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1. 发明授权

US08017499B2 Strained Si MOSFET on tensile-strained SiGe-on-insulator (SGOI) 有权
标题翻译：拉伸应变SiGe绝缘体上的应变Si MOSFET（SGOI）
公开(公告)号：US08017499B2
公开(公告)日：2011-09-13
申请号：US12125175
申请日：2008-05-22
申请人： Kevin K. Chan , Jack O. Chu , Kern Rim , Leathen Shi
发明人： Kevin K. Chan , Jack O. Chu , Kern Rim , Leathen Shi
IPC分类号： H01L21/336
CPC分类号： H01L29/78687 , H01L21/2007 , H01L29/1054 , H01L29/517 , H01L29/66742 , H01L29/7833 , H01L29/7842 , H01L29/78603
摘要： A semiconductor structure for use as a template for forming high-performance metal oxide semiconductor field effect transistor (MOSFET) devices is provided. More specifically, the present invention provides a structure that includes a SiGe-on-insulator substrate including a tensile-strained SiGe alloy layer located atop an insulating layer; and a strained Si layer atop the tensile-strained SiGe alloy layer. The present invention also provides a method of forming the tensile-strained SGOI substrate as well as the heterostructure described above. The method of the present invention decouples the preference for high strain in the strained Si layer and the Ge content in the underlying layer by providing a tensile-strained SiGe alloy layer directly atop on an insulating layer.
摘要翻译：提供了用作形成高性能金属氧化物半导体场效应晶体管（MOSFET）器件的模板的半导体结构。更具体地，本发明提供一种包括绝缘体上硅衬底的结构，其包括位于绝缘层顶部的拉伸应变SiGe合金层; 以及拉伸应变SiGe合金层顶部的应变Si层。本发明还提供了形成拉伸应变SGOI基板以及上述异质结构的方法。本发明的方法通过在绝缘层上直接提供拉伸应变SiGe合金层来分离应变Si层中的高应变和下层中的Ge含量的偏好。

2. 发明授权

US07217949B2 Strained Si MOSFET on tensile-strained SiGe-on-insulator (SGOI) 失效
标题翻译：拉伸应变SiGe绝缘体上的应变Si MOSFET（SGOI）
公开(公告)号：US07217949B2
公开(公告)日：2007-05-15
申请号：US10883443
申请日：2004-07-01
申请人： Kevin K. Chan , Jack O. Chu , Kern Rim , Leathen Shi
发明人： Kevin K. Chan , Jack O. Chu , Kern Rim , Leathen Shi
IPC分类号： H01L29/06
CPC分类号： H01L29/78687 , H01L21/2007 , H01L29/1054 , H01L29/517 , H01L29/66742 , H01L29/7833 , H01L29/7842 , H01L29/78603
摘要： A semiconductor structure for use as a template for forming high-performance metal oxide semiconductor field effect transistor (MOSFET) devices is provided. More specifically, the present invention provides a structure that includes a SiGe-on-insulator substrate including a tensile-strained SiGe alloy layer located atop an insulating layer; and a strained Si layer atop the tensile-strained SiGe alloy layer. The present invention also provides a method of forming the tensile-strained SGOI substrate as well as the heterostructure described above. The method of the present invention decouples the preference for high strain in the strained Si layer and the Ge content in the underlying layer by providing a tensile-strained SiGe alloy layer directly atop on an insulating layer.
摘要翻译：提供了用作形成高性能金属氧化物半导体场效应晶体管（MOSFET）器件的模板的半导体结构。更具体地，本发明提供一种包括绝缘体上硅衬底的结构，其包括位于绝缘层顶部的拉伸应变SiGe合金层; 以及拉伸应变SiGe合金层顶部的应变Si层。本发明还提供了形成拉伸应变SGOI基板以及上述异质结构的方法。本发明的方法通过在绝缘层上直接提供拉伸应变SiGe合金层来分离应变Si层中的高应变和下层中的Ge含量的偏好。

