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    • 2. 发明授权
    • Device for sensing temperature of an electronic chip
    • 用于感测电子芯片温度的装置
    • US06786639B2
    • 2004-09-07
    • US10232258
    • 2002-08-30
    • Kevin CoviRaymond LonghiEdward J. SeminaroSteven G. Shevach
    • Kevin CoviRaymond LonghiEdward J. SeminaroSteven G. Shevach
    • G01K1500
    • G01K7/00
    • A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.
    • 一种用于测量电子芯片上的温度的方法和装置。 该装置包括芯片上的热感测元件,在已知电压和温度下使电流通过所述热感测元件的电源,以及确定热感测元件在所述已知电压和温度下的初始电阻的测量电路。 随着电子芯片的温度变化,测量电路测量热敏元件的电阻变化,并将热敏元件的电阻变化与初始电阻进行比较。 测量电路在电子芯片的操作期间从初始电阻和热感测元件的电阻变化确定电子芯片的温度。
    • 8. 发明申请
    • System and Method for Providing Remotely Coupled I/O Adapters
    • 提供远程耦合I / O适配器的系统和方法
    • US20090198837A1
    • 2009-08-06
    • US12024695
    • 2008-02-01
    • Ravi K. ArimilliClaude BassoJean L. CalvignacEdward J. Seminaro
    • Ravi K. ArimilliClaude BassoJean L. CalvignacEdward J. Seminaro
    • G06F3/00
    • G06F9/45558G06F2009/45579
    • A heterogeneous processing element model is provided where I/O devices look and act like processors. In order to be treated like a processor, an I/O processing element, or other special purpose processing element, must follow some rules and have some characteristics of a processor, such as address translation, security, interrupt handling, and exception processing, for example. The heterogeneous processing element model abstracts an I/O device such that communication intended for the I/O device may be packetized and sent over a network. Thus, a virtualization platform may packetize communication intended for a remotely located I/O device and transmit the packetized communication over a distance, rather than having to make a call to a library, call a device driver, pin memory, and so forth.
    • 提供异构处理元件模型,其中I / O设备看起来像处理器一样操作。 为了像处理器一样处理I / O处理元件或其他专用处理元件,必须遵循一些规则并具有处理器的某些特性,例如地址转换,安全性,中断处理和异常处理,用于 例。 异构处理元件模型抽象出I / O设备,使得针对I / O设备的通信可以被分组并通过网络发送。 因此,虚拟化平台可以打包用于远程位置的I / O设备的通信,并且在一定距离上发送分组化的通信,而不是必须对库进行呼叫,调用设备驱动器,引脚存储器等。
    • 10. 发明授权
    • Dynamically moveable exhausting EMC sealing system
    • 动态可动的EMC密封系统
    • US06660932B1
    • 2003-12-09
    • US10161930
    • 2002-06-05
    • Dennis R. BarringerEdward J. SeminaroHarold M. Toffler
    • Dennis R. BarringerEdward J. SeminaroHarold M. Toffler
    • H05K900
    • H05K9/0015
    • A docking apparatus for printed circuit boards including a cassette housing, having a housing base, a housing cover and a housing wall, wherein the housing base and the housing wall are disposed relative to each other so as to define a housing cavity for containing a printed circuit card and wherein the housing wall includes a cable opening disposed so as to be communicated with the housing cavity, a housing bezel, disposed relative to the cassette housing so as to be associated with the cable opening, the housing bezel includes an outer bezel having a first plurality of openings and an inner bezel having a second plurality of apertures, the inner bezel in electrical communication with the printed circuit card, wherein said housing bezel is removable, and an EMC gasket disposed between the outer and inner bezels of said housing bezel, the EMC gasket configured to provide a removable EMC seal proximate the cable opening while still allowing airflow through the first and second plurality of apertures having the EMC gasket therebetween.
    • 一种用于印刷电路板的对接装置,包括一个盒体,具有壳体基座,一个壳体盖和一个壳体壁,其中壳体基座和壳体壁相对于彼此设置,以便限定用于容纳印刷 电路卡,并且其中所述壳体壁包括布置成与所述壳体腔室连通的电缆开口,壳体边框,其相对于所述盒壳体设置成与所述电缆开口相关联,所述壳体边框包括外部边框,所述外部边框具有 第一多个开口和具有第二多个孔的内表圈,所述内边框与所述印刷电路卡电连通,其中所述壳体边框是可移除的,以及设置在所述外壳边框的外挡板和内挡板之间的EMC垫圈 ,所述EMC垫圈被配置为在电缆开口附近提供可移除的EMC密封,同时仍允许气流通过第一和第二多个 的孔之间具有EMC垫片。