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    • 4. 发明授权
    • DC motor driving apparatus
    • 直流电动机驱动装置
    • US06384555B1
    • 2002-05-07
    • US09559526
    • 2000-04-28
    • Kunio Tanaka
    • Kunio Tanaka
    • H02P100
    • H02P7/04
    • One terminal 3a of the DC motor 3 is connected to the power supply terminal 301, and the other terminal 3b of the DC motor 3 is connected to the ground terminal 302 through the FET 1. The FET 2 is connected between the terminal 3a and terminal 3b of the DC motor 3. A reversal input terminal of the comparator 6 is connected to the terminal 3a of the DC motor 3, and a non-reversal input terminal of the comparator 6 is connected to the terminal 3b of the DC motor 3. The output terminal of the comparator 6 is connected to the gate of the FET 2 through the switch SW1. The CPU 200 supplies a control signal FV which is changed at a predetermined period T according to the speed signal supplied from the receiver 100, to the gate of the FET 2 through the driver 7. When the counter electromotive force is generated in the DC motor 3, the comparator 6 supplies a high level control signal RD to the gate of the FET 2 through the switch SW1.
    • 直流电动机3的一个端子3a连接到电源端子301,直流电动机3的另一个端子3b通过FET1连接到接地端子302.FET2连接在端子3a和端子 比较器6的反相输入端子连接到直流电动机3的端子3a,比较器6的非反相输入端子连接到直流电动机3的端子3b。 比较器6的输出端通过开关SW1连接到FET2的栅极。 CPU 200根据从接收器100提供的速度信号,在预定周期T改变控制信号FV,通过驱动器7向FET2的门提供。当在直流电动机中产生反电动势时 如图3所示,比较器6通过开关SW1向FET2的栅极提供高电平控制信号RD。
    • 7. 发明授权
    • Laser ablation device and thin film forming method
    • 激光烧蚀装置及薄膜成型方法
    • US5415901A
    • 1995-05-16
    • US69520
    • 1993-06-01
    • Kunio TanakaYouichi OhnishiYoshikazu YoshidaYukio Nishikawa
    • Kunio TanakaYouichi OhnishiYoshikazu YoshidaYukio Nishikawa
    • C23C14/08C23C14/00C23C14/28C30B23/02H01F10/20H01F41/20
    • H01F41/205C23C14/0021C23C14/28C30B23/002H01F10/20
    • A laser ablation device for forming a thin film includes a vacuum chamber having a gas introduction port through which an oxidating gas is introduced into the chamber, and a light-transmittable section, a target holder disposed in the vacuum chamber for holding a target made of a film forming material of an oxide, an object holder confronting the target holder for holding an object on which the thin film is to be formed, a short wavelength laser which emits a first short wavelength laser light passing to the target in the vacuum chamber through the light-transmittable section from outside of the vacuum chamber, and a short wavelength laser light irradiating device for irradiating the object with a second short wavelength laser light passing into the vacuum chamber through the light-transmittable section from outside of the vacuum chamber. The second short wavelength laser light has an intensity lower than that of the first short wavelength laser light irradiating the target. Alternatively, a short wavelength laser light passing device causes the second short wavelength laser light to pass through the light-transmittable section from outside of the vacuum chamber and then to pass in the vicinity of a surface of the object in the vacuum chamber as approximately parallel to the surface of the object.