3. 发明申请

US20080220588A1 STRAINED Si MOSFET ON TENSILE-STRAINED SiGe-ON-INSULATOR (SGOI) 有权
公开(公告)号：US20080220588A1
公开(公告)日：2008-09-11
申请号：US12125175
申请日：2008-05-22
申请人： Kevin K. Chan , Jack O. Chu , Kern Rim , Leathen Shi
发明人： Kevin K. Chan , Jack O. Chu , Kern Rim , Leathen Shi
IPC分类号： H01L21/46
CPC分类号： H01L29/78687 , H01L21/2007 , H01L29/1054 , H01L29/517 , H01L29/66742 , H01L29/7833 , H01L29/7842 , H01L29/78603
摘要： A semiconductor structure for use as a template for forming high-performance metal oxide semiconductor field effect transistor (MOSFET) devices is provided. More specifically, the present invention provides a structure that includes a SiGe-on-insulator substrate including a tensile-strained SiGe alloy layer located atop an insulating layer; and a strained Si layer atop the tensile-strained SiGe alloy layer. The present invention also provides a method of forming the tensile-strained SGOI substrate as well as the heterostructure described above. The method of the present invention decouples the preference for high strain in the strained Si layer and the Ge content in the underlying layer by providing a tensile-strained SiGe alloy layer directly atop on an insulating layer.

4. 发明授权

US07507989B2 Strained Si MOSFET on tensile-strained SiGe-on-insulator (SGOI) 有权
公开(公告)号：US07507989B2
公开(公告)日：2009-03-24
申请号：US11927006
申请日：2007-10-29
申请人： Kevin K. Chan , Jack O. Chu , Kern Rim , Leathen Shi
发明人： Kevin K. Chan , Jack O. Chu , Kern Rim , Leathen Shi
IPC分类号： H01L29/06
CPC分类号： H01L29/78687 , H01L21/2007 , H01L29/1054 , H01L29/517 , H01L29/66742 , H01L29/7833 , H01L29/7842 , H01L29/78603
摘要： A semiconductor structure for use as a template for forming high-performance metal oxide semiconductor field effect transistor (MOSFET) devices is provided. More specifically, the present invention provides a structure that includes a SiGe-on-insulator substrate including a tensile-strained SiGe alloy layer located atop an insulating layer; and a strained Si layer atop the tensile-strained SiGe alloy layer. The present invention also provides a method of forming the tensile-strained SGOI substrate as well as the heterostructure described above. The method of the present invention decouples the preference for high strain in the strained Si layer and the Ge content in the underlying layer by providing a tensile-strained SiGe alloy layer directly atop on an insulating layer.

5. 发明授权

US07485518B2 Strained Si MOSFET on tensile-strained SiGe-on-insulator (SGOI) 失效
标题翻译：拉伸应变SiGe绝缘体上的应变Si MOSFET（SGOI）
公开(公告)号：US07485518B2
公开(公告)日：2009-02-03
申请号：US11684855
申请日：2007-03-12
申请人： Kevin K. Chan , Jack Q Chan , Kern Rim , Leathen Shi
发明人： Kevin K. Chan , Jack Q Chan , Kern Rim , Leathen Shi
IPC分类号： H01L21/336
CPC分类号： H01L29/78687 , H01L21/2007 , H01L29/1054 , H01L29/517 , H01L29/66742 , H01L29/7833 , H01L29/7842 , H01L29/78603
摘要： A semiconductor structure for use as a template for forming high-performance metal oxide semiconductor field effect transistor (MOSFET) devices is provided. More specifically, the present invention provides a structure that includes a SiGe-on-insulator substrate including a tensile-strained SiGe alloy layer located atop an insulating layer; and a strained Si layer atop the tensile-strained SiGe alloy layer. The present invention also provides a method of forming the tensile-strained SGOI substrate as well as the heterostructure described above. The method of the present invention decouples the preference for high strain in the strained Si layer and the Ge content in the underlying layer by providing a tensile-strained SiGe alloy layer directly atop on an insulating layer.
摘要翻译：提供了用作形成高性能金属氧化物半导体场效应晶体管（MOSFET）器件的模板的半导体结构。更具体地，本发明提供一种包括绝缘体上硅衬底的结构，其包括位于绝缘层顶部的拉伸应变SiGe合金层; 以及拉伸应变SiGe合金层顶部的应变Si层。本发明还提供了形成拉伸应变SGOI基板以及上述异质结构的方法。本发明的方法通过在绝缘层上直接提供拉伸应变SiGe合金层来分离应变Si层中的高应变和下层中的Ge含量的偏好。

