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1. 发明申请

US20120295376A1 METHOD FOR MANUFACTURING A LED ARRAY DEVICE, AND LED ARRAY DEVICE MANUFACTURED THEREBY 审中-公开
标题翻译：制造LED阵列装置的方法及其制造的LED阵列装置
公开(公告)号：US20120295376A1
公开(公告)日：2012-11-22
申请号：US13473300
申请日：2012-05-16
申请人： Keon Jae LEE , So Young PARK , Seung Hyun LEE , Kwi Il PARK , Min KOO
发明人： Keon Jae LEE , So Young PARK , Seung Hyun LEE , Kwi Il PARK , Min KOO
IPC分类号： H01L33/30 , H01L33/08
CPC分类号： H01L25/0753 , A61N5/0622 , A61N2005/0652 , A61N2005/0662 , H01L24/19 , H01L33/62 , H01L2224/24137 , H01L2224/32225 , H01L2224/73267 , H01L2224/92244 , H01L2924/12041 , H01L2924/12042 , H01L2924/00
摘要： Disclosed are a method for fabricating a GaN LED array device for optogenetics and a GaN LED array device fabricated thereby.
摘要翻译：公开了一种用于制造用于光遗传学的GaN LED阵列器件和由其制造的GaN LED阵列器件的方法。

2. 发明申请

US20130037893A1 SEMICONDUCTOR DEVICE 审中-公开
标题翻译：半导体器件
公开(公告)号：US20130037893A1
公开(公告)日：2013-02-14
申请号：US13336050
申请日：2011-12-23
申请人： Seung Hyun LEE
发明人： Seung Hyun LEE
IPC分类号： H01L29/82
CPC分类号： H01L43/02 , G11C11/161 , G11C11/1659 , G11C11/1675 , G11C11/5607 , H01L27/228 , H01L43/08
摘要： A semiconductor device includes a first free layer having a magnetic direction that changes according to a direction and an amount of a first current, a first tunnel insulating layer arranged on the first free layer, a pinned layer, arranged on the first tunnel insulating layer, having a magnetic direction set to a first direction, a second tunnel insulating layer arranged on the pinned layer, and a second free layer, arranged on the second tunnel insulating layer, having a magnetic direction that changes according to a direction and an amount of a second current.
摘要翻译：半导体器件包括：第一自由层，其具有根据第一电流的方向和量而变化的磁方向，布置在第一自由层上的第一隧道绝缘层，布置在第一隧道绝缘层上的钉扎层，具有设置在第一方向的磁方向，布置在被钉扎层上的第二隧道绝缘层和布置在第二隧道绝缘层上的第二自由层，具有根据方向和量的变化的磁方向第二电流。

3. 发明申请

US20130018567A1 MOBILE TERMINAL, SYSTEM AND METHOD FOR CONTROLLING AN ELECTRONIC CONTROL UNIT 审中-公开
标题翻译：移动终端，用于控制电子控制单元的系统和方法
公开(公告)号：US20130018567A1
公开(公告)日：2013-01-17
申请号：US13313073
申请日：2011-12-07
申请人： Sang Woo LIM , Seung Hyun LEE , In Oh HWANG
发明人： Sang Woo LIM , Seung Hyun LEE , In Oh HWANG
IPC分类号： F02D28/00
CPC分类号： B60W50/085 , B60W2050/0064 , B60W2540/28 , B60W2550/20 , B60W2550/40 , B60W2550/402 , F02D41/021 , F02D41/266 , F02D2200/60 , F02D2200/70 , F02D2200/701 , F02D2200/702
摘要： A mobile terminal to control an Electronic Control Unit (ECU) of a vehicle includes a communication unit, a storage unit, and an ECU control unit. The communication unit communicates with the ECU, and the storage unit stores information collected from the ECU and status information collected inside or outside the mobile terminal. The ECU control unit determines a driving environment of the vehicle according to the status information collected, processes the information collected from the ECU, and controls the ECU. A method for controlling a vehicle ECU from a mobile terminal includes determining a driving environment, and remotely controlling the ECU from the mobile terminal based on the driving environment.
摘要翻译：用于控制车辆的电子控制单元（ECU）的移动终端包括通信单元，存储单元和ECU控制单元。通信单元与ECU通信，并且存储单元存储从ECU收集的信息和在移动终端内部或外部收集的状态信息。 ECU控制单元根据收集到的状态信息来确定车辆的行驶环境，处理从ECU收集的信息，并控制ECU。一种用于从移动终端控制车辆ECU的方法包括：根据驾驶环境确定驾驶环境，并从移动终端远程控制ECU。