    • 用于形成薄膜的激光烧蚀装置包括具有气体导入口的真空室,通过该气体导入口将氧化气体引入到室中,以及透光部,设置在真空室中的用于保持由 形成氧化物的成膜材料,面对用于保持要形成薄膜的物体的目标保持器的物体保持器,发射通过真空室中的目标物的第一短波长激光的短波长激光器,通过 来自真空室的外部的透光部分和用于通过透光部分从真空室外部向第一短波长激光照射物体的短波长激光照射装置。 第二短波长激光的强度比照射目标的第一短波长激光的强度低。 或者,短波长激光通过装置使第二短波长激光从真空室的外部通过透光部,然后在真空室内的物体的表面附近大致平行 到物体的表面。
    • 8. 发明授权
    • Laser ablation apparatus
    • 激光消融装置
    • US5227608A
    • 1993-07-13
    • US922768
    • 1992-07-31
    • Yoshikazu YoshidaYukio NishikawaKunio Tanaka
    • Yoshikazu YoshidaYukio NishikawaKunio Tanaka
    • B23K26/12B23K26/16B23K26/36
    • B23K26/123B23K26/1224B23K26/16B23K26/362
    • A laser ablation apparatus includes a laser beam source for ablation for emitting a first laser beam, a lens for focusing the first laser beam, a vacuum chamber having a window on its wall through which the first laser beam is injected into the vacuum chamber, a target holder arranged in the vacuum chamber to hold a target onto which the first laser beam is irradiated, a substrate holder arranged opposing to the target holder in the vacuum chamber to hold a substrate, and a laser beam source for particle decomposition for emitting a second laser beam in the vacuum chamber to decompose particles turned out from the target by the first laser beam in the vacuum chamber. The apparatus can further include a pair of mirrors, arranged on both sides of the target holder, for multiply reflecting the second laser beam over the target holder.
    • 激光烧蚀装置包括用于发射第一激光束的用于烧蚀的激光束源,用于聚焦第一激光束的透镜,在其壁上具有窗口的真空室,第一激光束通过该窗口注入到真空室中, 设置在所述真空室中的目标夹持器,用于保持照射所述第一激光束的目标;在所述真空室中与所述目标保持器相对配置以保持基板的基板保持器,以及用于发射第二激光束的用于粒子分解的激光束源 激光束在真空室中,以通过真空室中的第一激光束分解从目标物转出的颗粒。 该装置还可以包括一对反射镜,其布置在目标支架的两侧,用于将第二激光束反射超过目标支架。
    • 10. 发明授权
    • Area cutting method
    • 区域切割方法
    • US4823275A
    • 1989-04-18
    • US044944
    • 1987-03-16
    • Kunio TanakaYasushi Onishi
    • Kunio TanakaYasushi Onishi
    • G05B19/402B23Q15/00G05B19/4093G05B19/41G06F15/46
    • G05B19/41G05B2219/49381
    • The present invention relates to an area cutting method for cutting the interior of an area (AR) by moving a tool along a plurality of offset paths successively offset in an inward direction from a closed curve (AR) specifying the area. The area cutting method includes determining whether the area (AR) bounded by the closed curve (OLC) is to be divided, obtaining, if division is necessary, division suitability a division value for all sets of apices, in which any two apices form a set, by using an evaluation function indicative of a preset division suitability or value, dividing the area by a straight line connecting the two apices (P5, P7) of the set having the maximum suitability, executing similar processing for each divided area (PG1, PG2), deciding tool paths on the basis of the final divided areas, and performing area cutting by moving a tool along the tool paths.
    • PCT No.PCT / JP86 / 00369 Sec。 371日期1987年3月16日 102(e)1987年3月16日PCT PCT 1986年7月17日PCT公布。 公开号WO87 / 00650 PCT 日本1987年1月29日。本发明涉及一种通过沿着从闭合曲线(AR)向内依次偏移的多个偏移路径移动工具来切割区域(AR)的内部的区域切割方法。 该地区。 区域切割方法包括确定由闭合曲线(OLC)限定的区域(AR)是否被划分,如果需要划分,则获得分割适用性,所有顶点集合的分割值,其中任何两个顶点形成 通过使用表示预设的分割适用性或值的评价函数,通过连接具有最大适合性的集合的两个顶点(P5,P7)的直线来划分该区域,对每个划分区域(PG1, PG2),基于最终分割区域来确定工具路径,以及通过沿着刀具路径移动刀具来执行区域切割。