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1. 发明授权

US06326420B1 Pigment dispersions containing dispersants prepared by controlled radical polymerization 失效
标题翻译：含有通过控制自由基聚合制备的分散剂的颜料分散体
公开(公告)号：US06326420B1
公开(公告)日：2001-12-04
申请号：US09464947
申请日：1999-12-16
申请人： Kevin C. Olson , Simion Coca , James B. O'Dwyer , Karl F. Schimmel
发明人： Kevin C. Olson , Simion Coca , James B. O'Dwyer , Karl F. Schimmel
IPC分类号： C08L300
CPC分类号： C09B67/009 , C09D17/001
摘要： A pigment dispersion which includes a pigment, an aqueous carrier and a pigment dispersant. The pigment dispersant is prepared by controlled radical polymerization initiated in the presence of a monomeric initiator having at least two radically transferable groups. The pigment dispersant has at least one of the following polymer chain structures: &phgr;-[(G)p—(E)s—T]z and &phgr;-[(E)3—(G)p—T]z where G is a hydrophobic residue of at least one radically polymerizable ethylenically unsaturated monomer; E is a hydrophilic residue of at least one radically polymerizable ethylenically unsaturated monomer; &phgr; is a residue of or derived from the initiator, and is free of the radically transferable group; T is or is derived from the radically transferable group of the initiator; z is 2 to 10; p and s are at least one and are selected such that the pigment dispersant has a number average molecular weight of at least 500.
摘要翻译：颜料分散体，其包含颜料，水性载体和颜料分散剂。在具有至少两个可自由基转移基团的单体引发剂的存在下引发的受控自由基聚合来制备颜料分散剂。颜料分散剂具有以下聚合物链结构中的至少一种：其中G是至少一个可自由基聚合的烯属不饱和单体的疏水残基; E是至少一种可自由基聚合的烯属不饱和单体的亲水性残基; phi是引发剂的残基或衍生自起始物，不含可自由基转移基团; T衍生自引发剂的可自由转移基团; z为2〜10; p和s是至少一个，并且被选择为使得颜料分散剂的数均分子量为至少500。

2. 发明授权

US06590049B1 Multi-functional initiators for atom transfer radical (Co)polymerization 失效
标题翻译：用于原子转移自由基（Co）聚合的多官能引发剂
公开(公告)号：US06590049B1
公开(公告)日：2003-07-08
申请号：US09687026
申请日：2000-10-13
申请人： James B. O'Dwyer , Kevin C. Olson , Simion Coca , Brian E. Woodworth
发明人： James B. O'Dwyer , Kevin C. Olson , Simion Coca , Brian E. Woodworth
IPC分类号： C08F200
CPC分类号： C09D17/001 , C08F4/00 , C09B67/009
摘要： The present invention is directed to novel compounds that can serve as highly efficient initiators for controlled radical (co)polymerization processes including atom transfer radical (co)polymerization processes. These compounds include di-(trimethylolpropane)-tetra-(2-haloisobutyrate) compounds. The present invention also is directed to controlled radical (co)polymerization processes in which novel (co)polymers are prepared using the novel compounds, as well as to the novel (co)polymer products of the process.
摘要翻译：本发明涉及可用作用于受控自由基（共）聚合方法的高效引发剂的新型化合物，包括原子转移自由基（共）聚合方法。这些化合物包括二（三羟甲基丙烷） - 四 - （2-卤代异丁酸酯）化合物。本发明还涉及使用新化合物以及该方法的新型（共）聚合物产物制备新型（共）聚合物的受控自由基（共）聚合方法。

3. 发明授权

US08598467B2 Multi-layer circuit assembly and process for preparing the same 失效
标题翻译：多层电路组装及其制备方法
公开(公告)号：US08598467B2
公开(公告)日：2013-12-03
申请号：US13275808
申请日：2011-10-18
申请人： Kevin C. Olson , Alan G. Wang
发明人： Kevin C. Olson , Alan G. Wang
IPC分类号： H05K1/11
CPC分类号： H01L21/486 , C09D5/4488 , H01L21/481 , H01L21/4857 , H01L23/142 , H01L23/49827 , H01L2924/0002 , H01L2924/3011 , H05K1/056 , H05K3/0023 , H05K3/0032 , H05K3/0035 , H05K3/388 , H05K3/426 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K2201/0179 , H05K2201/09554 , H05K2201/09609 , H05K2203/0582 , H05K2203/135 , H01L2924/00
摘要： A process for fabricating a multi-layer circuit assembly is provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; (c) removing the dielectric coating in a predetermined pattern to expose sections of the substrate; (d) applying a layer of metal to all surfaces to form metallized vias through and/or to the electrically conductive core; (e) applying a resist to the metal layer to form a photosensitive layer thereon; (f) imaging resist in predetermined locations; (g) developing resist to uncover selected areas of the metal layer; and (h) etching uncovered areas of metal to form an electrical circuit pattern connected by the metallized vias.
摘要翻译：提供了一种用于制造多层电路组件的工艺。该方法包括（a）提供基底，其至少一个区域包括通孔密度为500至10,000个孔/平方英寸（75至1550个孔/平方厘米）的多个通孔区域; （b）将介电涂层施加到所述基底的所有暴露表面上以在其上形成保形涂层; （c）以预定图案去除所述电介质涂层以暴露所述基板的部分; （d）将金属层施加到所有表面以形成通过和/或导电芯的金属化通孔; （e）在所述金属层上施加抗蚀剂以在其上形成感光层; （f）在预定位置的成像抗蚀剂; （g）显影抗蚀剂以露出金属层的选定区域; 和（h）蚀刻金属的未覆盖区域以形成通过金属化通孔连接的电路图案。

