-su KimJin-hee KimByou-ree Lim
    • Ki-chul KimGeum-jong BaeIn-wook ChoByoung-jin LeeSang-su KimJin-hee KimByou-ree Lim
    • H01L29/76
    • H01L29/66833H01L21/28282H01L29/792
    • A non-volatile memory device having an asymmetric channel structure is provided. The non-volatile memory device includes a semiconductor substrate, a source region and a drain region which are formed in the semiconductor substrate and doped with n-type impurities, a trapping structure which includes a tunneling layer, which is disposed on a predetermined region of the semiconductor substrate and through which charge carriers are tunneled, and a charge trapping layer, which is formed on the tunneling layer and traps the tunneled charge carriers, a gate insulating layer which is formed on the trapping structure and the exposed semiconductor substrate, a gate electrode which is formed on the gate insulating layer, and a channel region which is formed between the source region and the drain region and includes a first channel region formed on a lower part of the trapping structure and a second channel region formed on a lower part of the gate insulating layer, the threshold voltage of the first channel region being lower than that of the second channel region.
    • 提供了具有非对称沟道结构的非易失性存储器件。 非易失性存储器件包括形成在半导体衬底中并掺杂有n型杂质的半导体衬底,源极区和漏极区,包括隧穿层的俘获结构,其被布置在 半导体衬底和通过其电荷载流子被隧道化;以及电荷俘获层,其形成在隧穿层上并俘获隧穿电荷载流子;形成在俘获结构和暴露的半导体衬底上的栅极绝缘层,栅极 形成在栅极绝缘层上的电极和形成在源极区域和漏极区域之间的沟道区域,并且包括形成在捕获结构的下部的第一沟道区域和形成在栅极绝缘层的下部的第二沟道区域 所述第一沟道区的阈值电压低于所述第二沟道区的阈值电压。
    • 10. 发明授权
    • Non-volatile memory device having a charge storage oxide layer and operation thereof
    • 具有电荷存储氧化物层的非易失性存储器件及其操作
    • US07394127B2
    • 2008-07-01
    • US11047764
    • 2005-02-02
    • Ki-Chul KimGeum-Jong BaeByoung-jin LeeSang-Su Kim
    • Ki-Chul KimGeum-Jong BaeByoung-jin LeeSang-Su Kim
    • H01L29/788
    • H01L29/7923H01L21/28282H01L29/66833H01L29/792
    • A non-volatile memory device includes a pair of source/drain regions disposed in a semiconductor substrate, having a channel region between them. A charge storage oxide layer is disposed on the channel region and overlaps part of each of the pair of source/drain regions. A gate electrode is disposed on the charge storage oxide layer. At least one halo implantation region is formed in the semiconductor substrate adjacent to one of the pair of source/drain regions, and overlapping the charge storage oxide layer. A program operation is performed by trapping electrons in the charge storage oxide layer located near the source/drain region where the halo ion implantation region is formed, and an erase operation is performed by injecting holes into the charge storage oxide layer located near the source/drain region where the halo ion implantation region is formed.
    • 非易失性存储器件包括设置在半导体衬底中的一对源极/漏极区域,它们之间具有沟道区域。 电荷存储氧化物层设置在沟道区上,并且与一对源极/漏极区的每一个的一部分重叠。 栅电极设置在电荷存储氧化物层上。 至少一个卤素注入区域形成在与一对源极/漏极区域中的一个相邻的半导体衬底中,并与电荷存储氧化物层重叠。 通过在位于形成有卤素离子注入区域的源极/漏极区附近的电荷存储氧化物层中俘获电子来执行编程操作,并且通过将空穴注入位于源/漏区附近的电荷存储氧化物层中来执行擦除操作, 漏区,其中形成有卤素离子注入区。