4. 发明申请

US20100224920A1 MAGNETORESISTIVE MEMORY CELL AND METHOD OF MANUFACTURING MEMORY DEVICE INCLUDING THE SAME 审中-公开
标题翻译：磁记忆体单元及其制造方法
公开(公告)号：US20100224920A1
公开(公告)日：2010-09-09
申请号：US12643011
申请日：2009-12-21
申请人： Seung Hyun LEE
发明人： Seung Hyun LEE
IPC分类号： H01L29/82 , H01L21/00
CPC分类号： H01L27/228 , G11C11/16
摘要： A magnetoresistive memory cell includes a magnetic tunnel junction element; and a selection transistor, wherein the selection transistor includes a first conductive type semiconductor layer, a gate electrode formed on the first conductive type semiconductor layer with a gate insulation film interposed between the first conductive type semiconductor layer and the gate electrode, and second conductive type first and second diffusion regions formed in the first conductive type semiconductor such that the first and second diffusion regions are spaced apart from each other. The magnetic tunnel junction element includes a free magnetization layer, a fixed magnetization layer, and a tunnel barrier layer interposed between the free magnetization layer and the fixed magnetization layer, and the free magnetization layer of the magnetic tunnel junction element is electrically connected to any one of the first and second diffusion regions of the selection transistor.
摘要翻译：磁阻存储单元包括磁性隧道结元件; 以及选择晶体管，其中所述选择晶体管包括第一导电类型半导体层，形成在所述第一导电类型半导体层上的栅电极，其中介于所述第一导电类型半导体层和所述栅极之间的栅极绝缘膜，以及第二导电类型形成在第一导电型半导体中的第一和第二扩散区域使得第一和第二扩散区域彼此间隔开。磁性隧道结元件包括自由磁化层，固定磁化层和介于自由磁化层和固定磁化层之间的隧道势垒层，并且磁性隧道结元件的自由磁化层电连接到任何一个的选择晶体管的第一和第二扩散区域。

5. 发明申请

US20090121326A1 SEMICONDUCTOR PACKAGE MODULE 有权
标题翻译：半导体封装模块
公开(公告)号：US20090121326A1
公开(公告)日：2009-05-14
申请号：US11953967
申请日：2007-12-11
申请人： Jong Hoon KIM , Min Suk SUH , Seong Cheol KIM , Seung Taek YANG , Seung Hyun LEE
发明人： Jong Hoon KIM , Min Suk SUH , Seong Cheol KIM , Seung Taek YANG , Seung Hyun LEE
IPC分类号： H01L23/495 , H01L23/538
CPC分类号： H05K1/141 , H01L25/105 , H01L2224/16225 , H01L2224/32145 , H01L2224/32225 , H01L2224/73253 , H01L2225/107 , H01L2225/1088 , H01L2225/1094 , H05K1/021 , H05K1/182 , H05K1/183 , H05K3/0061 , H05K2201/10371 , H05K2201/10545 , H05K2201/10674 , H05K2203/1572
摘要： A semiconductor package module includes a circuit board including a board body having a receiving portion and conductive patterns formed on the board body; a semiconductor package received in the receiving portion and having conductive terminals electrically connected to the conductive patterns and an s semiconductor chip electrically connected to the conductive terminals; and a connection member electrically connecting the conductive patterns and the conductive terminals. In the present invention, after a receiving portion having a receiving space is formed in the board body of a circuit board and a semiconductor package is received in the receiving portion, and a connection terminal of the semiconductor package and a conductive pattern of the board body are electrically connected using a connection member, a plurality of semiconductor packages can be stacked in a single circuit board without increasing the thickness thereby significantly improving data storage capacity and data processing speed of the semiconductor package module.
摘要翻译：一种半导体封装模块，包括：电路板，包括具有接收部分的基板主体和形成在所述基板主体上的导电图案; 接收在所述接收部分中并且具有电连接到所述导电图案的导电端子和与所述导电端子电连接的半导体芯片的半导体封装; 以及电连接导电图案和导电端子的连接构件。在本发明中，在电路基板的基板主体中形成具有接收空间的接收部分，并且在接收部分中接收半导体封装的接收部分，以及半导体封装的连接端子和板体的导电图案使用连接构件电连接，多个半导体封装可以堆叠在单个电路板中而不增加厚度，从而显着提高半导体封装模块的数据存储容量和数据处理速度。