6. 发明申请

US20050236687A1 Strained silicon CMOS on hybrid crystal orientations 失效
标题翻译：应变硅CMOS在混合晶体取向上
公开(公告)号：US20050236687A1
公开(公告)日：2005-10-27
申请号：US10830347
申请日：2004-04-22
申请人： Kevin Chan , Bruce Doris , Kathryn Guarini , Meikei Ieong , Shreesh Narasimha , Alexander Reznicek , Kern Rim , Devendra Sadana , Leathen Shi , Jeffrey Sleight , Min Yang
发明人： Kevin Chan , Bruce Doris , Kathryn Guarini , Meikei Ieong , Shreesh Narasimha , Alexander Reznicek , Kern Rim , Devendra Sadana , Leathen Shi , Jeffrey Sleight , Min Yang
IPC分类号： H01L27/08 , H01L21/02 , H01L21/20 , H01L21/336 , H01L21/762 , H01L21/8238 , H01L21/84 , H01L27/092 , H01L27/12 , H01L29/04 , H01L29/76 , H01L29/78 , H01L29/786
CPC分类号： H01L29/7842 , H01L21/2022 , H01L21/76275 , H01L21/823807 , H01L21/84 , H01L27/1203 , H01L29/045 , H01L29/78687
摘要： Methods of forming a strained Si-containing hybrid substrate are provided as well as the strained Si-containing hybrid substrate formed by the methods. In the methods of the present invention, a strained Si layer is formed overlying a regrown semiconductor material, a second semiconducting layer, or both. In accordance with the present invention, the strained Si layer has the same crystallographic orientation as either the regrown semiconductor layer or the second semiconducting layer. The methods provide a hybrid substrate in which at least one of the device layers includes strained Si.
摘要翻译：提供了形成应变含Si的杂化基板的方法以及通过这些方法形成的应变的含Si杂化基板。在本发明的方法中，形成覆盖重新生长的半导体材料，第二半导体层或两者的应变Si层。根据本发明，应变Si层具有与再生长半导体层或第二半导电层相同的晶体取向。该方法提供混合基板，其中至少一个器件层包括应变Si。

