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    • 5. 发明申请
    • COINCIDENCE DETERMINATION METHOD AND APPARATUS OF PET DEVICE
    • PET装置的确定方法和装置
    • US20130009064A1
    • 2013-01-10
    • US13635753
    • 2010-03-25
    • Eiji YoshidaTaiga Yamaya
    • Eiji YoshidaTaiga Yamaya
    • G01T1/164
    • G01T1/2985
    • In a coincidence determination processing of a PET device for regarding and counting a pair of annihilation radiations detected within a predetermined time as occurring from the same nuclide, a priority of a line of response to acquire is set and a true coincidence is extracted from multiple coincidences by using information on a detection time difference if a plurality of coincidences are detected with the predetermined time. Consequently, a true coincidence is extracted from multiple coincidences which have heretofore been discarded. This improves detection sensitivity at high radioactive concentration and contributes to an improved dynamic range.
    • 在从同一个核素发生的在预定时间内检测到的一对湮灭辐射的关联和计数的PET装置的重合确定处理中,设置对获取的响应行的优先级,并且从多个重合中提取真正的重合 如果在预定时间内检测到多个重合,则通过使用关于检测时间差的信息。 因此,从以前被丢弃的多个巧合中提取出真正的符合性。 这提高了在高放射性浓度下的检测灵敏度,并有助于改善动态范围。
    • 6. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
    • 半导体器件及制造半导体器件的方法
    • US20120193717A1
    • 2012-08-02
    • US13310298
    • 2011-12-02
    • Akira KATAKAMIEiji Yoshida
    • Akira KATAKAMIEiji Yoshida
    • H01L29/786H01L21/762H01L21/336
    • H01L21/3081H01L21/743H01L21/76229H01L29/665H01L29/7833
    • A semiconductor device includes a first device isolation insulating film formed in a semiconductor substrate, a first well having a first conductivity type, defined by the first device isolation insulating film, and shallower than the first device isolation insulating film, a second device isolation insulating film formed in the first well, shallower than the first well, and defining a first part of the first well and a second part of the first well, a gate insulating film formed above the first part, a gate electrode formed above the gate insulating film, and an interconnection electrically connected to the second part of the first well and the gate electrode, wherein an electric resistance of the first well in a first region below the second device isolation insulating film is lower than an electric resistance of the first well in a second region other than the first region on the same depth level.
    • 半导体器件包括形成在半导体衬底中的第一器件隔离绝缘膜,由第一器件隔离绝缘膜限定并且比第一器件隔离绝缘膜浅的具有第一导电类型的第一阱,第二器件隔离绝缘膜 形成在第一阱中,比第一阱浅,并且限定第一阱的第一部分和第一阱的第二部分,形成在第一部分上方的栅极绝缘膜,形成在栅极绝缘膜上方的栅电极, 以及电连接到第一阱和栅电极的第二部分的互连,其中在第二器件隔离绝缘膜下方的第一区域中的第一阱的电阻低于第二阱中的第一阱的电阻 区域以外的第一区域在相同的深度级别。
    • 7. 发明申请
    • OPTICAL SIGNAL TRANSMITTER, AND BIAS VOLTAGE CONTROL METHOD
    • US20120155865A1
    • 2012-06-21
    • US13393101
    • 2010-09-07
    • Hiroto KawakamiEiji YoshidaMasahiro Tachibana
    • Hiroto KawakamiEiji YoshidaMasahiro Tachibana
    • H04J14/00
    • G02F1/0123H04B10/5053H04B10/5057H04B10/50572H04B10/50575H04B10/5561
    • An optical signal transmitter of the present invention includes: two phase modulating portions; a phase shifter which displaces carrier phases of two output lights from the phase modulating portions by π/2; a multiplexing portion which multiplexes two signal lights, carrier phases of the two signal lights being made orthogonal to each other by the phase shifter; a drive signal electrode portion which supplies a differential data signal to each of four paths of interference optical waveguides, each of the two phase modulating portions having the interference optical waveguides, the differential data signal having an amplitude which is equal to a half-wave voltage Vπ of the two phase modulating portions; a drive amplifier which amplifies the differential data signal to be supplied to each of the four paths of the interference optical waveguides; a data bias electrode portion which supplies a total of four data bias voltages to two arms, each of the two phase modulating portions having the two arms; an orthogonal bias electrode portion which supplies an orthogonal bias voltage to the phase shifter; a data bias power supply portion that adjusts delay times in the two phase modulating portions by applying the data bias voltages to the data bias electrode portion; an orthogonal bias power supply portion that adjusts a delay amount relative to a light output from at least one of the two phase modulating portions by applying the orthogonal bias voltage to the orthogonal bias electrode portion; a dither signal adding portion that adds a dither signal to at most three of the four data bias voltages; a dither detecting portion which detects a wave that is n-times a dither component from an output of the multiplexing portion (where n is an integer equal to or greater than one); and an orthogonal bias control portion which feeds back a detection result of the dither detecting portion to the orthogonal bias power supply portion. The orthogonal bias power supply portion adjusts the delay amount relative to the light output from at least one of the two phase modulating portions by controlling the orthogonal bias voltage to be applied to the orthogonal bias electrode portion based on feedback from the orthogonal bias control portion.
    • 8. 发明申请
    • SEMICONDUCTOR DEVICE PRODUCTION METHOD AND SEMICONDUCTOR DEVICE
    • 半导体器件生产方法和半导体器件
    • US20120119267A1
    • 2012-05-17
    • US13198773
    • 2011-08-05
    • Eiji Yoshida
    • Eiji Yoshida
    • H01L29/78H01L21/22
    • H01L29/1033H01L29/4238H01L29/665H01L29/6653H01L29/6659H01L29/783
    • A semiconductor device production method includes: forming a semiconductor region including a first region, a second region connecting with the first region and having a width smaller than that of the first region, and a third region connecting with the second region and having a width smaller than that of the second region; forming a gate electrode including a first part crossing the third region and a second part extending from the first part across the first region; forming a side wall insulation film on the gate electrode to cover part of the second region while exposing the remaining part of the second region; implanting a second conductivity type impurity into the first region and the remaining part of the second region; performing heat treatment; removing part of the side wall insulation film, and forming a silicide layer on the first region and the remaining part of the second region.
    • 半导体器件制造方法包括:形成包括第一区域的半导体区域,与第一区域连接并且具有比第一区域的宽度小的第二区域,以及与第二区域连接并且具有较小的宽度的第三区域 比第二个地区; 形成包括与所述第三区域交叉的第一部分的栅电极和从所述第一部分延伸穿过所述第一区域的第二部分; 在所述栅电极上形成侧壁绝缘膜以覆盖所述第二区域的一部分,同时暴露所述第二区域的剩余部分; 将第二导电型杂质注入第一区域和第二区域的剩余部分; 进行热处理; 去除所述侧壁绝缘膜的一部分,并且在所述第一区域和所述第二区域的剩余部分上形成硅化物层。