6. 发明申请

US20130069226A1 SEMICONDUCTOR PACKAGE HAVING INTERPOSER 有权
标题翻译：具有插座的半导体封装
公开(公告)号：US20130069226A1
公开(公告)日：2013-03-21
申请号：US13337197
申请日：2011-12-26
申请人： Seung Hyun LEE
发明人： Seung Hyun LEE
IPC分类号： H01L23/498
CPC分类号： H01L23/49811 , H01L23/3128 , H01L23/49816 , H01L23/49827 , H01L23/49866 , H01L2224/16225 , H01L2924/15311
摘要： A semiconductor package includes a first structural body having a first surface and a second surface which faces away from the first surface, and formed with first connection members on the first surface; a second structural body placed over the first structural body, and formed with second connection members on a surface thereof which faces the first surface of the first structural body; and an interposer interposed between the first structural body and the second structural body, and having a body which is formed with openings into which the first connection members and the second connection members are inserted and a conductive layer which is formed to fill the openings.
摘要翻译：半导体封装包括具有第一表面的第一结构体和远离所述第一表面的第二表面，并且在所述第一表面上形成有第一连接构件; 第二结构体，其放置在第一结构体上，并且在与第一结构体的第一表面相对的表面上形成有第二连接构件; 以及介于所述第一结构体和所述第二结构体之间的插入体，并且具有形成有所述第一连接构件和所述第二连接构件插入的开口的主体和形成为填充所述开口的导电层。

7. 发明申请

US20120299199A1 STACKED WAFER LEVEL PACKAGE HAVING A REDUCED SIZE 审中-公开
公开(公告)号：US20120299199A1
公开(公告)日：2012-11-29
申请号：US13569562
申请日：2012-08-08
申请人： Jong Hoon KIM , Min Suk SUH , Seung Taek YANG , Seung Hyun LEE , Tae Min KANG
发明人： Jong Hoon KIM , Min Suk SUH , Seung Taek YANG , Seung Hyun LEE , Tae Min KANG
IPC分类号： H01L23/488
CPC分类号： H01L25/0652 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L23/3114 , H01L24/19 , H01L24/82 , H01L24/96 , H01L24/97 , H01L25/50 , H01L2221/68345 , H01L2224/0401 , H01L2224/04105 , H01L2224/12105 , H01L2224/19 , H01L2224/32145 , H01L2224/73217 , H01L2224/73267 , H01L2224/92244 , H01L2224/96 , H01L2224/97 , H01L2225/06562 , H01L2924/01023 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01059 , H01L2924/01078 , H01L2924/014 , H01L2924/12044 , H01L2924/15311 , H01L2924/15788 , H01L2924/18161 , H01L2924/18162 , H01L2224/82 , H01L2224/83 , H01L2924/00 , H01L2224/83005
摘要： A stacked wafer level package includes a first semiconductor chip having a first bonding pad and a second semiconductor chip having a second bonding pad. Both bonding pads of the semiconductor chips face the same direction. The second semiconductor chip is disposed in parallel to the first semiconductor chip. A third semiconductor chip is disposed over the first and second semiconductor chips acting as a supporting substrate. The third semiconductor chip has a third bonding pad that is exposed between the first and the second semiconductor chips upon attachment. Finally, a redistribution structure is electrically connected to the first, second, and third bonding pads.

