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    • 2. 发明申请
    • Power short circuit testing of an electronics assembly employing pre-characterized power off resistance of an electronic component thereof from a power boundary
    • 电子组件的电力短路测试,其采用电力边界的电子部件的预定义的断电电阻
    • US20060271326A1
    • 2006-11-30
    • US11137878
    • 2005-05-26
    • Frank BoscoGerald FahrRaymond LonghiVincent Mulligan
    • Frank BoscoGerald FahrRaymond LonghiVincent Mulligan
    • G01R31/14
    • G01R31/025
    • A technique for testing an electronics assembly for a power short circuit is provided. The technique includes pre-characterizing power off resistance of an electronic component(s) of a first packaging level from at least one power boundary of the electronic component(s). The characterizing of the power off resistance occurs prior to placement of the electronic component(s) into an electronics assembly of a higher packaging level. The technique further includes determining actual power off resistance of the electronics component(s) after placement thereof into the electronics assembly, with the actual power off resistance being determined from the at least one power boundary. Thereafter, the actual power off resistance of the electronic component(s) in the electronics assembly is compared with the pre-characterized power off resistance of the at least one electronic component(s), and a determination is made therefrom whether a power short circuit exists within the electronics assembly.
    • 提供了一种用于测试用于电源短路的电子组件的技术。 该技术包括从电子部件的至少一个电源边界预先表征第一封装级别的电子部件的断电电阻。 在将电子部件放置到更高封装水平的电子组件之前,断电阻力的表征发生。 该技术还包括在将电子元件放入电子组件之后确定电子元件的实际断电电阻,其中实际断电电阻是从至少一个电源边界确定的。 此后,将电子组件中的电子部件的实际断电电阻与至少一个电子部件的预表示的断电电阻进行比较,并且确定电力短路 存在于电子组件内。
    • 6. 发明授权
    • Device for sensing temperature of an electronic chip
    • 用于感测电子芯片温度的装置
    • US06786639B2
    • 2004-09-07
    • US10232258
    • 2002-08-30
    • Kevin CoviRaymond LonghiEdward J. SeminaroSteven G. Shevach
    • Kevin CoviRaymond LonghiEdward J. SeminaroSteven G. Shevach
    • G01K1500
    • G01K7/00
    • A method and apparatus for measuring the temperature on an electronic chip. The Apparatus includes a thermal sense element on the chip, a power supply passing electrical current through said thermal sense element at a known voltage and temperature, and a measuring circuit determining the initial resistance of the thermal sense element at said known voltage and temperature. The measuring circuit measures the change of the resistance of the thermal sense element as the temperature of the electronic chip changes, and compares the change in resistance of the thermal sense element to the initial resistance. The measuring circuit determines the temperature of the electronic chip from the initial resistance and change in resistance of the thermal sense element during the operation of the electronic chip.
    • 一种用于测量电子芯片上的温度的方法和装置。 该装置包括芯片上的热感测元件,在已知电压和温度下使电流通过所述热感测元件的电源,以及确定热感测元件在所述已知电压和温度下的初始电阻的测量电路。 随着电子芯片的温度变化,测量电路测量热敏元件的电阻变化,并将热敏元件的电阻变化与初始电阻进行比较。 测量电路在电子芯片的操作期间从初始电阻和热感测元件的电阻变化确定电子芯片的温度。