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    • 1. 发明授权
    • Method for etching photolithographically produced quartz crystal blanks
for singulation
    • 用于刻蚀光刻制造的石英晶体坯料进行分割的方法
    • US5650075A
    • 1997-07-22
    • US450661
    • 1995-05-30
    • Kevin L. HaasRobert S. WitteCharles L. ZimnickiIyad Alhayek
    • Kevin L. HaasRobert S. WitteCharles L. ZimnickiIyad Alhayek
    • H01L21/306H01L21/301H01L41/09H01L41/22H03H3/02H03H9/19H03H9/12
    • H03H3/02H01L41/332
    • A method for etching (200) photolithographically produced quartz crystal blanks for singulation. First, a quartz wafer is plated on both sides with metal and subsequently coated on both sides with photoresist (202). Second, the photoresist is patterned and developed and the metal layers etched to define the periphery of a quartz blank with a narrow quartz channel exposed between the blank to be singulated and the parent quartz wafer (204). Third, the quartz channel is preferentially etched partially into the wafer along parallel atomic planes to provide a mechanically weak junction between the quartz wafer and the blank to be singulated, while the periphery around the remainder of the quartz blank is etched completely through the parent quartz wafer (206). Fourth, the photoresist layers are stripped from the quartz wafer (208). Finally, the quartz blank is cleaved substantially along the bottom of the quartz channel to singulate the crystal blank from the wafer (210).
    • 用于刻蚀(200)光刻制造的用于单分割的石英晶体坯料的方法。 首先,用金属在两面涂覆石英晶片,随后用光致抗蚀剂(202)在两面涂覆石英晶片。 第二,对光致抗蚀剂进行图案化和显影,并且金属层被蚀刻以限定石英坯料的外围,其中窄的石英通道暴露在待分割的坯料和母体石英晶片(204)之间。 第三,石英沟道优先沿着平行的原子平面部分地蚀刻到晶片中,以在石英晶片和待分割的坯料之间提供机械上的弱连接,而围绕石英坯料的其余部分的周边被完全蚀刻通过母体石英 晶片(206)。 第四,从石英晶片(208)剥离光致抗蚀剂层。 最后,石英坯料基本沿着石英通道的底部裂开,以从晶片(210)上分离晶体坯料。
    • 3. 发明授权
    • Method and apparatus for providing enhanced vehicle detection
    • 用于提供增强车辆检测的方法和装置
    • US06519512B1
    • 2003-02-11
    • US09996548
    • 2001-11-28
    • Kevin L. HaasFrank D. Panzica
    • Kevin L. HaasFrank D. Panzica
    • G06F700
    • B61L3/004B61L29/246B61L2205/04
    • Detection of a locomotive or other vehicle is enhanced by transmitting an RF alert signal from the vehicle when the vehicle approaches a heightened alert area such as a railroad crossing. The RF alert signal is received by communication unit(s) carried by pedestrian(s) or residing in vehicle(s) approaching the heightened alert area, thereby providing an alert that supplements train whistles, gates, horns or other warning mechanisms known in the art. The RF alert signal may also be transmitted to infrastructure devices such as logging devices. In one embodiment, the RF alert signal is transmitted from a locomotive upon detecting operation of a train whistle associated with the locomotive and/or coincident to receiving an external alert signal or automatic vehicle location (AVL) information indicating that the locomotive is near a heightened alert area.