7. 发明申请

US20070155130A1 STRAINED Si MOSFET ON TENSILE-STRAINED SiGe-ON-INSULATOR (SGOI) 失效
标题翻译：拉伸应变SiGe-ON绝缘体（SGOI）上的应变Si MOSFET
公开(公告)号：US20070155130A1
公开(公告)日：2007-07-05
申请号：US11684855
申请日：2007-03-12
申请人： Kevin Chan , Jack Chan , Kern Rim , Leathen Shi
发明人： Kevin Chan , Jack Chan , Kern Rim , Leathen Shi
IPC分类号： H01L21/302
CPC分类号： H01L29/78687 , H01L21/2007 , H01L29/1054 , H01L29/517 , H01L29/66742 , H01L29/7833 , H01L29/7842 , H01L29/78603
摘要： A semiconductor structure for use as a template for forming high-performance metal oxide semiconductor field effect transistor (MOSFET) devices is provided. More specifically, the present invention provides a structure that includes a SiGe-on-insulator substrate including a tensile-strained SiGe alloy layer located atop an insulating layer; and a strained Si layer atop the tensile-strained SiGe alloy layer. The present invention also provides a method of forming the tensile-strained SGOI substrate as well as the heterostructure described above. The method of the present invention decouples the preference for high strain in the strained Si layer and the Ge content in the underlying layer by providing a tensile-strained SiGe alloy layer directly atop on an insulating layer.
摘要翻译：提供了用作形成高性能金属氧化物半导体场效应晶体管（MOSFET）器件的模板的半导体结构。更具体地，本发明提供一种包括绝缘体上硅衬底的结构，其包括位于绝缘层顶部的拉伸应变SiGe合金层; 以及拉伸应变SiGe合金层顶部的应变Si层。本发明还提供了形成拉伸应变SGOI基板以及上述异质结构的方法。本发明的方法通过在绝缘层上直接提供拉伸应变SiGe合金层来分离应变Si层中的高应变和下层中的Ge含量的偏好。

8. 发明申请

US20060001088A1 Strained Si MOSFET on tensile-strained SiGe-on-insulator (SGOI) 失效
标题翻译：拉伸应变SiGe绝缘体上的应变Si MOSFET（SGOI）
公开(公告)号：US20060001088A1
公开(公告)日：2006-01-05
申请号：US10883443
申请日：2004-07-01
申请人： Kevin Chan , Jack Chu , Kern Rim , Leathen Shi
发明人： Kevin Chan , Jack Chu , Kern Rim , Leathen Shi
IPC分类号： H01L21/00 , H01L31/0392
CPC分类号： H01L29/78687 , H01L21/2007 , H01L29/1054 , H01L29/517 , H01L29/66742 , H01L29/7833 , H01L29/7842 , H01L29/78603
摘要： A semiconductor structure for use as a template for forming high-performance metal oxide semiconductor field effect transistor (MOSFET) devices is provided. More specifically, the present invention provides a structure that includes a SiGe-on-insulator substrate comprising a tensile-strained SiGe alloy layer located atop an insulating layer; and a strained Si layer atop the tensile-strained SiGe alloy layer. The present invention also provides a method of forming the tensile-strained SGOI substrate as well as the heterostructure described above. The method of the present invention decouples the preference for high strain in the strained Si layer and the Ge content in the underlying layer by providing a tensile-strained SiGe alloy layer directly atop on an insulating layer. Specifically, the method includes forming a first multilayered structure comprising at least a tensile-strained SiGe alloy layer located above a relaxed SiGe alloy layer, wherein the tensile-strained SiGe alloy contains a lower Ge content than the relaxed SiGe alloy layer; bonding the first multilayered structure to an insulating layer of a second multilayered structure on a surface opposite the relaxed SiGe alloy layer; and removing the relaxed SiGe alloy layer.
摘要翻译：提供了用作形成高性能金属氧化物半导体场效应晶体管（MOSFET）器件的模板的半导体结构。更具体地，本发明提供一种包括绝缘体上硅衬底的结构，其包括位于绝缘层顶部的拉伸应变SiGe合金层; 以及拉伸应变SiGe合金层顶部的应变Si层。本发明还提供了形成拉伸应变SGOI基板以及上述异质结构的方法。本发明的方法通过在绝缘层上直接提供拉伸应变SiGe合金层来分离应变Si层中的高应变和下层中的Ge含量的偏好。具体地说，该方法包括形成至少包含位于松弛SiGe合金层上方的拉伸应变SiGe合金层的第一多层结构，其中拉伸应变SiGe合金含有比松弛SiGe合金层低的Ge含量; 将第一多层结构结合到与松弛SiGe合金层相对的表面上的第二多层结构的绝缘层; 并去除松弛的SiGe合金层。