8. 发明申请

US20120241828A1 SEMICONDUCTOR MEMORY DEVICE AND MANUFACTURING METHOD THEREOF 有权
标题翻译：半导体存储器件及其制造方法
公开(公告)号：US20120241828A1
公开(公告)日：2012-09-27
申请号：US13336069
申请日：2011-12-23
申请人： Seung Hyun LEE
发明人： Seung Hyun LEE
IPC分类号： H01L29/82 , H01L21/8246
CPC分类号： H01L43/12 , G11C11/155 , G11C11/161 , G11C11/1659 , G11C11/5607 , H01L27/226 , H01L27/228 , H01L29/82 , H01L43/02 , H01L43/08
摘要： A method for manufacturing a semiconductor memory device includes forming a magnetic tunnel junction layer on a lower electrode, forming a spacer having an annular shape on the magnetic tunnel junction layer, forming upper electrodes on both sidewall surfaces of the annular shaped spacer, removing the spacer, and etching the magnetic tunnel junction layer by using the upper electrodes as an etch mask.
摘要翻译：一种制造半导体存储器件的方法包括在下电极上形成磁性隧道结层，在磁性隧道结层上形成具有环形形状的间隔物，在环形间隔物的两个侧壁表面上形成上电极，，并通过使用上电极作为蚀刻掩模蚀刻磁性隧道结层。

9. 发明申请

US20110127611A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110127611A1
公开(公告)日：2011-06-02
申请号：US12842598
申请日：2010-07-23
申请人： Seung Hyun LEE
发明人： Seung Hyun LEE
IPC分类号： H01L29/78 , H01L21/336
CPC分类号： H01L29/78 , H01L29/41791 , H01L29/66795 , H01L29/785 , H01L2029/7858
摘要： A semiconductor device comprises an active region having an upper portion and a sidewall portion which are protruded from the top surface of a device isolation region, and a silicide film disposed in the upper portion and the sidewall portion of the active region, thereby effectively reducing resistance in a source/drain region of the semiconductor device. As a result, the entire resistance of the semiconductor device comprising a fin-type gate can be reduced to improve characteristics of the semiconductor device.
摘要翻译：半导体器件包括具有从器件隔离区的顶表面突出的上部和侧壁部分的有源区和设置在有源区的上部和侧壁部分中的硅化物膜，从而有效地降低电阻在半导体器件的源/漏区中。结果，可以减少包括鳍型栅极的半导体器件的整个电阻，以改善半导体器件的特性。

10. 发明申请

US20100259657A1 IMAGE SENSOR MODULE 有权
标题翻译：图像传感器模块
公开(公告)号：US20100259657A1
公开(公告)日：2010-10-14
申请号：US12491412
申请日：2009-06-25
申请人： Seung Hyun LEE , Chan Ki HWANG , Seung Ho LEE , Hee Jin PARK
发明人： Seung Hyun LEE , Chan Ki HWANG , Seung Ho LEE , Hee Jin PARK
IPC分类号： H04N5/335
CPC分类号： H01L27/14625 , H01L24/13 , H01L24/16 , H01L27/14618 , H01L27/14621 , H01L27/14636 , H01L2224/0554 , H01L2224/0557 , H01L2224/05571 , H01L2224/05573 , H01L2224/13562 , H01L2224/1369 , H01L2224/1379 , H01L2224/138 , H01L2224/16225 , H01L2224/16227 , H01L2924/00014 , H01L2924/07802 , H01L2924/00 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： An image sensor module is presented which includes a semiconductor chip, a holder and a coupling member. The semiconductor chip has a semiconductor chip body; an image sensing section over the semiconductor chip body; and bonding pads on the semiconductor chip body. The holder is mounted over the semiconductor chip and has an insulation section over the semiconductor chip body; connection patterns on the insulation section which are electrically coupled to the bonding pads; and a transparent cover over the image sensing section which is connected to the insulation section. The coupling member is interposed between the holder and the semiconductor chip for coupling together the holder to the semiconductor chip.
摘要翻译：提出了一种图像传感器模块，其包括半导体芯片，保持器和联接构件。半导体芯片具有半导体芯片体; 半导体芯片本体上的图像感测部分; 以及半导体芯片主体上的接合焊盘。保持器安装在半导体芯片上，并且在半导体芯片主体上方具有绝缘部分; 绝缘部分上的连接图案，其电耦合到接合焊盘; 以及连接到绝缘部分的图像感测部分上方的透明盖。联接构件插入在保持器和半导体芯片之间，用于将保持器联接在半导体芯片上。

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