    • 当车辆接近诸如铁路道口的高度警戒区域时,通过从车辆发送RF警报信号来增​​强机车或其他车辆的检测。 RF警报信号由行人携带的通信单元接收或驻留在接近高度警戒区域的车辆中,从而提供警报,该警报补充火车口哨,门,角或其他警告机构 艺术。 RF警报信号也可以被发送到诸如记录设备的基础设施设备。 在一个实施例中,当检测到与机车相关联的火车口哨的操作和/或重合以接收外部警报信号或指示机车靠近升高的自动车辆位置(AVL)信息时,从机车发送RF警报信号 警戒区域。
    • 6. 发明授权
    • Punch out pattern for hot melt tape used in smartcards
    • 用于智能卡的热熔胶带的打孔图案
    • US06179210B2
    • 2001-01-30
    • US09247714
    • 1999-02-09
    • Kevin L. HaasKiron P. Gore
    • Kevin L. HaasKiron P. Gore
    • G06K1902
    • G06K19/07769G06K19/02G06K19/07728G06K19/07745H01L2924/0002H01L2924/00
    • An improved punch out pattern for a hot melt tape used in smartcard manufacture. The hot melt tape is provided with punch out channels that direct the overflow of conductive adhesive away from the surface of the hot melt tape. In a preferred embodiment, the punch out channels are dimensioned to direct the overflow away from one another and toward a module receiving cavity formed in the smartcard body. In an alternate embodiment where it may not be feasible to direct overflow toward the overmold receiving cavity without affecting the electrical or mechanical performance of the smartcard, the punch out channels are dimensioned to direct overflow away from one another and along the periphery of the hot melt tape area. In either scenario, the channels do not interfere with module adhesion and, by virtue of the channeling of overfill matter, direct the conductive adhesive away from other connections in close vicinity and thus avoid the possibility of shorting.
    • 用于智能卡制造的热熔胶带的改进的冲孔图案。 热熔胶带设置有冲孔通道,其引导导电粘合剂的溢出物远离热熔胶带的表面。 在优选实施例中,穿孔通道的尺寸被设计成引导溢出物彼此远离并且朝向形成在智能卡体内的模块接收腔。 在替代实施例中,在不影响智能卡的电气或机械性能的情况下,可能不可能将溢流引导到包覆模制容纳腔,冲孔通道的尺寸被设计成引导溢出物彼此远离并且沿着热熔体的周边 磁带区。 在任一情况下,通道不会干扰模块粘附,并且由于过度填充物的通道导致导电粘合剂远离其他连接处附近,从而避免短路的可能性。
    • 7. 发明授权
    • Surface-mountable crystal resonator
    • 表面贴装晶体谐振器
    • US5444325A
    • 1995-08-22
    • US388236
    • 1995-02-14
    • Kevin L. HaasKen A. HaasKimber J. Vought
    • Kevin L. HaasKen A. HaasKimber J. Vought
    • H03H9/05H04L29/12H05K3/32H01L41/08
    • H03H9/0509H03H9/0514H04L29/12009H04L61/00H05K3/321
    • A surface-mountable crystal resonator (100) is provided in the following manner. A first predetermined electrode pattern (105) and a second predetermined electrode pattern (201) are formed on a first major surface (104) and a second major surface (200), respectively, of a piezoelectric crystal substrate (101). Additionally, a first predetermined attachment electrode pattern (106), electrically coupled to the second predetermined attachment electrode pattern, and a second predetermined attachment electrode pattern (202), electrically coupled to the first predetermined attachment electrode pattern, are formed on a first attachment area (102) and a second attachment area (103), respectively. The first and second attachment areas include extensions (107) that, when mounted, allow a conductive adhesive (301), placed on a mounting substrate (300), to flow and establish electrical connections with the first and second predetermined attachment electrode patterns.
    • 以下列方式提供表面安装晶体谐振器(100)。 分别在压电晶体基板(101)的第一主表面(104)和第二主表面(200)上形成第一预定电极图案(105)和第二预定电极图案(201)。 另外,电耦合到第二预定附接电极图案的第一预定附接电极图案(106)和电耦合到第一预定附接电极图案的第二预定附接电极图案(202)形成在第一附接区域 (102)和第二附接区域(103)。 第一和第二附接区域包括延伸部(107),其在安装时允许放置在安装基板(300)上的导电粘合剂(301)流动并建立与第一和第二预定附接电极图案的电连接。