4. 发明申请

US20110098394A1 COATING COMPOSITION COMPRISING AN ALKOXYSILANE, A POLYSILOXANE, AND A PLURALITY OF PARTICLES 有权
标题翻译：包含烷基硅烷，聚硅氧烷和多种颗粒的涂料组合物
公开(公告)号：US20110098394A1
公开(公告)日：2011-04-28
申请号：US12607734
申请日：2009-10-28
申请人： Robert Schmeltzer , Susan Donaldson , Kevin C. Olson , Kurt G. Olson , John E. Schwendeman , Dennis A. Simpson , Frank C. Williams
发明人： Robert Schmeltzer , Susan Donaldson , Kevin C. Olson , Kurt G. Olson , John E. Schwendeman , Dennis A. Simpson , Frank C. Williams
IPC分类号： C08K3/22 , C08K3/10 , C08L83/06 , C08L77/00 , C08L67/00
CPC分类号： C09D183/04 , C08G18/792 , C08K3/22 , C08K3/36 , C09D183/06 , C09D183/08 , C09D201/10 , C08L2666/02
摘要： The present invention is directed to a coating composition, such as a substantially clear coating composition, which comprises (1) an alkoxysilane, (2) a polysiloxane, (3) a plurality of particles, and (4) curing agent that is reactive with the polysiloxane. The coating composition of the present invention can exhibit increased physical properties, such as scratch resistance, when compared to similar coating compositions that lack the components disclosed herein.
摘要翻译：本发明涉及涂料组合物，例如基本上透明的涂料组合物，其包括（1）烷氧基硅烷，（2）聚硅氧烷，（3）多个颗粒，和（4）与聚硅氧烷。当与缺乏本文公开的组分的类似涂料组合物相比时，本发明的涂料组合物可以表现出增加的物理性能，例如耐刮擦性。

5. 发明授权

US07803415B2 Methods for coating food cans 有权
标题翻译：食品包装方法
公开(公告)号：US07803415B2
公开(公告)日：2010-09-28
申请号：US11862423
申请日：2007-09-27
申请人： Laura Kiefer-Liptak , John M. Dudik , Ronald R. Ambrose , Kevin C. Olson , Padmanabhan Sundararaman
发明人： Laura Kiefer-Liptak , John M. Dudik , Ronald R. Ambrose , Kevin C. Olson , Padmanabhan Sundararaman
IPC分类号： C09D167/00
CPC分类号： C09D167/06 , C08K5/0025 , C08K5/34922 , C08L33/00 , C08L51/08 , C08L61/00 , C08L61/12 , C08L67/02 , C08L67/06 , C08L87/005 , C09D151/08 , C09D167/00 , C09D167/02 , C09D167/04 , C08L2666/14 , C08L2666/02 , C08L2666/24 , C08L2666/18
摘要： A composition for coating food cans is disclosed. The composition comprises a polyester, an acrylic copolymer and a crosslinker; the polyester and acrylic copolymer have been compatibilized in some way, such as through graft copolymerization. Methods for compatibilizing acrylics and polyesters are also disclosed as are methods for coating cans using compositions comprising acrylic and polyesters.
摘要翻译：公开了一种用于涂覆食品罐头的组合物。该组合物包含聚酯，丙烯酸共聚物和交联剂; 聚酯和丙烯酸共聚物已经以某种方式相容，例如通过接枝共聚。还公开了相容化丙烯酸类和聚酯的方法，其中使用包含丙烯酸和聚酯的组合物涂覆罐的方法。