9. 发明申请

US20080042166A1 STRAINED Si MOSFET ON TENSILE-STRAINED SiGe-ON-INSULATOR (SGOI) 有权
标题翻译：拉伸应变SiGe-ON绝缘体（SGOI）上的应变Si MOSFET
公开(公告)号：US20080042166A1
公开(公告)日：2008-02-21
申请号：US11927006
申请日：2007-10-29
申请人： Kevin Chan , Jack Chu , Kern Rim , Leathen Shi
发明人： Kevin Chan , Jack Chu , Kern Rim , Leathen Shi
IPC分类号： H01L29/06
CPC分类号： H01L29/78687 , H01L21/2007 , H01L29/1054 , H01L29/517 , H01L29/66742 , H01L29/7833 , H01L29/7842 , H01L29/78603
摘要： A semiconductor structure for use as a template for forming high-performance metal oxide semiconductor field effect transistor (MOSFET) devices is provided. More specifically, the present invention provides a structure that includes a SiGe-on-insulator substrate including a tensile-strained SiGe alloy layer located atop an insulating layer; and a strained Si layer atop the tensile-strained SiGe alloy layer. The present invention also provides a method of forming the tensile-strained SGOI substrate as well as the heterostructure described above. The method of the present invention decouples the preference for high strain in the strained Si layer and the Ge content in the underlying layer by providing a tensile-strained SiGe alloy layer directly atop on an insulating layer.
摘要翻译：提供了用作形成高性能金属氧化物半导体场效应晶体管（MOSFET）器件的模板的半导体结构。更具体地，本发明提供一种包括绝缘体上硅衬底的结构，其包括位于绝缘层顶部的拉伸应变SiGe合金层; 以及拉伸应变SiGe合金层顶部的应变Si层。本发明还提供了形成拉伸应变SGOI基板以及上述异质结构的方法。本发明的方法通过在绝缘层上直接提供拉伸应变SiGe合金层来分离应变Si层中的高应变和下层中的Ge含量的偏好。

10. 发明授权

US07888264B2 MOSFET structure with multiple self-aligned silicide contacts 有权
标题翻译：具有多个自对准硅化物触点的MOSFET结构
公开(公告)号：US07888264B2
公开(公告)日：2011-02-15
申请号：US12814942
申请日：2010-06-14
申请人： Kevin K. Chan , Christian Lavoie , Kern Rim
发明人： Kevin K. Chan , Christian Lavoie , Kern Rim
IPC分类号： H01L21/44
CPC分类号： H01L29/66507 , H01L29/6653 , H01L29/7833
摘要： A metal oxide semiconductor field effect transistor (MOSFET) structure that includes multiple and distinct self-aligned silicide contacts and methods of fabricating the same are provided. The MOSFET structure includes at least one metal oxide semiconductor field effect transistor having a gate conductor including a gate edge located on a surface of a Si-containing substrate; a first inner silicide having an edge that is substantially aligned to the gate edge of the at least one metal oxide semiconductor field effect transistor; and a second outer silicide located adjacent to the first inner silicide. In accordance with the present invention, the second outer silicide has second thickness is greater than the first thickness of the first inner silicide. Moreover, the second outer silicide has a resistivity that is lower than the resistivity of the first inner silicide.
摘要翻译：提供了包括多个不同的自对准硅化物触点的金属氧化物半导体场效应晶体管（MOSFET）结构及其制造方法。 MOSFET结构包括至少一个金属氧化物半导体场效应晶体管，其具有包括位于含Si衬底的表面上的栅极边缘的栅极导体; 第一内部硅化物，其具有基本上与所述至少一个金属氧化物半导体场效应晶体管的栅极边缘对准的边缘; 以及位于第一内部硅化物附近的第二外部硅化物。根据本发明，第二外部硅化物的第二厚度大于第一内部硅化物的第一厚度。此外，第二外部硅化物的电阻率低于第一内部硅化物的电阻率。

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