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    • 6. 发明授权
    • Method for etching photolithographically produced quartz crystal blanks
for singulation
    • 用于刻蚀光刻制造的石英晶体坯料进行分割的方法
    • US5650075A
    • 1997-07-22
    • US450661
    • 1995-05-30
    • Kevin L. HaasRobert S. WitteCharles L. ZimnickiIyad Alhayek
    • Kevin L. HaasRobert S. WitteCharles L. ZimnickiIyad Alhayek
    • H01L21/306H01L21/301H01L41/09H01L41/22H03H3/02H03H9/19H03H9/12
    • H03H3/02H01L41/332
    • A method for etching (200) photolithographically produced quartz crystal blanks for singulation. First, a quartz wafer is plated on both sides with metal and subsequently coated on both sides with photoresist (202). Second, the photoresist is patterned and developed and the metal layers etched to define the periphery of a quartz blank with a narrow quartz channel exposed between the blank to be singulated and the parent quartz wafer (204). Third, the quartz channel is preferentially etched partially into the wafer along parallel atomic planes to provide a mechanically weak junction between the quartz wafer and the blank to be singulated, while the periphery around the remainder of the quartz blank is etched completely through the parent quartz wafer (206). Fourth, the photoresist layers are stripped from the quartz wafer (208). Finally, the quartz blank is cleaved substantially along the bottom of the quartz channel to singulate the crystal blank from the wafer (210).
    • 用于刻蚀(200)光刻制造的用于单分割的石英晶体坯料的方法。 首先,用金属在两面涂覆石英晶片,随后用光致抗蚀剂(202)在两面涂覆石英晶片。 第二,对光致抗蚀剂进行图案化和显影,并且金属层被蚀刻以限定石英坯料的外围,其中窄的石英通道暴露在待分割的坯料和母体石英晶片(204)之间。 第三,石英沟道优先沿着平行的原子平面部分地蚀刻到晶片中,以在石英晶片和待分割的坯料之间提供机械上的弱连接,而围绕石英坯料的其余部分的周边被完全蚀刻通过母体石英 晶片(206)。 第四,从石英晶片(208)剥离光致抗蚀剂层。 最后,石英坯料基本沿着石英通道的底部裂开,以从晶片(210)上分离晶体坯料。