6. 发明申请

US20090178838A1 CIRCUIT BOARD HAVING AN ELECTRODEPOSITED COATING ON A CONDUCTIVE CORE WITHIN A VIA AND METHOD OF MAKING SAME 有权
标题翻译：电路板在导电芯中具有电沉积涂层及其制造方法
公开(公告)号：US20090178838A1
公开(公告)日：2009-07-16
申请号：US11972671
申请日：2008-01-11
申请人： Alan E. Wang , Kevin C. Olson , Michael L. Pawlik
发明人： Alan E. Wang , Kevin C. Olson , Michael L. Pawlik
IPC分类号： H05K1/05 , H05K3/42
CPC分类号： H05K3/429 , H01L2924/0002 , H05K3/445 , H05K3/4641 , H05K2201/09309 , H05K2203/135 , Y10T29/49126 , Y10T29/49165 , H01L2924/00
摘要： A process for fabricating a circuit board includes: providing a substrate including a first electrically conductive core having a first insulating coating on a first side and a second insulating coating on a second side, forming an opening in the first and second insulating coatings and the first electrically conductive core, exposing an edge of the conductive core within the opening, and electrodepositing a third insulating material on the exposed edge of the first electrically conductive core. A circuit board fabricated using the process is also provided.
摘要翻译：一种电路板的制造方法，包括：提供包括第一导电芯的基板，第一导电芯在第一侧具有第一绝缘涂层，在第二侧具有第二绝缘涂层，在第一绝缘涂层和第二绝缘涂层中形成开口导电芯，将导电芯的边缘暴露在开口内，以及在第一导电芯的暴露边缘上电沉积第三绝缘材料。还提供了使用该方法制造的电路板。

7. 发明授权

US07228623B2 Process for fabricating a multi layer circuit assembly 失效
标题翻译：制造多层电路组件的方法
公开(公告)号：US07228623B2
公开(公告)日：2007-06-12
申请号：US10291876
申请日：2002-11-08
申请人： Kevin C. Olson , Alan E. Wang
发明人： Kevin C. Olson , Alan E. Wang
IPC分类号： H01K3/10 , B05D1/36 , G03C5/00
CPC分类号： C09D5/4488 , H01L21/481 , H01L21/4857 , H01L21/486 , H01L23/142 , H01L2924/0002 , H01L2924/3011 , H05K1/056 , H05K3/0023 , H05K3/0032 , H05K3/0035 , H05K3/388 , H05K3/426 , H05K3/44 , H05K3/445 , H05K3/4608 , H05K2201/0179 , H05K2201/09554 , H05K2201/09609 , H05K2203/0582 , H05K2203/135 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158 , Y10T29/49165 , H01L2924/00
摘要： Processes for fabricating a multi-layer circuit assembly and a multi-layer circuit assembly fabricated by such processes are provided. The process includes (a) providing a substrate at least one area of which comprises a plurality of vias, these area(s) having a via density of 500 to 10,000 holes/square inch (75 to 1550 holes/square centimeter); (b) applying a dielectric coating onto all exposed surfaces of the substrate to form a conformal coating thereon; and (c) applying a layer of metal to all surfaces of the substrate. Additional processing steps such as circuitization may be included.
摘要翻译：提供了用于制造多层电路组件的工艺和通过这些工艺制造的多层电路组件。该方法包括（a）提供基底，其至少一个区域包括多个通孔，这些区域的通孔密度为500至10,000个孔/平方英寸（75至1550个孔/平方厘米）; （b）将介电涂层施加到所述基底的所有暴露表面上以在其上形成保形涂层; 和（c）在基片的所有表面上涂一层金属。可以包括诸如电路化的附加处理步骤。

8. 发明授权

US07159308B2 Method of making a circuit board 有权
标题翻译：制作电路板的方法
公开(公告)号：US07159308B2
公开(公告)日：2007-01-09
申请号：US11224197
申请日：2005-09-12
申请人： Alan E. Wang , Kevin C. Olson , Thomas H. Di Stefano
发明人： Alan E. Wang , Kevin C. Olson , Thomas H. Di Stefano
IPC分类号： H05K3/36
CPC分类号： H05K1/0231 , H01L2224/16225 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/44 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0397 , H05K2201/0909 , H05K2201/0919 , H05K2201/09309 , H05K2201/09554 , H05K2201/10446 , H05K2203/135 , Y10T29/49117 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of forming a circuit board including (a) providing a first conductive sheet; (b) selectively removing one or more portions of the first conductive sheet to form a first panel having a first circuit board that is coupled to a disposable part of the first panel by at least one tab that extends from an edge of the first circuit board to an edge of the disposable part of the first panel; (c) applying an insulating coating to the first circuit board so that at least each edge of the first circuit board is covered thereby; and (d) separating the first circuit board from the disposable part in a manner whereupon at least part of the tab remains attached to the first circuit board and includes an exposed edge of the conductive sheet of the first circuit board. Circuit boards formed by the method are also provided.
摘要翻译：提供一种形成电路板的方法，包括：（a）提供第一导电片; （b）选择性地去除所述第一导电片的一个或多个部分以形成具有第一电路板的第一面板，所述第一电路板通过从所述第一电路板的边缘延伸的至少一个接片连接到所述第一面板的一次性部分到所述第一面板的一次性部分的边缘; （c）向第一电路板施加绝缘涂层，使得第一电路板的至少每个边缘被覆盖; 和（d）以一种方式将第一电路板与一次性部分分离，由此至少部分突片保持附接到第一电路板并且包括第一电路板的导电片的暴露边缘。还提供了通过该方法形成的电路板。

9. 发明授权

US08409982B2 Method of forming solid blind vias through the dielectric coating on high density interconnect (HDI) substrate materials 失效
标题翻译：通过高密度互连（HDI）衬底材料上的电介质涂层形成固体盲孔的方法
公开(公告)号：US08409982B2
公开(公告)日：2013-04-02
申请号：US13182838
申请日：2011-07-14
申请人： Kevin C. Olson , Alan E. Wang
发明人： Kevin C. Olson , Alan E. Wang
IPC分类号： H01L21/4763
CPC分类号： H05K3/44 , H05K3/108 , H05K3/388 , H05K3/445 , H05K3/4647 , H05K2201/09554 , H05K2203/0582 , H05K2203/0733 , H05K2203/135
摘要： A method includes forming a first substrate by (a) applying an electrodepositable dielectric coating onto a conductive surface; (b) curing the dielectric coating; (c) depositing an adhesion layer and a seed layer onto the dielectric coating; (d) applying a layer of a first removable material to the seed layer; (e) forming openings in the first removable material to expose areas of the seed layer; (f) electroplating a first conductive material to the exposed areas of the seed layer; (g) applying a layer of a second removable material; (h) forming openings in the second removable material to expose areas of the first conductive material; (i) plating a second conductive material to the exposed areas of the first conductive material; (j) removing the first and second removable materials; (k) removing unplated portions of the seed layer; repeating steps (a) through (k) to form a second substrate; and laminating the first and second substrates together with a layer of dielectric material between the first and second substrates to form at least one interconnect between the first and second substrates.
摘要翻译：一种方法包括通过以下步骤形成第一衬底：（a）将电沉积介电涂层施加到导电表面上; （b）固化电介质涂层; （c）在所述电介质涂层上沉积粘附层和种子层; （d）将第一可移除材料层施加到种子层; （e）在第一可移除材料中形成开口以暴露种子层的区域; （f）将第一导电材料电镀到种子层的暴露区域; （g）施加第二可移除材料层; （h）在所述第二可移除材料中形成开口以暴露所述第一导电材料的区域; （i）将第二导电材料镀覆到第一导电材料的暴露区域; （j）移除第一和第二可移除材料; （k）去除种子层的未镀层的部分; 重复步骤（a）至（k）以形成第二衬底; 以及将所述第一和第二基板与第一和第二基板之间的介电材料层一起层压，以在所述第一和第二基板之间形成至少一个互连。

10. 发明授权

US08141245B2 Method of forming a circuit board with improved via design 失效
标题翻译：用改进的通孔设计形成电路板的方法
公开(公告)号：US08141245B2
公开(公告)日：2012-03-27
申请号：US12344643
申请日：2008-12-29
申请人： Kevin C. Olson , Alan E. Wang , Peter Elenius , Thomas W. Goodman
发明人： Kevin C. Olson , Alan E. Wang , Peter Elenius , Thomas W. Goodman
IPC分类号： H01K3/10
CPC分类号： H05K3/44 , H05K1/056 , H05K3/002 , H05K3/0052 , H05K3/4641 , H05K3/4644 , H05K2201/0166 , H05K2201/0909 , H05K2201/0919 , H05K2201/09554 , H05K2203/135 , Y10T29/49126 , Y10T29/49156 , Y10T29/49167 , Y10T428/12361 , Y10T428/24322
摘要： A circuit board or each circuit board of a multi-layer circuit board includes an electrically conductive sheet coated with an insulating top layer covering one surface of the conductive sheet, an insulating bottom layer covering another surface of the conductive sheet and an insulating edge layer covering an edge of the conductive sheet. An insulating interlayer can be sandwiched between a pair of adjacent circuit boards of a multi-layer circuit board assembly. A landless through-hole or via can extend through one or more of the circuit boards for connecting electrical conductors on opposing surfaces thereof.
摘要翻译：多层电路板的电路板或每个电路板包括涂覆有覆盖导电片的一个表面的绝缘顶层的导电片，覆盖导电片的另一表面的绝缘底层和覆盖导电片的边缘。绝缘中间层可以夹在多层电路板组件的一对相邻电路板之间。无地通孔或通孔可以延伸通过一个或多个电路板，用于连接其相对表面上的电导体。

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